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IPC-A-600H-2010 印制板的可接受性(中文版 )

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标签: IPC-A-600H中文版

IPC-A-600H-2010 印制板的可接受性(中文版 )

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目录 Acknowledgment鸣谢 iii 1 Introduction前 1 11 Scope范围 1 12 Purpose的 1 13 Approach To This Document本件的使法 1 14 Classification产品分级 2 15 Acceptance Criteria验收准则 2 16 Applicable Documents引件 4 161 IPC 4 162 American Society of Mechanical Engineers美国机械工程师协会 4 17 Dimensions and Tolerances尺与公差 5 18 Terms and Definitions术语和定义 5 19 Revision Level Changes版本修订变化 5 110 Workmanship艺质量 5 2 Externally Observable Characteristics 外部可观察特性 6 21 Printed Board Edges印制板边缘 6 211 Burr......

目录 Acknowledgment(鸣谢) ................................................................. iii 1 Introduction(前⾔) .................................................................. 1 1.1 Scope(范围).............................................................................. 1 1.2 Purpose(⽬的) .......................................................................... 1 1.3 Approach To This Document(本⽂件的使⽤⽅法) ........... 1 1.4 Classification(产品分级) ........................................................ 2 1.5 Acceptance Criteria(验收准则) ............................................ 2 1.6 Applicable Documents(引⽤⽂件) ...................................... 4 1.6.1 IPC .................................................................................... 4 1.6.2 American Society of Mechanical Engineers(美国机械工程师协会) ............................... 4 1.7 Dimensions and Tolerances(尺⼨与公差) ......................... 5 1.8 Terms and Definitions(术语和定义) .................................... 5 1.9 Revision Level Changes(版本修订变化) ............................ 5 1.10 Workmanship(⼯艺质量) ....................................................... 5 2 Externally Observable Characteristics (外部可观察特性)...................................................................... 6 2.1 Printed Board Edges(印制板边缘) ...................................... 6 2.1.1 Burrs(毛刺) .................................................................. 6 2.1.1.1 Nonmetallic Burrs(非金属毛刺) ................................. 7 2.1.1.2 Metallic Burrs(金属毛刺) ........................................... 8 2.1.2 Nicks(缺口) ................................................................. 9 2.1.3 Haloing(晕圈) ............................................................ 10 2.2 Base Material Surface(基材表⾯) ...................................... 11 2.2.1 Weave Exposure(露织物) ......................................... 12 2.2.2 Weave Texture(显布纹) ............................................ 13 2.2.3 Exposed/Disrupted Fibers(暴露/断裂的纤维) ......... 14 2.2.4 Pits and Voids(麻点和空洞) ..................................... 15 2.3 Base Material Subsurface(基材表⾯下) ........................... 16 2.3.1 Measling(白斑) .......................................................... 21 2.3.2 Crazing(微裂纹) ........................................................ 22 2.3.3 Delamination/Blister(分层/起泡) ............................. 24 2.3.4 Foreign Inclusions(外来杂夹物) ............................... 26 2.4 Solder Coatings and Fused Tin Lead (焊料涂覆层和热熔锡铅层).................................................... 28 2.4.1 Nonwetting(不润湿) ................................................. 28 2.4.2 Dewetting(退润湿) ................................................... 29 2.5 Holes – Plated-Through – General(镀覆孔- 通则) ....... 31 2.5.1 Nodules/Burrs(结瘤/毛刺) ....................................... 31 2.5.2 Pink Ring(粉红圈) .................................................... 32 2.5.3 Voids – Copper Plating(铜镀层空洞) ....................... 33 2.5.4 Voids – Finished Coating(最终涂覆层空洞)............ 34 2.5.5 Lifted Lands – (Visual)(焊盘起翘–(目检)) ........... 35 2.5.6 Cap Plating of Filled Holes – (Visual) (填塞孔的盖覆电镀–(目检)).................................. 36 2.6 Holes – Unsupported(⾮⽀撑孔) ....................................... 38 2.6.1 Haloing(晕圈) ............................................................ 38 2.7 Printed Contacts(印制接触⽚) ............................................ 39 2.7.1 Surface Plating – Plated Contacts (表面镀层–电镀的接触片)..................................... 