pdf

EMCP H9TP64A8JDMCPR-KGM规格书

  • 1星
  • 日期: 2016-12-20
  • 大小: 3.39MB
  • 所需积分:1分
  • 下载次数:42
  • favicon收藏
  • rep举报
  • 分享
  • free评论
标签: EMCP

EMCP H9TP64A8JDMCPR-KGM规格书

文档内容节选

CIMCP Specification 8GB eNAND x8 8Gb LPDDR2S4B x32 2CS This document is a general product description and is subject to change without notice SK hynix does not assume any responsibility for use of circuits described No patent licenses are implied Rev 11 Nov 2014 1 H9TP64A8JDMCPR 8GB eNAND x8 LPDDR2S4B 8Gbx32 2CS Document Title CIMCP 8GB eNANDx8 Flash 8Gb x32 2CS LPDDR2S4B Revision History Revision No History 01 02 03 10 11 Initial Draft Corrected Ball assignment Editorial Change Final V......

CI-MCP Specification 8GB eNAND (x8) + 8Gb LPDDR2-S4B (x32, 2CS) This document is a general product description and is subject to change without notice. SK hynix does not assume any responsibility for use of circuits described. No patent licenses are implied. Rev 1.1 / Nov. 2014 1 H9TP64A8JDMCPR 8GB eNAND (x8) / LPDDR2-S4B 8Gb(x32, 2CS) Document Title CI-MCP 8GB eNAND(x8) Flash / 8Gb (x32, 2CS) LPDDR2-S4B Revision History Revision No. History 0.1 0.2 0.3 1.0 1.1 - Initial Draft - Corrected Ball assignment - Editorial Change Final Version - Updated eNAND and IDD specification - Changed Refresh Command - Updated PRV value Draft Date Remark May. 2014 Preliminary Jun. 2014 Preliminary Jul. 2014 Preliminary Sep. 2014 Nov. 2014 Rev 1.1 / Nov. 2014 2 H9TP64A8JDMCPR 8GB eNAND (x8) / LPDDR2-S4B 8Gb(x32, 2CS) FEATURES [ CI-MCP ] ● Operation Temperature - (-25)oC ~ 85oC ● Package - 162-ball FBGA - 11.5x13.0mm2, 1.0t, 0.5mm pitch - Lead & Halogen Free [ e-NAND ] • eMMC5.0 compatible (Backward compatible to eMMC4.5) • Bus mode - Data bus width : 1 bit(default), 4 bits, 8 bits - Data transfer rate: up to 400MB/s (HS400) - MMC I/F Clock frequency : 0~200MHz - MMC I/F Boot frequency : 0~52MHz • Operating voltage range - Vcc (NAND) : 2.7 - 3.6V - Vccq (Controller) : 1.7 - 1.95V / 2.7 - 3.6V • Temperature - Operation (-25℃ ~ +85℃) - Storage without operation (-40℃ ~ +85℃) • Others - This product is compliance with the RoHS directive    • Supported features - HS400, HS200 - HPI, BKOPS - Packed CMD, Cache - Partitioning, RPMB - Discard, Trim, Erase, Sanitize - Write protect, Lock / Unlock - PON, Sleep / Awake - Reliable write - Boot feature, Boot partition - HW / SW Reset - Field firmware update - Configurable driver strength - Health(Smart) report - Production state awareness - Secure removal type Rev 1.1 / Nov. 2014 [ LPDDR2 S4B ] ● VDD1 = 1.8V (1.7V to 1.95V) ● VDD2, VDDCA and VDDQ = 1.2V (1.14V to 1.30) ● HSUL_12 interface (High Speed Unterminated Logic 1.2V) ● Double data rate architecture for command, address and data Bus; - all control and address except CS_n, CKE latched at both rising and falling edge of the clock - CS_n, CKE latched at rising edge of the clock - two data accesses per clock cycle ● Differential clock inputs (CK_t, CK_c) ● Bi-directional differential data strobe (DQS_t, DQS_c) - Source synchronous data transaction aligned to bi-direc- tional differential data strobe (DQS_t, DQS_c) - Data outputs aligned to the edge of the data strobe (DQS_t, DQS_c) when READ operation - Data inputs aligned to the center of the data strobe (DQS_t, DQS_c) when WRITE operation ● DM masks write data at the both rising and falling edge of the data strobe ● Programmable RL (Read Latency) and WL (Write Latency) ● Programmable burst length: 4, 8 and 16 ● Auto refresh and self refresh supported ● All bank auto refresh and per bank auto refresh supported ● Auto TCSR (Temperature Compensated Self Refresh) ● PASR (Partial Array Self Refresh) by Bank Mask and Seg- ment Mask ● DS (Drive Strength) ● DPD (Deep Power Down) ● ZQ (Calibration) 3 Functional Block Diagram e-NAND Block Diagram MultiMediaCard Interface MMC Controller DRAM Block Diagram CA0 ~ CA9 CS0, CKE0 H9TP64A8JDMCPR 8GB eNAND (x8) / LPDDR2-S4B 8Gb(x32, 2CS) NAND Flash Data In/Out Control e-NAND DM0~DM3, DQS0_t~DQS3_t, DQS0_c~DQS3_c, DQ0~DQ31 8Gb x32 device (256M x 32) CK_t, CK_c ZQ VDD1, VDD2, VDDCA, VDDQ, Vref(CA/DQ) VSS, VSSCA, VSSQ Note 1. Total current consumption is dependent to user operating conditions. AC and DC Characteristics shown in this specification are based on a single die. See the section of “DC Parameters and Operating Conditions” Rev 1.1 / Nov. 2014 4 H9TP64A8JDMCPR 8GB eNAND (x8) / LPDDR2-S4B 8Gb(x32, 2CS) ORDERING INFORMATION Part Number Memory Combination Operation Voltage Density Speed Package H9TP64A8JDMCPR-KGM e-NAND 3.3V 8GB (x8) 200MHz mobile DDR2 S4B 1.8V/1.2/1.2/1.2 8Gb (x32) DDR2 1066 162Ball FBGA (Lead & Halogen Free) H 9 T P 6 4 A 8 J D M C P R - K G M SK Hynix Memory MCP/PoP Product Mode : CI-MCP NAND DDR2 Density, Stack, Block Size & Page Buffer for NVM : 64Gb, SDP, LB, MLC Voltage & I/O for NVM : 3.3V, x8 Density, Stack, CH & CS for DRAM : 8Gb, DDP, 1Ch, 2CS Voltage, I/O & Option for DRAM : 1.2v, x32, LPDDR2-S4 Temperature : Standard (-25~85’C) DRAM Speed : LPDDR2 1066Mbps Ci-NAND Speed : 200Mhz Package Material : Lead & Halogen Free Package Type : FBGA 162 Ball 11.5x13 Generation : 1st Rev 1.1 / Nov. 2014 5
更多简介内容

