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CC2530 DATASHEET

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CC2530F32, CC2530F64 CC2530F128, CC2530F256 www.ti.com SWRS081B – APRIL 2009 – REVISED FEBRUARY 2011 A True System-on-Chip Solution for 2.4-GHz IEEE 802.15.4 and ZigBee Applications Check for Samples: CC2530F32, CC2530F64, CC2530F128, CC2530F256 FEATURES 1 •2345 RF/Layout – 2.4-GHz IEEE 802.15.4 Compliant RF Transceiver – Excellent Receiver Sensitivity and Robustness to Interference – Programmable Output Power Up to 4.5 dBm – Very Few External Components – Only a Single Crystal Needed for Asynchronous Networks – 6-mm × 6-mm QFN40 Package – Suitable for Systems Targeting Compliance With Worldwide Radio-Frequency Regulations: ETSI EN 300 328 and EN 300 440 (Europe), FCC CFR47 Part 15 (US) and ARIB STD-T-66 (Japan) • Low Power – Active-Mode RX (CPU Idle): 24 mA – Active Mode TX at 1 dBm (CPU Idle): 29 mA – Power Mode 1 (4 μs Wake-Up): 0.2 mA – Power Mode 2 (Sleep Timer Running): 1 μA – Power Mode 3 (External Interrupts): 0.4 μA – Wide Supply-Voltage Range (2 V–3.6 V) • Microcontroller – High-Performance and Low-Power 8051 Microcontroller Core With Code Prefetch – 32-, 64-, 128-, or 256-KB In-System-Programmable Flash – 8-KB RAM With Retention in All Power Modes – Hardware Debug Support • Peripherals – Powerful Five-Channel DMA – Integrated High-Performance Op-Amp and Ultralow-Power Comparator – IEEE 802.15.4 MAC Timer, General-Purpose Timers (One 16-Bit, Two 8-Bit) – IR Generation Circuitry – 32-kHz Sleep Timer With Capture – CSMA/CA Hardware Support – Accurate Digital RSSI/LQI Support – Battery Monitor and Temperature Sensor – 12-Bit ADC With Eight Channels and Configurable Resolution – AES Security Coprocessor – Two Powerful USARTs With Support for Several Serial Protocols – 21 General-Purpose I/O Pins (19 × 4 mA, 2 × 20 mA) – Watchdog Timer • Development Tools – CC2530 Development Kit – CC2530 ZigBee® Development Kit – CC2530 RemoTI™ Development Kit for RF4CE – SmartRF™ Software – Packet Sniffer – IAR Embedded Workbench™ Available APPLICATIONS • 2.4-GHz IEEE 802.15.4 Systems • RF4CE Remote Control Systems (64-KB Flash and Higher) • ZigBee Systems (256-KB Flash) • Home/Building Automation • Lighting Systems • Industrial Control and Monitoring • Low-Power Wireless Sensor Networks • Consumer Electronics • Health Care 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. RemoTI, SmartRF, Z-Stack are trademarks of Texas Instruments. 2 IAR Embedded Workbench is a trademark of IAR Systems AB. 3 ZigBee is a registered trademark of the ZigBee Alliance. 4 All other trademarks are the property of their respective owners. 5 PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. © 2009–2011, Texas Instruments Incorporated CC2530F32, CC2530F64 CC2530F128, CC2530F256 SWRS081B – APRIL 2009 – REVISED FEBRUARY 2011 www.ti.com DESCRIPTION The CC2530 is a true system-on-chip (SoC) solution for IEEE 802.15.4, Zigbee and RF4CE applications. It enables robust network nodes to be built with very low total bill-of-material costs. The CC2530 combines the excellent performance of a leading RF transceiver with an industry-standard enhanced 8051 MCU, in-system programmable flash memory, 8-KB RAM, and many other powerful features. The CC2530 comes in four different flash versions: CC2530F32/64/128/256, with 32/64/128/256 KB of flash memory, respectively. The CC2530 has various operating modes, making it highly suited for systems where ultralow power consumption is required. Short transition times between operating modes further ensure low energy consumption. Combined with the industry-leading and golden-unit-status ZigBee protocol stack ( Z-Stack™) from Texas Instruments, the CC2530F256 provides a robust and complete ZigBee solution. Combined with the golden-unit-status RemoTI stack from Texas Instruments, the CC2530F64 and higher provide a robust and complete ZigBee RF4CE remote-control solution. 2 Submit Documentation Feedback © 2009–2011, Texas Instruments Incorporated Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256 www.ti.com RESET_N XOSC_Q2 XOSC_Q1 P2_4 P2_3 P2_2 P2_1 P2_0 P1_7 P1_6 P1_5 P1_4 P1_3 P1_2 P1_1 P1_0 P0_7 P0_6 P0_5 P0_4 P0_3 P0_2 P0_1 P0_0 I/O CONTROLLER RESET 32-MHz CRYSTAL OSC 32.768-kHz CRYSTAL OSC DEBUG INTERFACE WATCHDOG TIMER CLOCK MUX and CALIBRATION HIGHSPEED RC-OSC 32-kHz RC-OSC CC2530F32, CC2530F64 CC2530F128, CC2530F256 SWRS081B – APRIL 2009 – REVISED FEBRUARY 2011 ON-CHIP VOLTAGE REGULATOR POWER-ON RESET BROWN OUT VDD (2 V–3.6 V) DCOUPL SLEEP TIMER POWER MANAGEMENT CONTROLLER 8051 CPU CORE DMA MEMORY ARBITER 8-KB SRAM 32/64/128/256-KB FLASH IRQ CTRL ANALOG COMPARATOR OP-AMP FLASH CTRL RADIO REGISTERS CSMA/CA STROBE PROCESSOR 12-BIT DS ADC AES ENCRYPTION AND DECRYPTION RADIO DATA INTERFACE DEMODULATOR AND AGC MODULATOR FIFO and FRAME CONTROL SYNTH FREQUENCY SYNTHESIZER USART 0 USART 1 RECEIVE CHAIN TRANSMIT CHAIN TIMER 1 (16-Bit) TIMER 2 (IEEE 802.15.4 MAC TIMER) TIMER 3 (8-Bit) RF_P RF_N DIGITAL ANALOG MIXED TIMER 4 (8-Bit) B0301-02 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. © 2009–2011, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256 CC2530F32, CC2530F64 CC2530F128, CC2530F256 SWRS081B – APRIL 2009 – REVISED FEBRUARY 2011 www.ti.com ABSOLUTE MAXIMUM RATINGS(1) Supply voltage All supply pins must have the same voltage Voltage on any digital pin Input RF level Storage temperature range ESD (2) All pads, according to human-body model, JEDEC STD 22, method A114 According to charged-device model, JEDEC STD 22, method C101 MIN MAX UNIT –0.3 3.9 V –0.3 VDD + 0.3, ≤ 3.9 V 10 dBm –40 125 °C 2 kV 500 V (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) CAUTION: ESD sensitive device. Precaution should be used when handling the device in order to prevent permanent damage. RECOMMENDED OPERATING CONDITIONS Operating ambient temperature range, TA Operating supply voltage MIN MAX UNIT –40 125 °C 2 3.6 V ELECTRICAL CHARACTERISTICS Measured on Texas Instruments CC2530 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted. Boldface limits apply over the entire operating range, TA = –40°C to 125°C, VDD = 2 V to 3.6 V, and fc = 2394 MHz to 2507 MHz. PARAMETER TEST CONDITIONS Digital regulator on. 16-MHz RCOSC running. No radio, crystals, or peripherals active. Medium CPU activity: normal flash access(1), no RAM access 32-MHz XOSC running. No radio or peripherals active. Medium CPU activity: normal flash access(1), no RAM access 32-MHz XOSC running, radio in RX mode, –50-dBm input power, no peripherals active, CPU idle Icore Core current consumption 32-MHz XOSC running, radio in RX mode at -100-dBm input power (waiting for signal), no peripherals active, CPU idle 32-MHz XOSC running, radio in TX mode, 1-dBm output power, no peripherals active, CPU idle 32-MHz XOSC running, radio in TX mode, 4.5-dBm output power, no peripherals