39 2.7.1.1 Surface Plating – Wire Bond Pads (表面镀层–金属线键合盘)..................................... 41 2.7.2 Burrs on Edge-Board Contacts (印制接触片–边缘毛刺)......................................... 43 2.7.3 Adhesion of Overplate(外镀层附着力) .................... 44 2.8 Marking(标记) ........................................................................ 45 2.8.1 Etched Marking(蚀刻标记) ....................................... 48 2.8.2 Screened or Ink Stamped Marking (丝印或油墨盖印标记)............................................. 50 2.9 Solder Mask(阻焊膜(阻焊剂)) ........................................... 52 2.9.1 Coverage Over Conductors (Skip Coverage)(导体上的覆盖(跳印)) ........................... 53 2.9.2 Registration to Holes (All Finishes) (与孔的重合度(所有涂覆层))................................ 54 2.9.3 Registration to Other Conductive Patterns (与其它导电图形的重合度)..................................... 55 2.9.3.1 Ball Grid Array (Solder Mask-Defined Lands) (球栅列阵(阻焊膜限定的焊盘))............................ 56 2.9.3.2 Ball Grid Array (Copper-Defined Lands) (球栅列阵(铜箔限定的焊盘))................................ 57 2.9.3.3 Ball Grid Array (Solder Dam) (球栅列阵(阻焊坝))................................................ 58 2.9.4 Blisters/Delamination(起泡/分层) ........................... 59 2.9.5 Adhesion (Flaking or Peeling) (附着力(剥落或起皮))............................................ 61 2.9.6 Waves/Wrinkles/Ripples(波纹/褶皱/皱纹) ............. 62 2.9.7 Tenting (Via Holes)(掩蔽(导通孔)) ....................... 63 2.9.8 Soda Strawing(吸管状空隙) ..................................... 64 2.10 Pattern Definition – Dimensional (图形精确度- 尺⼨要求) ........................................................ 66 2.10.1 Conductor Width and Spacing (导体宽度和间距)..................................................... 66 2.10.1.1 Conductor Width(导体宽度) ..................................... 67 2.10.1.2 Conductor Spacing(导体间距) .................................. 68 2.10.2 External Annular Ring – Measurement (外层环宽的测量)..................................................... 69 2.10.3 External Annular Ring – Supported Holes (支撑孔的外层环宽)................................................. 70 2.10.4 External Annular Ring – Unsupported Holes (非支撑孔的外层环宽)............................................. 72 2.11 Flatness(平整度) ................................................................... 73 3 Internally Observable Characteristics (内部可观察特性).................................................................... 75 3.1 Dielectric Materials(介质材料) ........................................... 76 3.1.1 Laminate Voids/Cracks (Outside Thermal Zone) (层压板空洞/裂缝(受热区外)).............................. 76 3.1.2 Registration/Conductor to Holes (导体与孔的重合度)................................................. 78 Table of Contents(⽬录) IPC-A-600H-2010 2010年4月 v 3.1.3 Clearance Hole, Unsupported, to Power/Ground Planes(电源层/接地层上的非支撑孔,隔离孔) .... 79 3.1.4 Delamination/Blister(分层/起泡) ............................. 80 3.1.5 Etchback(凹蚀) .......................................................... 81 3.1.5.1 Etchback(凹蚀) .......................................................... 82 3.1.5.2 Negative Etchback(负凹蚀) ...................................... 84 3.1.6 Smear Removal(去钻污) ........................................... 85 3.1.7 Dielectric Material, Clearance, Metal Plane for Supported Holes(金属层上支撑孔的介质间距) ...... 87 3.1.8 Layer-to-Layer Spacing(层间间距) .......................... 88 3.1.9 Resin Recession(树脂凹缩) ...................................... 89 3.1.10 Hole Wall Dielectric/Plated Barrel Separation (Hole Wall Pullaway)(孔壁介质与孔壁镀层 分离(孔壁拉脱))........................................................ 90 3.2 Conductive Patterns – General(导电图形- 总则) ......... 91 3.2.1 Etching Characteristics(蚀刻特性) ........................... 94 3.2.2 Print and Etch(丝印及蚀刻) ...................................... 96 3.2.3 Surface Conductor Thickness (Foil Plus Plating)(表面导体厚度(铜箔加上镀层)) ............... 97 3.2.4 Foil Thickness – Internal Layers(内层铜箔厚度) ..... 98 3.3 Plated-Through Holes – General(镀覆孔- 总则) ........... 99 3.3.1 Annular Ring – Internal Layers(内层环宽) ............ 101 3.3.2 Lifted Lands – (Cross-Sections) (焊盘起翘(显微切片)).......................................... 103 3.3.3 Foil Crack – (Internal Foil) ‘‘C’’Crack (铜箔裂缝–(内层铜箔)C型裂缝) ...................... 