pdf

ADS1248芯片中文资料

  • 1星
  • 日期: 2018-06-06
  • 大小: 1.7MB
  • 所需积分:1分
  • 下载次数:12
  • favicon收藏
  • rep举报
  • 分享
  • free评论
标签: ADS1248

ADS1248芯片的资料,适用在RTD等方面

文档内容节选

wwwticom ADS1246 ADS1247 ADS1248 SBAS426G AUGUST 2008REVISED OCTOBER 2011 24Bit AnalogtoDigital Converters for Temperature Sensors Check for Samples ADS1246 ADS1247 ADS1248 1FEATURES 23 24 Bits No Missing Codes Data Output Rates Up to 2kSPS SingleCycle Settling for All Data Rates Simultaneous 5060Hz Rejection at 20SPS LowNoise PGA 48nV at PGA 128 Matched Current Source DACs Very Low Drift Internal Voltage Reference 4 Differential7 SingleEnded Inputs ADS1248 2 Differential3 SingleEnded I......

www.ti.com ADS1246 ADS1247 ADS1248 SBAS426G –AUGUST 2008–REVISED OCTOBER 2011 24-Bit Analog-to-Digital Converters for Temperature Sensors Check for Samples: ADS1246, ADS1247, ADS1248 1FEATURES 23• 24 Bits, No Missing Codes • Data Output Rates Up to 2kSPS • Single-Cycle Settling for All Data Rates • Simultaneous 50/60Hz Rejection at 20SPS • • • Low-Noise PGA: 48nV at PGA = 128 • Matched Current Source DACs • Very Low Drift Internal Voltage Reference: 4 Differential/7 Single-Ended Inputs (ADS1248) 2 Differential/3 Single-Ended Inputs (ADS1247) 10ppm/°C (max) • Sensor Burnout Detection • • • Power Supply and VREF Monitoring 4/8 General-Purpose I/Os (ADS1247/8) Internal Temperature Sensor (ADS1247/8) • Self and System Calibration • SPI™-Compatible Serial Interface • Analog Supply Unipolar (+2.7V to +5.25V)/Bipolar (±2.5V) Operation • Digital Supply: +2.7V to +5.25V • Operating Temperature –40°C to +125°C APPLICATIONS • Temperature Measurement – RTDs, Thermocouples, and Thermistors • Pressure Measurement • Industrial Process Control and ADS1248 DESCRIPTION The ADS1246, ADS1247, are highly-integrated, precision, 24-bit analog-to-digital converters (ADCs). The ADS1246/7/8 feature an onboard, low-noise, programmable gain amplifier (PGA), a precision delta-sigma (ΔΣ) ADC with a single-cycle settling digital filter, and an internal oscillator. The ADS1247 and ADS1248 also provide a built-in, very low drift voltage reference with 10mA output capacity, and two matched programmable current digital-to-analog converters (DACs). The ADS1246/7/8 provide a complete front-end solution for temperature sensor applications including thermal couples, thermistors, and RTDs. An input multiplexer supports four differential inputs for the ADS1248, two for the ADS1247, and one for In addition, the multiplexer has a the ADS1246. detect, sensor for and system thermocouples, I/Os general-purpose digital and ADS1248). The onboard, low-noise PGA provides selectable gains of 1 to 128. The ΔΣ modulator and adjustable digital filter settle in only one cycle, for fast channel cycling when using the input multiplexer, and support data rates up to 2kSPS. For data rates of 20SPS or less, both 50Hz and 60Hz interference are rejected by the filter. The ADS1246 is offered in a small TSSOP-16 package, the ADS1247 is available in a TSSOP-20 package, and the ADS1248 in a TSSOP-28 package. All the extended specified temperature range of –40°C to +105°C. three devices are rated over burnout voltage monitoring, bias (ADS1247 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 2SPI is a trademark of Motorola, Inc. 3All other trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2008–2011, Texas Instruments Incorporated ADS1246 ADS1247 ADS1248 SBAS426G –AUGUST 2008–REVISED OCTOBER 2011 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. integrated circuits be handled with ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION(1) PRODUCT NUMBER OF INPUTS VOLTAGE REFERENCE DUAL SENSOR EXCITATION CURRENT SOURCES ADS1246 ADS1247 ADS1248 1 Differential 1 Single-Ended 2 Differential or or or 3 Single-Ended 4 Differential 7 Single-Ended External Internal or External Internal or External NO YES YES PACKAGE- LEAD TSSOP-16 TSSOP-20 TSSOP-28 (1) For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet, or see the TI website at www.ti.com ABSOLUTE MAXIMUM RATINGS(1) Over operating free-air temperature range (unless otherwise noted). PARAMETER AVDD to AVSS AVSS to DGND DVDD to DGND Input current Analog input voltage to AVSS Digital input voltage to DGND Maximum junction temperature Operating temperature range Storage temperature range ADS1246, ADS1247, ADS1248 MIN –0.3 –2.8 –0.3 MAX +5.5 +0.3 +5.5 100, momentary 10, continuous AVSS – 0.3 –0.3 –40 –60 AVDD + 0.3 DVDD + 0.3 +150 +125 +150 UNIT V V V mA mA V V °C °C °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2 Copyright © 2008–2011, Texas Instruments Incorporated www.ti.com ADS1246 ADS1247 ADS1248 SBAS426G –AUGUST 2008–REVISED OCTOBER 2011 ELECTRICAL CHARACTERISTICS Minimum/maximum specifications apply from –40°C to +105°C. Typical specifications are at +25°C. All specifications at AVDD = +5V, DVDD = +3.3V, AVSS = 0V, VREF = +2.048V, and oscillator frequency = 4.096MHz, unless otherwise noted. CONDITIONS MIN TYP MAX UNIT ADS1246, ADS1247, ADS1248 ±VREF/PGA (1) 100 See Table 7 1, 2, 4, 8, 16, 32, 64, 128 0.5, 2, or 10 (AVDD + AVSS)/2 400 No missing codes 24 PARAMETER ANALOG INPUTS Full-scale input voltage (VIN = ADCINP – ADCINN) Common-mode input range Differential input current Absolute input current PGA gain settings Burnout current source Bias voltage Bias voltage output impedance SYSTEM PERFORMANCE Resolution Data rate Integral nonlinearity (INL) Offset error Offset drift Gain error Gain drift ADC conversion time Noise Normal-mode rejection Common-mode rejection Power-supply rejection VOLTAGE REFERENCE INPUT Voltage reference input (VREF = VREFP – VREFN) Negative reference input (REFN) Positive reference input (REFP) Reference input current ON-CHIP VOLTAGE REFERENCE Output voltage Output current (3) Load regulation Drift (4) Startup time Differential input, end point fit, PGA = 1 VCM = 2.5V After calibration (2) T = +25°C, all PGAs, data rate = 40, 80, or 160SPS At dc, PGA = 1 At dc, PGA = 32 AVDD/DVDD at dc, PGA = 32, data rate = 80SPS TA = +25°C to +105°C TA = –40°C to +105°C V V pA μA V Ω Bits SPS ppm μV nV/°C 15 15 5, 10, 20, 40, 80, 160, 320, 640, 1000, 2000 6 –15 See Figure 11 to Figure 14 –0.02 ±0.005 0.02 % See Figure 19 to Figure 22 ppm/°C Single-cycle settling See Table 1 to Table 4 See Table 9 80 90 100 0.5 AVSS – 0.1 REFN + 0.5 2.038 90 125 135 30 2.048 50 2 6 See Table 10 dB dB dB V V V nA (AVDD – AVSS) – 1 REFP – 0.5 AVDD + 0.1 2.058 ±10 10 15 V mA μV/mA ppm/°C ppm/°C μs (1) For VREF > 2.7V, the analog input differential voltage should not exceed 2.7V/PGA. (2) Offset calibration on the order of noise. (3) Do not exceed this loading on the internal