active, CPU idle Power mode 1. Digital regulator on; 16-MHz RCOSC and 32-MHz crystal oscillator off; 32.768-kHz XOSC, POR, BOD and sleep timer active; RAM and register retention Power mode 2. Digital regulator off; 16-MHz RCOSC and 32-MHz crystal oscillator off; 32.768-kHz XOSC, POR, and sleep timer active; RAM and register retention Power mode 3. Digital regulator off; no clocks; POR active; RAM and register retention Peripheral Current Consumption (Adds to core current Icore for each peripheral unit activated) Timer 1 Timer running, 32-MHz XOSC used Timer 2 Timer running, 32-MHz XOSC used Timer 3 Timer running, 32-MHz XOSC used Iperi Timer 4 Sleep timer Timer running, 32-MHz XOSC used Including 32.753-kHz RCOSC ADC When converting Flash Erase Burst write peak current MIN TYP MAX UNIT 3.4 mA 6.5 8.9 mA 20.5 mA 24.3 29.6 mA 28.7 mA 33.5 39.6 mA 0.2 0.3 mA 1 2 μA 0.4 1 μA 90 μA 90 μA 60 μA 70 μA 0.6 μA 1.2 mA 1 mA 6 mA (1) Normal flash access means that the code used exceeds the cache storage, so cache misses happen frequently. GENERAL CHARACTERISTICS Measured on Texas Instruments CC2530 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT WAKE-UP AND TIMING 4 Submit Documentation Feedback © 2009–2011, Texas Instruments Incorporated Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256 www.ti.com CC2530F32, CC2530F64 CC2530F128, CC2530F256 SWRS081B – APRIL 2009 – REVISED FEBRUARY 2011 GENERAL CHARACTERISTICS (continued) Measured on Texas Instruments CC2530 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Power mode 1 → active Digital regulator on, 16-MHz RCOSC and 32-MHz crystal oscillator off. Start-up of 16-MHz RCOSC 4 μs Power mode 2 or 3 → active Digital regulator off, 16-MHz RCOSC and 32-MHz crystal oscillator off. Start-up of regulator and 16-MHz RCOSC 0.1 ms Active → TX or RX Initially running on 16-MHz RCOSC, with 32-MHz XOSC OFF With 32-MHz XOSC initially on 0.5 ms 192 μs RX/TX and TX/RX turnaround 192 μs RADIO PART RF frequency range Programmable in 1-MHz steps, 5 MHz between channels for compliance with [1] 2394 2507 MHz Radio baud rate As defined by [1] 250 kbps Radio chip rate As defined by [1] 2 MChip/s Flash erase cycles 20 k cycles Flash page size 2 KB © 2009–2011, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256 CC2530F32, CC2530F64 CC2530F128, CC2530F256 SWRS081B – APRIL 2009 – REVISED FEBRUARY 2011 www.ti.com RF RECEIVE SECTION Measured on Texas Instruments CC2530 EM reference design with TA = 25°C, VDD = 3 V, and fc = 2440 MHz, unless otherwise noted. Boldface limits apply over the entire operating range, TA = –40°C to 125°C, VDD = 2 V to 3.6 V, and fc = 2394 MHz to 2507 MHz. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Receiver sensitivity PER = 1%, as specified by [1] [1] requires –85 dBm –97 –92 –88 dBm Saturation (maximum input level) PER = 1%, as specified by [1] [1] requires –20 dBm 10 dBm Adjacent-channel rejection, 5-MHz channel spacing Wanted signal –82 dBm, adjacent modulated channel at 5 MHz, PER = 1 %, as specified by [1]. [1] requires 0 dB 49 dB Adjacent-channel rejection, –5-MHz channel spacing Wanted signal –82 dBm, adjacent modulated channel at –5 MHz, PER = 1 %, as specified by [1]. [1] requires 0 dB 49 dB Alternate-channel rejection, 10-MHz channel spacing Wanted signal –82 dBm, adjacent modulated channel at 10 MHz, PER = 1%, as specified by [1] [1] requires 30 dB 57 dB Alternate-channel rejection, –10-MHz channel spacing Wanted signal –82 dBm, adjacent modulated channel at –10 MHz, PER = 1 %, as specified by [1] [1] requires 30 dB 57 dB Channel rejection ≥ 20 MHz ≤ –20 MHz Wanted signal at –82 dBm. Undesired signal is an IEEE 802.15.4 modulated channel, stepped through all channels from 2405 to 2480 MHz. Signal level for PER = 1%. 57 dB 57 Co-channel rejection Wanted signal at –82 dBm. Undesired signal is 802.15.4 modulated at the same frequency as the desired signal. Signal level for PER = 1%. –3 dB Blocking/desensitization 5 MHz from band edge 10 MHz from band edge 20 MHz from band edge 50 MHz from band edge –5 MHz from band edge –10 MHz from band edge –20 MHz from band edge –50 MHz from band edge Wanted signal 3 dB above the sensitivity level, CW jammer, PER = 1%. Measured according to EN 300 440 class 2. –33 –33 –32 –31 dBm –35 –35 –34 –34 Spurious emission. Only largest spurious emission stated within each band. 30 MHz–1000 MHz 1 GHz–12.75 GHz Conducted measurement with a 50-Ω single-ended load. Suitable for systems targeting compliance with EN 300 328, EN 300 440, FCC CFR47 Part 15 and ARIB STD-T-66. Frequency error tolerance(1) Symbol rate error tolerance(2) [1] requires minimum 80 ppm [1] requires minimum 80 ppm < –80 –57 ±150 ±1000 dBm ppm ppm (1) Difference between center frequency of the received RF signal and local oscillator frequency. (2) Difference between incoming symbol rate and the internally generated symbol rate 6 Submit Documentation Feedback © 2009–2011, Texas Instruments Incorporated Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256 www.ti.com CC2530F32, CC2530F64 CC2530F128, CC2530F256 SWRS081B – APRIL 2009 – REVISED FEBRUARY 2011 RF TRANSMIT SECTION Measured on Texas Instruments CC2530 EM reference design with TA = 25°C, VDD = 3 V and fc = 2440 MHz, unless otherwise noted. Boldface limits apply over the entire operating range, TA = –40°C to 125°C, VDD = 2 V to 3.6 V and fc = 2394 MHz to 2507 MHz. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Nominal output power Delivered to a single-ended 50-Ω load through a balun using maximum-recommended output-power setting [1] requires minimum –3 dBm 0 –8 4.5 8 10 dBm Programmable output power range Spurious emissions Max recommended output power setting(1) 32 dB Measured conducted according to stated regulations. Only largest spurious emission stated within each band. 25 MHz–1000 MHz (outside restricted bands) 25 MHz–2400 MHz (within FCC restricted bands) 25 MHz–1000 MHz (within ETSI restricted bands) 1800–1900 MHz (ETSI restricted band) 5150–5300 MHz (ETSI restricted band) At 2 × fc and 3 × fc (FCC restricted band) At 2 × fc and 3 × fc (ETSI EN 300-440 and EN 300-328)(2) 1 GHz–12.75 GHz (outside restricted bands) At 2483.5 MHz and above (FCC restricted band) fc= 2480 MHz(3) –60 –60 –60 –57 –55 dBm –42 –31 –53 –42 Measured as defined by [1] using maximum-recommended Error vector magnitude (EVM) output-power setting 2% [1] requires maximum 35%. Optimum load impedance Differential impedance as seen from the RF port (RF_P and RF_N) towards the antenna 69 + j29 Ω (1) Texas Instruments CC2530 EM reference design is suitable for systems targeting compliance with EN 300 328, EN 300 440, FCC CFR47 Part 15 and ARIB STD-T-66. (2) Margins for passing conducted requirements at the third harmonic can be improved by using a simple band-pass filter connected between matching network and RF connector (1.8 pF in parallel with 1.6 nH); this filter