104 3.3.4 Foil Crack (External Foil) (铜箔裂缝(外层铜箔)).......................................... 105 3.3.5 Plating Crack (Barrel) ‘‘E’’Crack (镀层裂缝(孔壁)– E型裂缝) .......................... 106 3.3.6 Plating Crack – (Corner) ‘‘F’’Crack (镀层裂缝–(拐角)F型裂缝) .............................. 107 3.3.7 Plating Nodules(镀层结瘤) ..................................... 108 3.3.8 Copper Plating Thickness – Hole Wall (铜镀层厚度–孔壁)............................................... 109 3.3.9 Copper Wrap Plating(铜包覆电镀) ......................... 110 3.3.10 Plating Voids(镀层空洞) ......................................... 113 3.3.11 Solder Coating Thickness (Only When Specified)(焊料涂覆层厚度(仅当有规定时)) ..... 115 3.3.12 Solder Mask Thickness(阻焊膜厚度) ..................... 116 3.3.13 Wicking(芯吸) ......................................................... 117 3.3.13.1 Wicking, Clearance Holes(隔离孔的芯吸) ............ 118 3.3.14 Innerlayer Separation – Vertical (Axial) Microsection (内层分离–垂直(轴向)显微切片)................... 119 3.3.15 Innerlayer Separation – Horizontal (Transverse) Microsection(内层分离–水平(横向) 显微切片) ................................................................... 120 3.3.16 Material Fill of Blind and Buried Vias (埋/盲导通孔的材料填塞)..................................... 121 3.3.17 Cap Plating of Filled Holes (填塞孔的盖覆电镀)............................................... 123 3.4 Plated-Through Holes – Drilled(镀覆孔- 钻孔) ........... 125 3.4.1 Burrs(毛刺) .............................................................. 126 3.4.2 Nailheading(钉头) ................................................... 127 3.5 Plated-Through Holes – Punched(镀覆孔- 冲孔) ....... 128 3.5.1 Roughness and Nodules(粗糙度和结瘤) ................ 129 3.5.2 Flare(锥口) .............................................................. 130 4 Miscellaneous(其他类型板) .............................................. 131 4.1 Flexible and Rigid-Flex Printed Boards (挠性及刚挠性印制板) .......................................................... 132 4.1.1 Coverlay Coverage – Coverfilm Separations (覆盖层覆盖–覆盖膜分离)................................... 133 4.1.2 Coverlay/Covercoat Coverage – Adhesives (覆盖层/覆盖涂层的覆盖–粘接剂)..................... 134 4.1.2.1 Adhesive Squeeze-Out – Land Area (焊盘区域粘接剂的挤出)....................................... 134 4.1.2.2 Adhesive Squeeze-Out – Foil Surface (铜箔表面粘接剂的挤出)....................................... 135 4.1.3 Access Hole Registration for Coverlay and Stiffeners(元器件孔与覆盖层及增强板 的重合度) ................................................................... 136 4.1.4 Plating Defects(镀层缺陷) ...................................... 137 4.1.5 Stiffener Bonding(增强板的粘接) .......................... 138 4.1.6 Transition Zone, Rigid Area to Flexible Area (刚性区域与挠性区域的过渡区) ........................... 140 4.1.7 Solder Wicking/Plating Penetration Under Coverlay(覆盖层下的焊料芯吸/镀层渗透) .......... 141 4.1.8 Laminate Integrity(层压板完整性) ......................... 143 4.1.8.1 Laminate Integrity – Flexible Printed Board (层压板完整性–挠性印制板) ............................... 144 4.1.8.2 Laminate Integrity – Rigid-Flex Printed Board (层压板的完整性–刚挠性印制板)....................... 145 4.1.9 Etchback (Type 3 and Type 4 Only)(凹蚀 (仅3型和4型板))...................................................... 146 4.1.10 Smear Removal (Type 3 and 4 Only)(去钻污 (仅3型和4型板))...................................................... 147 4.1.11 Trimmed Edges/Edge Delamination (裁切边缘/边缘分层)............................................. 148 4.1.12 Fold/Bend Marks(折叠/弯曲痕迹) ........................ 150 4.1.13 Silver Film Integrity(银膜完整性) .......................... 151 4.2 Metal Core Printed Boards(⾦属芯印制板) ................... 153 4.2.1 Type Classifications(分类) ...................................... 154 4.2.2 Spacing Laminated Type(层压型板的间距) .......... 155 4.2.3 Insulation Thickness, Insulated Metal Substrate (绝缘型金属基板的绝缘厚度) ............................... 156 4.2.4 Insulation Material Fill, Laminated Type Metal Core (层压型金属芯板的绝缘材料填充)....................... 157 4.2.5 Cracks in Insulation Material Fill, Laminated Type (层压型板绝缘材料填充中的裂缝)....................... 158 4.2.6 Core Bond to Plated-Through Hole Wall (金属芯与镀覆孔壁的连接)................................... 159
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