voltage reference. (4) Specified by the combination of design and final production test. Copyright © 2008–2011, Texas Instruments Incorporated 3 ADS1246 ADS1247 ADS1248 SBAS426G –AUGUST 2008–REVISED OCTOBER 2011 www.ti.com ELECTRICAL CHARACTERISTICS (continued) Minimum/maximum specifications apply from –40°C to +105°C. Typical specifications are at +25°C. All specifications at AVDD = +5V, DVDD = +3.3V, AVSS = 0V, VREF = +2.048V, and oscillator frequency = 4.096MHz, unless otherwise noted. ADS1246, ADS1247, ADS1248 PARAMETER CONDITIONS MIN TYP MAX UNIT CURRENT SOURCES (IDACS) Output current Voltage compliance All currents Initial error Initial mismatch Temperature drift Temperature drift matching SYSTEM MONITORS All currents, each IDAC All currents, between IDACs Each IDAC Between IDACs Voltage Temperature sensor reading Drift GENERAL-PURPOSE INPUT/OUTPUT (GPIO) TA = +25°C VIH VIL VOH VOL Logic levels IOH = 1mA IOL = 1mA DIGITAL INPUT/OUTPUT (other than GPIO) Logic levels VIH VIL VOH VOL Input leakage Clock input (CLK) Frequency Duty cycle Internal oscillator frequency POWER SUPPLY DVDD AVSS AVDD DVDD current AVDD current Power dissipation TEMPERATURE RANGE Specified Operating Storage IOH = 1mA IOL = 1mA DGND < VIN < DVDD Normal mode, DVDD = 5V, data rate = 20SPS, internal oscillator Normal mode, DVDD = 3.3V, data rate = 20SPS, internal oscillator Sleep mode Converting, AVDD = 5V, data rate = 20SPS, external reference Converting, AVDD = 3.3V, data rate = 20SPS, external reference Sleep mode Additional current with internal reference enabled AVDD = DVDD = 5V, data rate = 20SPS, internal oscillator, external reference AVDD = DVDD = 3.3V, data rate = 20SPS, internal oscillator, external reference –40 –40 –60 +105 +125 +150 4 Copyright © 2008–2011, Texas Instruments Incorporated AVDD 0.3AVDD 0.2 AVDD DVDD 0.3DVDD 0.2 DVDD ±10 4.5 75 4.3 5.25 0 AVSS + 5.25 50, 100, 250, 500, 750, 1000, 1500 –6 0.7AVDD AVSS 0.8AVDD 0.7DVDD DGND 0.8DVDD DGND 1 25 3.89 2.7 –2.5 AVSS + 2.7 AVDD – 0.7 ±1 ±0.15 100 10 118 405 4.096 230 210 0.2 225 200 0.1 180 2.3 1.4 μA V 6 % of FS % of FS ppm/°C ppm/°C mV μV/°C V V V V V V V V μA MHz % MHz V V V μA μA µA µA µA µA μA mW mW °C °C °C www.ti.com THERMAL INFORMATION THERMAL METRIC(1) θJA θJC(top) θJB ψJT ψJB θJC(bottom) Junction-to-ambient thermal resistance (2) Junction-to-case(top) thermal resistance (3) Junction-to-board thermal resistance (4) Junction-to-top characterization parameter (5) Junction-to-board characterization parameter (6) Junction-to-case(bottom) thermal resistance (7) ADS1246 ADS1247 ADS1248 SBAS426G –AUGUST 2008–REVISED OCTOBER 2011 ADS1246, ADS1247, ADS1248 TSSOP (IPW) 28 54.6 11.3 13.0 0.5 12.7 n/a UNITS °C/W (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. (2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as specified in JESD51-7, in an environment described in JESD51-2a. (3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. (4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB temperature, as described in JESD51-8. (5) The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7). (6) The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7). (7) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. Copyright © 2008–2011, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Link(s): ADS1246 ADS1247 ADS1248
更多简介内容

