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TI DESIGNS Part # TIDM-WIRELESSSENSORNODE Literature # TIDR103 Bill of Materials DESIGNATOR C1 C2 C41 C51 C81 C91 C101 C111 C121 C122 C123 C124 C125 C126 C131 C132 C141 C151 C181 R1 R2 R5 R6 R171 L121 L2 L123 L131 IC1 IC2 D1 D2 Q2 ANT1 ST1 TS1 20 x 30 mm, 1mm thick chem. gold FR4 VALUE 100n 100n 100n 100n 27p 220p 27p 100n 100p 1p 0.47p 0.47p 100p 100p 100p 1p 100n 220p 220p 0 560R 47k 330R 56K 4n7 1µ 4n7 4n7 Red Green TOLERANCE 10% 10% 10% 10% 5% 10% 5% 10% 5% 5% 5% 5% 5% 5% 5% 5% 5% 10% 10% 1% 1% 1% 1% 1% Package 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0603 0603 0603 0603 40-pin QFN (RHA) QLP20 0603 0603 5 x 3,5 9x2 1.27 pitch B3U-1000P MANUFACTURER PART NUMBER Remarks Resistor for D2 (Green LED) Resistor for D1 (Red LED) TI TI Compotek Würth Mill-Max Omron MSP430F2274IRHA CC2500 CTA531-26.000-16-10/10/A 7488910245 Mouser PN: 575-501201 B3U-1000P LED LED HF-Quartz Chip antenna 6-pin header Button NOTE: Correct PCB is critical for proper RF performance. IMPORTANT NOTICE FOR TI REFERENCE DESIGNS Texas Instruments Incorporated ("TI") reference designs are solely intended to assist designers (“Buyers”) who are developing systems that incorporate TI semiconductor products (also referred to herein as “components”). Buyer understands and agrees that Buyer remains responsible for using its independent analysis, evaluation and judgment in designing Buyer’s systems and products. TI reference designs have been created using standard laboratory conditions and engineering practices. TI has not conducted any testing other than that specifically described in the published documentation for a particular reference design. TI may make corrections, enhancements, improvements and other changes to its reference designs. Buyers are authorized to use TI reference designs with the TI component(s) identified in each particular reference design and to modify the reference design in the development of their end products. HOWEVER, NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY THIRD PARTY TECHNOLOGY OR INTELLECTUAL PROPERTY RIGHT, IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services, or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. TI REFERENCE DESIGNS ARE PROVIDED "AS IS". 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TI reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques for TI components are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. Reproduction of significant portions of TI information in TI data books, data sheets or reference designs is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards that anticipate dangerous failures, monitor failures and their consequences, lessen the likelihood of dangerous failures and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in Buyer’s safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed an agreement specifically governing such use. Only those TI components that TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components that have not been so designated is solely at Buyer's risk, and Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2013, Texas Instruments Incorporated







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