must be connected to a good RF ground. (3) Margins for passing FCC requirements at 2483.5 MHz and above when transmitting at 2480 MHz can be improved by using a lower output-power setting or having less than 100% duty cycle. © 2009–2011, Texas Instruments Incorporated Submit Documentation Feedback 7 Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256 CC2530F32, CC2530F64 CC2530F128, CC2530F256 SWRS081B – APRIL 2009 – REVISED FEBRUARY 2011 www.ti.com 32-MHz CRYSTAL OSCILLATOR Measured on Texas Instruments CC2530 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Crystal frequency 32 MHz Crystal frequency accuracy requirement (1) –40 40 ppm ESR Equivalent series resistance 6 60 Ω C0 Crystal shunt capacitance CL Crystal load capacitance Start-up time 1 10 0.3 7 pF 16 pF ms The crystal oscillator must be in power down for a guard time before it is used again. This Power-down guard time requirement is valid for all modes of operation. The 3 ms need for power-down guard time can vary with crystal type and load. (1) Including aging and temperature dependency, as specified by [1] 32.768-kHz CRYSTAL OSCILLATOR Measured on Texas Instruments CC2530 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Crystal frequency 32.768 kHz Crystal frequency accuracy requirement (1) –40 40 ppm ESR Equivalent series resistance 40 130 kΩ C0 Crystal shunt capacitance CL Crystal load capacitance Start-up time 0.9 2 pF 12 16 pF 0.4 s (1) Including aging and temperature dependency, as specified by [1] 32-kHz RC OSCILLATOR Measured on Texas Instruments CC2530 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Calibrated frequency(1) 32.753 kHz Frequency accuracy after calibration Temperature coefficient(2) Supply-voltage coefficient(3) Calibration time(4) ±0.2% 0.4 3 2 %/°C %/V ms (1) The calibrated 32-kHz RC oscillator frequency is the 32-MHz XTAL frequency divided by 977. (2) Frequency drift when temperature changes after calibration (3) Frequency drift when supply voltage changes after calibration (4) When the 32-kHz RC oscillator is enabled, it is calibrated when a switch from the 16-MHz RC oscillator to the 32-MHz crystal oscillator is performed while SLEEPCMD.OSC32K_CALDIS is 0. 8 Submit Documentation Feedback © 2009–2011, Texas Instruments Incorporated Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256 www.ti.com CC2530F32, CC2530F64 CC2530F128, CC2530F256 SWRS081B – APRIL 2009 – REVISED FEBRUARY 2011 16-MHz RC OSCILLATOR Measured on Texas Instruments CC2530 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Frequency (1) 16 MHz Uncalibrated frequency accuracy ±18% Calibrated frequency accuracy ±0.6% ±1% Start-up time Initial calibration time(2) 10 μs 50 μs (1) The calibrated 16-MHz RC oscillator frequency is the 32-MHz XTAL frequency divided by 2. (2) When the 16-MHz RC oscillator is enabled, it is calibrated when a switch from the 16-MHz RC oscillator to the 32-MHz crystal oscillator is performed while SLEEPCMD.OSC_PD is set to 0. RSSI/CCA CHARACTERISTICS Measured on Texas Instruments CC2530 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT RSSI range 100 dB Absolute uncalibrated RSSI/CCA accuracy RSSI/CCA offset(1) ±4 dB 73 dB Step size (LSB value) 1 dB (1) Real RSSI = Register value – offset FREQEST CHARACTERISTICS Measured on Texas Instruments CC2530 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT FREQEST range ±250 kHz FREQEST accuracy FREQEST offset(1) ±40 kHz 20 kHz Step size (LSB value) 7.8 kHz (1) Real FREQEST = Register value – offset FREQUENCY SYNTHESIZER CHARACTERISTICS Measured on Texas Instruments CC2530 EM reference design with TA = 25°C, VDD = 3 V and fc = 2440 MHz, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT At ±1-MHz offset from carrier –110 Phase noise, unmodulated carrier At ±2-MHz offset from carrier –117 dBc/Hz At ±5-MHz offset from carrier –122 ANALOG TEMPERATURE SENSOR Measured on Texas Instruments CC2530 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Output at 25°C 1480 12-bit ADC Temperature coefficient 4.5 /1°C Voltage coefficient Initial accuracy without calibration Accuracy using 1-point calibration (entire temperature range) Measured using integrated ADC using internal bandgap voltage reference and maximum resolution 1 /0.1 V ±10 °C ±5 °C Current consumption when enabled (ADC current not included) 0.5 mA © 2009–2011, Texas Instruments Incorporated Submit Documentation Feedback 9 Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256 CC2530F32, CC2530F64 CC2530F128, CC2530F256 SWRS081B – APRIL 2009 – REVISED FEBRUARY 2011 www.ti.com OP-AMP CHARACTERISTICS TA = 25°C, VDD = 3 V . All measurement results are obtained using the CC2530 reference designs post-calibration. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Chopping Configuration, Register APCFG = 0x07, OPAMPMC = 0x03, OPAMPC = 0x01 Output maximum voltage VDD – 0.07 V Output minimum voltage 0.07 V Open-loop gain 108 dB Gain-bandwidth product 2 MHz Slew rate 107 V/μs Input maximum voltage VDD + 0.13 V Intput minimum voltage –55 mV Input offset voltage 40 μV CMRR Common-mode rejection ratio 90 dB Supply current 0.4 mA Input noise voltage f = 0.01 Hz to 1 Hz f = 0.1 Hz to 10 Hz 1.1 nV/√(Hz) 1.7 Non-Chopping Configuration, Register APCFG = 0x07, OPAMPMC = 0x00, OPAMPC = 0x01 Output maximum voltage VDD – 0.07 V Output minimum voltage 0.07 V Open-loop gain 108 dB Gain-bandwidth product 2 MHz Slew rate 107 V/μs Input maximum voltage VDD + 0.13 V Intput minimum voltage –55 mV Input offset voltage 0.8 mV CMRR Common-mode rejection ratio 90 dB Supply current 0.4 mA Input noise voltage f = 0.01 Hz to 1 Hz f = 0.1 Hz to 10 Hz 60 nV/√(Hz) 65 COMPARATOR CHARACTERISTICS TA = 25°C, VDD = 3 V. All measurement results are obtained using the CC2530 reference designs, post-calibration. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Common-mode maximum voltage VDD V Common-mode minimum voltage –0.3 Input offset voltage 1 mV Offset vs temperature 16 µV/°C Offset vs operating voltage 4 mV/V Supply current 230 nA Hysteresis 0.15 mV 10 Submit Documentation Feedback © 2009–2011, Texas Instruments Incorporated Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256 www.ti.com CC2530F32, CC2530F64 CC2530F128, CC2530F256 SWRS081B – APRIL 2009 – REVISED FEBRUARY 2011 ADC CHARACTERISTICS TA = 25°C and VDD = 3 V, unless otherwise noted. PARAMETER TEST CONDITIONS Input voltage VDD is voltage on AVDD5 pin External reference voltage VDD is voltage on AVDD5 pin External reference voltage differential VDD is voltage on AVDD5 pin Input resistance, signal Full-scale signal(1) Using 4-MHz clock speed Peak-to-peak, defines 0 dBFS Single-ended input, 7-bit setting Single-ended input, 9-bit setting Single-ended input, 10-bit setting ENOB (1) Effective number of bits Single-ended input, 12-bit setting Differential input, 7-bit setting Differential input, 9-bit setting Differential input, 10-bit