推荐帖子

无线通讯基本概念
本帖最后由 btty038 于 2020-5-14 11:44 编辑 无线通讯基本概念 利用电磁波的辐射和传播,经过空间传送信息的通讯方式称之为无线电通讯(Wireless Communication),也称之为无线通信。利用无线通讯可以传送电报,电话,传真,数据,图像以及广播和电视节目等通讯业务。            
btty038 RF/无线
电阻并联电路故障如何自测?
电阻并联电路是最基本的并联电路,所有负责的电路都可以转化成电阻串联电路和电阻并联电路来进行工作原理的理解。并联电路和串联电路特性完全不一样,是完全不同的电路,它们之间不能相互等效(电阻并联电路图)。 图为电阻并联电路,从图中可以看出电阻的R1和R2两根引脚分别相连,构成两个电阻的并联电路,+V是这一电路的直流工作电压。R1,R2并联在电路工作于交流电路中时,电路形式不变,只是直流电压+V
Aguilera 【模拟与混合信号】
TI OMAP-L138(定点/浮点DSP C674x+ARM9)拓展IO信号、底板B2B连接器
  CPU OMAP-L138、TMS320C6748、AM1808三款CPU管脚兼容,外设资源基本相同。 TMS320C6748 TI TMS320C6748是一款低功耗浮点DSP处理器。支持DSP的高数字信号处理性能和精简指令计算机(RISC)技术,采用一个高性能的456MHz TMS320C674x 32位处理器。以下是TMS320C6748 CPU的资源框图:
火辣西米秀 【微控制器 MCU】
基于RFID技术应用的汽车衡称重系统
RFID技术概述 RFID技术,英文为Radio Frequency Identification,中文为无线射频识别,是可通过无线电信号识别特定目标并读写相关数据,而无需识别系统与特定目125k~134.2K)、高频(13.56Mhz)、超高频、微波(2.4-2.5Ghz)等射频技术。 RFID技术的基本工作原理:标签进入磁场后,接收阅读器发出的射频信号,凭借感应电流所获得的
fish001 RF/无线
MSP430F149为核心的温度检测仪的设计
      兰州大型的综合工程重离子加速器——冷却存储环(HIFRL-CSR)是国家科学重点工程之一,在其内部控制系统里存在着大量的测量温度的场合,这些场合依靠约束离子的行为发挥CSR主环中的磁场作用,在磁场中,这些带电粒子束有时处于聚焦状态,有时则处于传输状态,且磁场性能的好坏对束流品质有直接影响。 由于磁铁的温度与磁场性能及安全密切相关。磁铁的线圈中通过电流时,会产生很高的温度,因此,对其温
Jacktang 【微控制器 MCU】
单片机基础:详解按键单击、双击、长按
前言:很多人学单片机的时候马马虎虎,许多例程都是知其然不知其所以然。这样其实是害了自己,拿来就用自然很方便,但如果不懂其中的原理,只要功能要求稍微变一点,估计你就蒙圈了。毕竟技巧是基于扎实的基础之上的! 下面这篇文章,作者是马潮老师,AVR单片机的教育者,出版过很多本书。通过一个IO口,详细讲解了按键单击、双击、长按的各种情况,适合初学者慢慢啃。 用户基本操作定义:     1。短按
fish001 【微控制器 MCU】

评论

登录/注册

意见反馈

求资源

回顶部

datasheet推荐 换一换

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版 版权声明

北京市海淀区知春路23号集成电路设计园量子银座1305 电话:(010)82350740 邮编:100191

电子工程世界版权所有 京ICP证060456号 京ICP备10001474号 电信业务审批[2006]字第258号函 京公海网安备110108001534 Copyright © 2005-2020 EEWORLD.com.cn, Inc. All rights reserved
$(function(){ var appid = $(".select li a").data("channel"); $(".select li a").click(function(){ var appid = $(this).data("channel"); $('.select dt').html($(this).html()); $('#channel').val(appid); }) })