推荐帖子

电路设计中如何选择二极管的类型和型号
二极管的种类繁多,同一种类的二极管又有不同型号不同系列,在电子电路中做检波用。就要选用检波二极管,并且要注意不同型号的管子的参数和特性差异。在电路中做整流用,就要选用整流二极管,并且要注意功率的大小,电路的工作频率和工作电压。在电路中做电子调谐用,可选用变容二极管和开关二极管。选用变容二极管要特别注意零偏压结电容和电容变化范围等参数,并且根据不同的频率覆盖范围,选用不同特性的变容二极管。在电子调谐
火辣西米秀 【模拟与混合信号】
STM32F407简单视觉小板(识别二维码,数据矩阵码,apriltags,圆方形状检测)
本帖最后由 RCSN 于 2020-5-10 21:39 编辑     楼主前阵子帮别人开发了个简单低成本的二维码识别方案,使用STM32F407VET6+OV2640方案,成本估计不超过30,后来楼主觉得不够过瘾,在其192Kram的情况下,多加了二维码,数据矩阵码,apriltags,圆方形状检测等简单的识别,不过由于ram受限,识别的最高分辨率也只是240*160,还有90多k ram
RCSN 【stm32/stm8】
!!!求救“有没有人知道怎么把SIM900A焊在洞洞板上”
听说因为SIM900A的引脚太密,所以根本行不通。有没有人知道能不能实现吖。 着急+10086 ------------------------------------------------------------------------------------------------------------------------------------------来自毕设倒计时1
biu12138biu PCB设计
为温度传感器选择正确的热敏电阻
本帖最后由 qwqwqw2088 于 2020-5-7 08:44 编辑      当面对数以千计的热敏电阻类型时,选型可能会造成相当大的困难。这里介绍一些,选择热敏电阻时需牢记的一些重要参数,尤其是当要在两种常用的用于温度传感的热敏电阻类型(负温度系数NTC热敏电阻或硅基线性热敏电阻)之间做出决定时。NTC热敏电阻由于价格低廉而广泛使用,但在极端温度下提供精度较低。硅基线性热敏电阻可在更宽
qwqwqw2088 【模拟与混合信号】
关于CC1312R 的LAUNCHPAD 版本区别问题
网购一块LAUNCHXL-CC1312R1 Rev:A的开发板,主芯片为:XCC1312R1F3 ,开发环境:CCS920+simplelink_cc13x2_26x2_sdk_3_30_00_03,当前问题是: 1:可以烧写程序,但开发板上程序不正常运行,比如PWMLED例程,板子无反应,暂停debug时报错说chipinfo.c找不到。 2:从网上看说时此开发板搭载芯片版本和SDK
火辣西米秀 【无线连接】
最全的电路测试流程
当一个电路板焊接完后,在检查电路板是否可以正常工作时,通常不直接给电路板供电,而是要按下面的步骤进行,确保每一步都没有问题后再上电也不迟。   连线是否正确   检查原理图很关键,第一个检查的重点是芯片的电源和网络节点的标注是否正确,同时也要注意网络节点是否有重叠的现象。另一个重点是原件的封装,封装的型号,封装的引脚顺
造物工场PCB PCB设计

评论

Jerry_He
正是要找的关于eMCP的资料,多谢分享!
2018-07-09 13:39:06回复
登录/注册

意见反馈

求资源

回顶部

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版 版权声明

北京市海淀区知春路23号集成电路设计园量子银座1305 电话:(010)82350740 邮编:100191

电子工程世界版权所有 京ICP证060456号 京ICP备10001474号 电信业务审批[2006]字第258号函 京公海网安备110108001534 Copyright © 2005-2020 EEWORLD.com.cn, Inc. All rights reserved
$(function(){ var appid = $(".select li a").data("channel"); $(".select li a").click(function(){ var appid = $(this).data("channel"); $('.select dt').html($(this).html()); $('#channel').val(appid); }) })