setting Differential input, 12-bit setting Useful power bandwidth 7-bit setting, both single and differential THD (1) Total harmonic distortion Single-ended input, 12-bit setting, –6 dBFS Differential input, 12-bit setting, –6 dBFS Single-ended input, 12-bit setting Signal to nonharmonic ratio(1) Differential input, 12-bit setting Single-ended input, 12-bit setting, –6 dBFS Differential input, 12-bit setting, –6 dBFS CMRR Common-mode rejection ratio Differential input, 12-bit setting, 1-kHz sine (0 dBFS), limited by ADC resolution Crosstalk Single-ended input, 12-bit setting, 1-kHz sine (0 dBFS), limited by ADC resolution Offset Midscale Gain error DNL (1) Differential nonlinearity 12-bit setting, mean 12-bit setting, maximum INL (1) Integral nonlinearity 12-bit setting, mean 12-bit setting, maximum Single-ended input, 7-bit setting Single-ended input, 9-bit setting Single-ended input, 10-bit setting SINAD (1) (–THD+N) Signal-to-noise-and-distortion Single-ended input, 12-bit setting Differential input, 7-bit setting Differential input, 9-bit setting Differential input, 10-bit setting Differential input, 12-bit setting 7-bit setting Conversion time 9-bit setting 10-bit setting 12-bit setting Power consumption Internal reference voltage Internal reference VDD coefficient Internal reference temperature coefficient (1) Measured with 300-Hz sine-wave input and VDD as reference. MIN TYP MAX UNIT 0 VDD V 0 VDD V 0 VDD V 197 kΩ 2.97 V 5.7 7.5 9.3 10.8 bits 6.5 8.3 10.0 11.5 0–20 kHz –75.2 dB –86.6 70.2 79.3 dB 78.8 88.9 >84 dB >84 dB –3 mV 0.68 % 0.05 LSB 0.9 4.6 LSB 13.3 35.4 46.8 57.5 66.6 dB 40.7 51.6 61.8 70.8 20 36 μs 68 132 1.2 mA 1.15 V 4 mV/V 0.4 mV/10°C © 2009–2011, Texas Instruments Incorporated Submit Documentation Feedback 11 Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256 CC2530F32, CC2530F64 CC2530F128, CC2530F256 SWRS081B – APRIL 2009 – REVISED FEBRUARY 2011 CONTROL INPUT AC CHARACTERISTICS TA = –40°C to 125°C, VDD = 2 V to 3.6 V, unless otherwise noted. PARAMETER TEST CONDITIONS System clock, fSYSCLK tSYSCLK = 1/fSYSCLK The undivided system clock is 32 MHz when crystal oscillator is used. The undivided system clock is 16 MHz when calibrated 16-MHz RC oscillator is used. RESET_N low duration See item 1, Figure 1. This is the shortest pulse that is recognized as a complete reset pin request. Note that shorter pulses may be recognized but might not lead to complete reset of all modules within the chip. Interrupt pulse duration See item 2, Figure 1.This is the shortest pulse that is recognized as an interrupt request. www.ti.com MIN TYP 16 MAX UNIT 32 MHz 1 μs 20 ns RESET_N Px.n 1 2 Figure 1. Control Input AC Characteristics T0299-01 12 Submit Documentation Feedback © 2009–2011, Texas Instruments Incorporated Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256 www.ti.com SPI AC CHARACTERISTICS TA = –40°C to 125°C, VDD = 2 V to 3.6 V PARAMETER TEST CONDITIONS t1 SCK period Master, RX and TX Slave, RX and TX SCK duty cycle Master t2 SSN low to SCK Master Slave t3 SCK to SSN high Master Slave t4 MOSI early out t5 MOSI late out t6 MISO setup t7 MISO hold SCK duty cycle Master, load = 10 pF Master, load = 10 pF Master Master Slave t10 MOSI setup t11 MOSI hold t9 MISO late out Slave Slave Slave, load = 10 pF Master, TX only Operating frequency Master, RX and TX Slave, RX only Slave, RX and TX CC2530F32, CC2530F64 CC2530F128, CC2530F256 SWRS081B – APRIL 2009 – REVISED FEBRUARY 2011 MIN TYP MAX UNIT 250 ns 250 50% 63 ns 63 63 ns 63 7 ns 10 ns 90 ns 10 ns 50% ns 35 ns 10 ns 95 ns 8 4 MHz 8 4 SCK SSN MOSI MISO X t2 t3 D0 t6 t7 D0 t4 t5 X D1 X Figure 2. SPI Master AC Characteristics T0478-01 © 2009–2011, Texas Instruments Incorporated Submit Documentation Feedback 13 Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256 CC2530F32, CC2530F64 CC2530F128, CC2530F256 SWRS081B – APRIL 2009 – REVISED FEBRUARY 2011 SCK SSN MISO MOSI X t2 t3 D0 t10 t11 D0 t8 t9 X D1 X Figure 3. SPI Slave AC Characteristics www.ti.com T0479-01 14 Submit Documentation Feedback © 2009–2011, Texas Instruments Incorporated Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256 www.ti.com DEBUG INTERFACE AC CHARACTERISTICS TA = –40°C to 125°C, VDD = 2 V to 3.6 V, unless otherwise noted. PARAMETER TEST CONDITIONS fclk_dbg t1 t2 t3 Debug clock frequency (see Figure 4) Allowed high pulse on clock (see Figure 4) Allowed low pulse on clock (see Figure 4) EXT_RESET_N low to first falling edge on debug clock (see Figure 5) t4 Falling edge on clock to EXT_RESET_N high (see Figure 5) t5 EXT_RESET_N high to first debug command (see Figure 5) t6 Debug data setup (see Figure 6) t7 Debug data hold (see Figure 6) t8 Clock-to-data delay (see Figure 6) Load = 10 pF CC2530F32, CC2530F64 CC2530F128, CC2530F256 SWRS081B – APRIL 2009 – REVISED FEBRUARY 2011 MIN TYP MAX UNIT 12 MHz 35 ns 35 ns 167 ns 83 ns 83 ns 2 ns 4 ns 30 ns Time DEBUG_ CLK P2_2 t1 t2 1/fclk_dbg Figure 4. Debug Clock – Basic Timing T0436-01 Time DEBUG_ CLK P2_2 RESET_N t3 t4 t5 Figure 5. Data Setup and Hold Timing T0437-01 © 2009–2011, Texas Instruments Incorporated Submit Documentation Feedback 15 Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256 CC2530F32, CC2530F64 CC2530F128, CC2530F256 SWRS081B – APRIL 2009 – REVISED FEBRUARY 2011 www.ti.com Time DEBUG_ CLK P2_2 DEBUG_DATA (to CC253x) P2_1 DEBUG_DATA (from CC253x) P2_1 t6 t7 Figure 6. Debug Enable Timing TIMER INPUTS AC CHARACTERISTICS TA = –40°C to 125°C, VDD = 2 V to 3.6 V, unless otherwise noted. PARAMETER TEST CONDITIONS Synchronizers determine the shortest input pulse that can be Input capture pulse duration recognized. The synchronizers operate at the current system clock rate (16 or 32 MHz). t8 T0438-01 MIN TYP MAX UNIT tSYSCLK 1.5 16 Submit Documentation Feedback © 2009–2011, Texas Instruments Incorporated Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256 www.ti.com DC CHARACTERISTICS TA = 25°C, VDD = 3 V, unless otherwise noted. PARAMETER TEST CONDITIONS Logic-0 input voltage Logic-1 input voltage Logic-0 input current Input equals 0 V Logic-1 input current Input equals VDD I/O-pin pullup and pulldown resistors Logic-0 output voltage, 4-mA pins Output load 4 mA Logic-1 output voltage, 4-mA pins Output load 4 mA Logic-0 output voltage, 20-mA pins Output load 20 mA Logic-1 output voltage, 20-mA pins Output load 20 mA CC2530F32, CC2530F64 CC2530F128, CC2530F256 SWRS081B – APRIL 2009 – REVISED FEBRUARY 2011 MIN TYP MAX UNIT 0.5 V 2.5 V –50 50 nA –50 50 nA 20 kΩ 0.5 V 2.4 V 0.5 V 2.4 V DEVICE INFORMATION PIN DESCRIPTIONS The CC2530 pinout is shown in Figure 7 and a short description of the pins follows. CC2530 RHA Package (Top View) DCOUPL DVDD1 P1_6 P1_7 P2_0 P2_1 P2_2 P2_3/XOSC32K_Q2 P2_4/XOSC32K_Q1 AVDD6 GND GND GND GND P1_5 P1_4 P1_3 P1_2 P1_1 DVDD2 40 39 38 37 36 35 34 33 32 31 1 30 2 29 3 28 4 27 5 GND 26 6 Ground Pad 25 7 24 8 23 22 10 21 11 12 13 14 15 16 17 18 19 20 RBIAS AVDD4 AVDD1 AVDD2 RF_N RF_P AVDD3 XOSC_Q2 XOSC_Q1 AVDD5 9 P1_0 P0_7 P0_6 P0_5 P0_4 P0_3 P0_2 P0_1 P0_0 RESET_N P0076-02 NOTE: The exposed ground pad must be connected to a solid ground plane, as this is the ground connection for the chip. Figure 7. Pinout Top View © 2009–2011, Texas Instruments Incorporated Submit Documentation Feedback 17 Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256 CC2530F32, CC2530F64 CC2530F128, CC2530F256 SWRS081B – APRIL 2009 – REVISED FEBRUARY 2011 www.ti.com PIN NAME AVDD1 AVDD2 AVDD3 AVDD4 AVDD5 AVDD6 DCOUPL DVDD1 DVDD2 GND GND P0_0 P0_1 P0_2 P0_3 P0_4 P0_5 P0_6 P0_7 P1_0 P1_1 P1_2 P1_3 P1_4 P1_5 P1_6 P1_7 P2_0 P2_1 P2_2 P2_3/ XOSC32K_Q2 P2_4/ XOSC32K_Q1 RBIAS RESET_N RF_N RF_P XOSC_Q1 XOSC_Q2 PIN 28 27 24 29 21 31 40 39 10 — 1, 2, 3, 4 19 18 17 16 15 14 13 12 11 9 8 7 6 5 38 37 36 35 34 33 32 30 20 26 25 22 23 PIN TYPE Power (analog) Power (analog) Power (analog) Power (analog) Power (analog) Power (analog) Power (digital) Power (digital) Power (digital) Ground Unused pins Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O, Analog I/O Digital I/O, Analog I/O Analog I/O Digital input RF I/O RF I/O Analog I/O Analog I/O Table 1. Pin Descriptions DESCRIPTION 2-V–3.6-V analog power-supply connection 2-V–3.6-V analog power-supply connection 2-V–3.6-V analog power-supply connection 2-V–3.6-V analog power-supply connection 2-V–3.6-V analog power-supply connection 2-V–3.6-V analog power-supply connection 1.8-V digital power-supply decoupling. Do not use for supplying external circuits. 2-V–3.6-V digital power-supply connection 2-V–3.6-V digital power-supply connection The ground pad must be connected to a solid ground plane. Connect to GND Port 0.0 Port 0.1 Port 0.2 Port 0.3 Port 0.4 Port 0.5 Port 0.6 Port 0.7 Port 1.0 – 20-mA drive capability Port 1.1 – 20-mA drive capability Port 1.2 Port 1.3 Port 1.4 Port 1.5 Port 1.6 Port 1.7 Port 2.0 Port 2.1 Port 2.2 Port 2.3/32.768 kHz XOSC Port 2.4/32.768 kHz XOSC External precision bias resistor for reference current Reset, active-low Negative RF input signal to LNA during RX Negative RF output signal from PA during TX Positive RF input signal to LNA during RX Positive RF output signal from PA during TX 32-MHz crystal oscillator pin 1 or external-clock input 32-MHz crystal oscillator pin 2 18 Submit Documentation Feedback © 2009–2011, Texas Instruments Incorporated Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256 www.ti.com CIRCUIT DESCRIPTION CC2530F32, CC2530F64 CC2530F128, CC2530F256 SWRS081B – APRIL 2009 – REVISED FEBRUARY 2011 RESET_N XOSC_Q2 XOSC_Q1 P2_4 P2_3 P2_2 P2_1 P2_0 P1_7 P1_6 P1_5 P1_4 P1_3 P1_2 P1_1 P1_0 P0_7 P0_6 P0_5 P0_4 P0_3 P0_2 P0_1 P0_0 I/O CONTROLLER RESET 32-MHz CRYSTAL OSC 32.768-kHz CRYSTAL OSC DEBUG INTERFACE WATCHDOG TIMER CLOCK MUX and CALIBRATION HIGHSPEED RC-OSC 32-kHz RC-OSC ON-CHIP VOLTAGE REGULATOR POWER-ON RESET BROWN OUT VDD (2 V–3.6 V) DCOUPL SLEEP TIMER POWER MANAGEMENT CONTROLLER 8051 CPU CORE DMA MEMORY ARBITER 8-KB SRAM 32/64/128/256-KB FLASH IRQ CTRL ANALOG COMPARATOR OP-AMP FLASH CTRL RADIO REGISTERS CSMA/CA STROBE PROCESSOR 12-BIT DS ADC AES ENCRYPTION AND DECRYPTION RADIO DATA INTERFACE DEMODULATOR AND AGC MODULATOR FIFO and FRAME CONTROL SYNTH FREQUENCY SYNTHESIZER USART 0 USART 1 RECEIVE CHAIN TRANSMIT CHAIN TIMER 1 (16-Bit) TIMER 2 (IEEE 802.15.4 MAC TIMER) TIMER 3 (8-Bit) TIMER 4 (8-Bit) RF_P RF_N DIGITAL ANALOG MIXED B0301-02 © 2009–2011, Texas Instruments Incorporated Submit Documentation Feedback 19 Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256 CC2530F32, CC2530F64 CC2530F128, CC2530F256 SWRS081B – APRIL 2009 – REVISED FEBRUARY 2011 Figure 8. CC2530 Block Diagram www.ti.com A block diagram of the CC2530 is shown in Figure 8. The modules can be roughly divided into one of three categories: CPU- and memory-related modules; modules related to peripherals, clocks, and power management; and radio-related modules. In the following subsections, a short description of each module that appears in Figure 8 is given. For more details about the modules and their usage, see the corresponding chapters in the CC253x User's Guide (SWRU191). CPU and Memory The 8051 CPU core used in the CC253x device family is a single-cycle 8051-compatible core. It has three different memory-access buses (SFR, DATA and CODE/XDATA) with single-cycle access to SFR, DATA, and the main SRAM. It also includes a debug interface and an 18-input extended interrupt unit. The interrupt controller services a total of 18 interrupt sources, divided into six interrupt groups, each of which is associated with one of four interrupt priorities. Any interrupt service request is serviced also when the device is in idle mode by going back to active mode. Some interrupts can also wake up the device from sleep mode (power modes 1–3). The memory arbiter is at the heart of the system, as it connects the CPU and DMA controller with the physical memories and all peripherals through the SFR bus. The memory arbiter has four memory access points, access of which can map to one of three physical memories: an 8-KB SRAM, flash memory, and XREG/SFR registers. It is responsible for performing arbitration and sequencing between simultaneous memory accesses to the same physical memory. The 8-KB SRAM maps to the DATA memory space and to parts of the XDATA memory spaces. The 8-KB SRAM is an ultralow-power SRAM that retains its contents even when the digital part is powered off (power modes 2 and 3). This is an important feature for low-power applications. The 32/64/128/256 KB flash block provides in-circuit programmable non-volatile program memory for the device, and maps into the CODE and XDATA memory spaces. In addition to holding program code and constants, the non-volatile memory allows the application to save data that must be preserved such that it is available after restarting the device. Using this feature one can, e.g., use saved network-specific data to avoid the need for a full start-up and network find-and-join process . Clocks and Power Management The digital core and peripherals are powered by a 1.8-V low-dropout voltage regulator. It provides power management functionality that enables low power operation for long battery life using different power modes. Five different reset sources exist to reset the device. Peripherals The CC2530 includes many different peripherals that allow the application designer to develop advanced applications. The debug interface implements a proprietary two-wire serial interface that is used for in-circuit debugging. Through this debug interface, it is possible to perform an erasure of the entire flash memory, control which oscillators are enabled, stop and start execution of the user program, execute supplied instructions on the 8051 core, set code breakpoints, and single-step through instructions in the code. Using these techniques, it is possible to perform in-circuit debugging and external flash programming elegantly. The device contains flash memory for storage of program code. The flash memory is programmable from the user software and through the debug interface. The flash controller handles writing and erasing the embedded flash memory. The flash controller allows page-wise erasure and 4-bytewise programming. The I/O controller is responsible for all general-purpose I/O pins. The CPU can configure whether peripheral modules control certain pins or whether they are under software control, and if so, whether each pin is configured as an input or output and if a pullup or pulldown resistor in the pad is connected. CPU interrupts can be enabled on each pin individually. Each peripheral that connects to the I/O pins can choose between two different I/O pin locations to ensure flexibility in various applications. 20 Submit Documentation Feedback © 2009–2011, Texas Instruments Incorporated Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256 www.ti.com CC2530F32, CC2530F64 CC2530F128, CC2530F256 SWRS081B – APRIL 2009 – REVISED FEBRUARY 2011 A versatile five-channel DMA controller is available in the system, accesses memory using the XDATA memory space, and thus has access to all physical memories. Each channel (trigger, priority, transfer mode, addressing mode, source and destination pointers, and transfer count) is configured with DMA descriptors anywhere in memory. Many of the hardware peripherals (AES core, flash controller, USARTs, timers, ADC interface) achieve highly efficient operation by using the DMA controller for data transfers between SFR or XREG addresses and flash/SRAM. Timer 1 is a 16-bit timer with timer/counter/PWM functionality. It has a programmable prescaler, a 16-bit period value, and five individually programmable counter/capture channels, each with a 16-bit compare value. Each of the counter/capture channels can be used as a PWM output or to capture the timing of edges on input signals. It can also be configured in IR Generation Mode where it counts Timer 3 periods and the output is ANDed with the output of Timer 3 to generate modulated consumer IR signals with minimal CPU interaction. Timer 2 (the MAC Timer) is specially designed for supporting an IEEE 802.15.4 MAC or other time-slotted protocol in software. The timer has a configurable timer period and a 24-bit overflow counter that can be used to keep track of the number of periods that have transpired. A 40-bit capture register is also used to record the exact time at which a start-of-frame delimiter is received/transmitted or the exact time at which transmission ends, as well as two 16-bit output compare registers and two 24-bit overflow compare registers that can send various command strobes (start RX, start TX, etc.) at specific times to the radio modules. Timer 3 and Timer 4 are 8-bit timers with timer/counter/PWM functionality. They have a programmable prescaler, an 8-bit period value, and one programmable counter channel with an 8-bit compare value. Each of the counter channels can be used as a PWM output. The sleep timer is an ultralow-power timer that counts 32-kHz crystal oscillator or 32-kHz RC oscillator periods. The sleep timer runs continuously in all operating modes except power mode 3 (PM3). Typical applications of this timer are as a real-time counter or as a wake-up timer to come out of power mode 1 (PM1) or 2 (PM2). The ADC supports 7 to 12 bits of resolution in a 30 kHz to 4 kHz bandwidth, respectively. DC and audio conversions with up to eight input channels (Port 0) are possible. The inputs can be selected as single-ended or differential. The reference voltage can be internal, AVDD, or a single-ended or differential external signal. The ADC also has a temperature-sensor input channel. The ADC can automate the process of periodic sampling or conversion over a sequence of channels. The operational amplifier is intended to provide front-end buffering and gain for the ADC. Both inputs as well as the output are available on pins, so the feedback network is fully customizable. A chopper-stabilized mode is available for applications that need good accuracy with high gain. The ultralow-power analog comparator enables applications to wake up from PM2 or PM3 based on an analog signal. Both inputs are brought out to pins; the reference voltage must be provided externally. The comparator output is connected to the I/O controller interrupt detector and can be treated by the MCU as a regular I/O pin interrupt. The random-number generator uses a 16-bit LFSR to generate pseudorandom numbers, which can be read by the CPU or used directly by the command strobe processor. It can be seeded with random data from noise in the radio ADC. The AES encryption/decryption core allows the user to encrypt and decrypt data using the AES algorithm with 128-bit keys. The core is able to support the AES operations required by IEEE 802.15.4 MAC security, the ZigBee network layer, and the application layer. A built-in watchdog timer allows the CC2530 to reset itself in case the firmware hangs. When enabled by software, the watchdog timer must be cleared periodically; otherwise, it resets the device when it times out. It can alternatively be configured for use as a general 32-kHz timer. USART 0 and USART 1 are each configurable as either a SPI master/slave or a UART. They provide double buffering on both RX and TX and hardware flow control and are thus well suited to high-throughput full-duplex applications. Each has its own high-precision baud-rate generator, thus leaving the ordinary timers free for other uses. © 2009–2011, Texas Instruments Incorporated Submit Documentation Feedback 21 Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256 CC2530F32, CC2530F64 CC2530F128, CC2530F256 SWRS081B – APRIL 2009 – REVISED FEBRUARY 2011 www.ti.com Radio The CC2530 features an IEEE 802.15.4-compliant radio transceiver. The RF core controls the analog radio modules. In addition, it provides an interface between the MCU and the radio which makes it possible to issue commands, read status, and automate and sequence radio events. The radio also includes a packet-filtering and address-recognition module. TYPICAL CHARACTERISTICS RX CURRENT (–100 dBm INPUT) vs TEMPERATURE TX CURRENT (TXPOWER = 0xF5) vs TEMPERATURE 28 36 27 35 26 TX Current − mA RX Current − mA 25 34 24 33 23 22 −40 26.0 0 40 80 T − Temperature − °C Figure 9. RX CURRENT (–100 dBm INPUT) vs SUPPLY VOLTAGE 120 G001 32 −40 34.4 0 40 80 T − Temperature − °C Figure 10. TX CURRENT (TXPOWER = 0xF5) vs SUPPLY VOLTAGE 120 G002 25.5 34.2 TX Current − mA RX Current − mA 25.0 34.0 24.5 33.8 24.0 2.0 2.4 2.8 3.2 VCC − Supply Voltage − V Figure 11. 3.6 G003 33.6 2.0 2.4 2.8 3.2 VCC − Supply Voltage − V Figure 12. 3.6 G004 22 Submit Documentation Feedback © 2009–2011, Texas Instruments Incorporated Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256 www.ti.com 6.0 CC2530F32, CC2530F64 CC2530F128, CC2530F256 SWRS081B – APRIL 2009 – REVISED FEBRUARY 2011 TYPICAL CHARACTERISTICS (continued) OUTPUT POWER (TXPOWER = 0xF5) vs FREQUENCY INTERFERER REJECTION (802.15.4 INTERFERER) vs INTERFERER FREQUENCY (CARRIER AT –82 dBm, 2440 MHz) 75 Interferer Rejection − dB PO − Output Power − dBm 5.5 50 5.0 25 4.5 0 4.0 Sensitivity − dBm 3.5 2394 2414 2434 2454 2474 2494 f − Frequency − MHz G005 Figure 13. SENSITIVITY vs TEMPERATURE −92 −93 −94 −95 −96 −97 −98 −99 −40 0 40 80 T − Temperature − °C Figure 15. 120 G007 PO − Output Power − dBm −25 2400 2420 2440 2460 Interferer Frequency − MHz Figure 14. 2480 G006 OUTPUT POWER (TXPOWER = 0xF5) vs TEMPERATURE 8 6 4 2 0 −2 −40 0 40 80 T − Temperature − °C Figure 16. 120 G008 © 2009–2011, Texas Instruments Incorporated Submit Documentation Feedback 23 Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256 CC2530F32, CC2530F64 CC2530F128, CC2530F256 SWRS081B – APRIL 2009 – REVISED FEBRUARY 2011 TYPICAL CHARACTERISTICS (continued) OUTPUT POWER (TXPOWER = 0xF5) vs SUPPLY VOLTAGE SENSITIVITY vs SUPPLY VOLTAGE 5.0 −94 www.ti.com PO − Output Power − dBm Sensitivity − dBm 4.8 4.6 4.4 4.2 4.0 2.0 2.4 2.8 3.2 VCC − Supply Voltage − V Figure 17. 3.6 G009 −95 −96 −97 −98 −99 −100 2.0 2.4 2.8 3.2 VCC − Supply Voltage − V Figure 18. 3.6 G010 Table 2. Recommended Output Power Settings(1) TXPOWER Register Setting 0xF5 0xE5 0xD5 0xC5 0xB5 0xA5 0x95 0x85 0x75 0x65 0x55 0x45 0x35 0x25 0x15 0x05 0x05 and TXCTRL = 0x09 Typical Output Power (dBm) 4.5 2.5 1 –0.5 –1.5 –3 –4 –6 –8 –10 –12 –14 –16 –18 –20 –22 –28 Typical Current Consumption (mA) 34 31 29 28 27 27 26 26 25 25 25 25 25 24 24 23 23 (1) Measured on Texas Instruments CC2530 EM reference design with TA = 25°C, VDD = 3 V and fc = 2440 MHz, unless otherwise noted. See References, Item 1, for recommended register settings. 24 Submit Documentation Feedback © 2009–2011, Texas Instruments Incorporated Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256 www.ti.com CC2530F32, CC2530F64 CC2530F128, CC2530F256 SWRS081B – APRIL 2009 – REVISED FEBRUARY 2011 APPLICATION INFORMATION Few external components are required for the operation of the CC2530. A typical application circuit is shown in Figure 19. Typical values and description of external components are shown in Table 3. 2-V to 3.6-V Power Supply Optional 32-kHz Crystal C401 C331 XTAL2 1 GND 2 GND 3 GND 4 GND 5 P1_5 6 P1_4 7 P1_3 8 P1_2 9 P1_1 10 DVDD2 DCOUPL 40 DVDD1 39 P1_6 38 P1_7 37 P2_0 36 P2_1 35 P2_2 34 P2_3/XOSC32K_Q2 33 P2_4/XOSC32K_Q1 32 AVDD6 31 C321 CC2530 DIE ATTACH PAD RBIAS 30 AVDD4 29 AVDD1 28 AVDD2 27 RF_N 26 RF_P 25 AVDD3 24 XOSC_Q2 23 XOSC_Q1 22 AVDD5 21 R301 C251 L252 C252 C261 L261 C262 Antenna (50 W) C253 11 P1_0 12 P0_7 13 P0_6 14 P0_5 15 P0_4 16 P0_3 17 P0_2 18 P0_1 19 P0_0 20 RESET_N Power Supply Decoupling Capacitors are Not Shown Digital I/O Not Connected C221 XTAL1 C231 Figure 19. CC2530 Application Circuit S0383-01 Table 3. Overview of External Components (Excluding Supply Decoupling Capacitors) Component C251 C261 L252 L261 C262 C252 C253 C331 C321 C231 C221 C401 Description Part of the RF matching network Part of the RF matching network Part of the RF matching network Part of the RF matching network Part of the RF matching network Part of the RF matching network Part of the RF matching network 32kHz xtal loading capacitor 32kHz xtal loading capacitor 32MHz xtal loading capacitor 32MHz xtal loading capacitor Decoupling capacitor for the internal digital regulator Value 18 pF 18 pF 2 nH 2 nH 1 pF 1 pF 2.2 pF 15 pF 15 pF 27 pF 27 pF 1 μF © 2009–2011, Texas Instruments Incorporated Submit Documentation Feedback 25 Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256 CC2530F32, CC2530F64 CC2530F128, CC2530F256 SWRS081B – APRIL 2009 – REVISED FEBRUARY 2011 www.ti.com Table 3. Overview of External Components (Excluding Supply Decoupling Capacitors) (continued) Component R301 Description Resistor used for internal biasing Value 56 kΩ Input/Output Matching When using an unbalanced antenna such as a monopole, a balun should be used to optimize performance. The balun can be implemented using low-cost discrete inductors and capacitors. The recommended balun shown consists of C262, L261, C252, and L252. If a balanced antenna such as a folded dipole is used, the balun can be omitted. Crystal An external 32-MHz crystal, XTAL1, with two loading capacitors (C221 and C231) is used for the 32-MHz crystal oscillator. See the 32-MHz Crystal Oscillator section for details. The load capacitance seen by the 32-MHz crystal is given by: CL = 1 1 1 + Cparasitic + C221 C231 (1) XTAL2 is an optional 32.768-kHz crystal, with two loading capacitors (C321 and C331) used for the 32.768-kHz crystal oscillator. The 32.768-kHz crystal oscillator is used in applications where both very low sleep-current consumption and accurate wake-up times are needed. The load capacitance seen by the 32.768-kHz crystal is given by: CL = 1 1 + 1 + Cparasitic C321 C331 (2) A series resistor may be used to comply with the ESR requirement. On-Chip 1.8-V Voltage-Regulator Decoupling The 1.8-V on-chip voltage regulator supplies the 1.8-V digital logic. This regulator requires a decoupling capacitor (C401) for stable operation. Power-Supply Decoupling and Filtering Proper power-supply decoupling must be used for optimum performance. The placement and size of the decoupling capacitors and the power supply filtering are very important to achieve the best performance in an application. TI provides a compact reference design that should be followed very closely. References 1. IEEE Std. 802.15.4-2006: Wireless Medium Access Control (MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs) http://standards.ieee.org/getieee802/download/802.15.4-2006.pdf 2. CC253x User's Guide – CC253x System-on-Chip Solution for 2.4 GHz IEEE 802.15.4 and ZigBee Applications (SWRU191) Additional Information Texas Instruments offers a wide selection of cost-effective, low-power RF solutions for proprietary and standard-based wireless applications for use in industrial and consumer applications. Our selection includes RF transceivers, RF transmitters, RF front ends, and System-on-Chips as well as various software solutions for the sub-1- and 2.4-GHz frequency bands. 26 Submit Documentation Feedback © 2009–2011, Texas Instruments Incorporated Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256 www.ti.com CC2530F32, CC2530F64 CC2530F128, CC2530F256 SWRS081B – APRIL 2009 – REVISED FEBRUARY 2011 In addition, Texas Instruments provides a large selection of support collateral such as development tools, technical documentation, reference designs, application expertise, customer support, third-party and university programs. The Low-Power RF E2E Online Community provides technical support forums, videos and blogs, and the chance to interact with fellow engineers from all over the world. With a broad selection of product solutions, end application possibilities, and a range of technical support, Texas Instruments offers the broadest low-power RF portfolio. We make RF easy! The following subsections point to where to find more information. Texas Instruments Low-Power RF Web Site Texas Instruments’ Low-Power RF Web site has all our latest products, application and design notes, FAQ section, news and events updates, and much more. Just go to www.ti.com/lprf. Low-Power RF Online Community • Forums, videos, and blogs • RF design help • E2E interaction Join us today at www.ti.com/lprf-forum. Texas Instruments Low-Power RF Developer Network Texas Instruments has launched an extensive network of low-power RF development partners to help customers speed up their application development. The network consists of recommended companies, RF consultants, and independent design houses that provide a series of hardware module products and design services, including: • RF circuit, low-power RF, and ZigBee design services • Low-power RF and ZigBee module solutions and development tools • RF certification services and RF circuit manufacturing Need help with modules, engineering services or development tools? Search the Low-Power RF Developer Network tool to find a suitable partner. www.ti.com/lprfnetwork Low-Power RF eNewsletter The Low-Power RF eNewsletter keeps you up-to-date on new products, news releases, developers’ news, and other news and events associated with low-power RF products from TI. The Low-Power RF eNewsletter articles include links to get more online information. Sign up today on www.ti.com/lprfnewsletter © 2009–2011, Texas Instruments Incorporated Submit Documentation Feedback 27 Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256 CC2530F32, CC2530F64 CC2530F128, CC2530F256 SWRS081B – APRIL 2009 – REVISED FEBRUARY 2011 REVISION HISTORY www.ti.com Changes from Revision A (November 2010) to Revision B Page • Changed recommendation for single-crystal implementations to asynchronous networks .................................................. 1 • Added op-amp and comparator to peripherals list ................................................................................................................ 1 • Revised block diagram ......................................................................................................................................................... 3 • Added number of erase cycles and page size for flash ........................................................................................................ 5 • Updated ESR for 32 kHz crystal ........................................................................................................................................... 8 • Updated voltage coefficient for temperature sensor ............................................................................................................. 9 • Added tables for op-amp and comparator to the Electrical Characteristics section ........................................................... 10 • Changed SPI AC characteristics SSN low from SCK negative edge to SCK positive edge and split into separate master and slave tables. ..................................................................................................................................................... 13 • Revised block diagram ....................................................................................................................................................... 19 • Corrected description of Timer 2 (MAC Timer) ................................................................................................................... 21 • Improved readability of sleep timer description. ................................................................................................................. 21 • Added the operational amplifier and the ultralow-power analog comparator paragraphs from the SWRS084 after The ADC supports... channels paragraph .................................................................................................................................. 21 • Removed sentence that pseudorandom data can be used for security ............................................................................. 21 28 Submit Documentation Feedback © 2009–2011, Texas Instruments Incorporated Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256 PACKAGE OPTION ADDENDUM www.ti.com 9-Sep-2014 PACKAGING INFORMATION Orderable Device CC2530F128RHAR CC2530F128RHAT CC2530F256RHAR CC2530F256RHAT CC2530F32RHAR CC2530F32RHAT CC2530F64RHAR CC2530F64RHAT Status Package Type Package Pins Package Eco Plan (1) Drawing Qty (2) ACTIVE VQFN RHA 40 2500 Green (RoHS & no Sb/Br) ACTIVE VQFN RHA 40 250 Green (RoHS & no Sb/Br) ACTIVE VQFN RHA 40 2500 Green (RoHS & no Sb/Br) ACTIVE VQFN RHA 40 250 Green (RoHS & no Sb/Br) ACTIVE VQFN RHA 40 2500 Green (RoHS & no Sb/Br) ACTIVE VQFN RHA 40 250 Green (RoHS & no Sb/Br) ACTIVE VQFN RHA 40 2500 Green (RoHS & no Sb/Br) ACTIVE VQFN RHA 40 250 Green (RoHS & no Sb/Br) Lead/Ball Finish (6) CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU MSL Peak Temp Op Temp (°C) (3) Level-3-260C-168 HR -40 to 125 Level-3-260C-168 HR -40 to 125 Level-3-260C-168 HR -40 to 125 Level-3-260C-168 HR -40 to 125 Level-3-260C-168 HR -40 to 125 Level-3-260C-168 HR -40 to 125 Level-3-260C-168 HR -40 to 125 Level-3-260C-168 HR -40 to 125 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. Device Marking (4/5) CC2530 F128 CC2530 F128 CC2530 F256 CC2530 F256 CC2530 F32 CC2530 F32 CC2530 F64 CC2530 F64 (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Samples Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 9-Sep-2014 (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. 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Addendum-Page 2 www.ti.com TAPE AND REEL INFORMATION PACKAGE MATERIALS INFORMATION 17-Apr-2015 *All dimensions are nominal Device Package Package Pins Type Drawing CC2530F256RHAR CC2530F256RHAT CC2530F32RHAR VQFN RHA 40 VQFN RHA 40 VQFN RHA 40 SPQ 2500 250 2500 Reel Reel A0 B0 K0 P1 W Pin1 Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1 (mm) 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q2 180.0 16.4 6.3 6.3 1.5 12.0 16.0 Q2 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q2 Pack Materials-Page 1 www.ti.com PACKAGE MATERIALS INFORMATION 17-Apr-2015 *All dimensions are nominal Device CC2530F256RHAR CC2530F256RHAT CC2530F32RHAR Package Type VQFN VQFN VQFN Package Drawing Pins RHA 40 RHA 40 RHA 40 SPQ 2500 250 2500 Length (mm) 336.6 213.0 336.6 Width (mm) 336.6 191.0 336.6 Height (mm) 28.6 55.0 28.6 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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