首页资源分类嵌入式系统 > 闪光灯驱动ic

闪光灯驱动ic

已有 445117个资源

下载专区

文档信息举报收藏

标    签:闪光灯驱动ic

分    享:

文档简介

闪光灯 驱动 ic ocp

文档预览

OCP8136 High Efficiency Dual Color Temperature Dimming Dual-1.2A Flash LED Driver With Separate 1-Wire Flash Dimming „ General Description The OCP8136 is a dual-channel 2MHz fixed frequency synchronous boost converter, optimized for maximum 2.4A(1.2A/channel) camera flash application and maximum 1000mA (500mA/channel) movie mode applications using high-current white LEDs in all single cell Li-ion powered products. An adaptive regulation method ensures the current for each LED remains in regulation and maximizes efficiency. The dual-channel flash LED drivers are independent. ENM1 and ENF1 pins control channel 1 flash LED driver; ENM2 and EMF2 pins control channel 2 flash LED driver. Two simple logic control inputs (ENM1/2 and ENF1/2) enable and disable flash and movie mode operation of the OCP8136. Movie-mode and Flash-mode current levels are independently fixed by two separate resistors (RSETM1/2 and RSETF1/2). For Flash mode, a default timer can be used either to terminate a flash event or as a safety flash timer. In flash mode, the flash LED current can be programmed in 16 steps by the 1-wire dimming interface at ENF pin. Two LEDs can be connected to the OCP8136. The OCP8136 integrate an input voltage monitor to monitor low battery conditions and can force the LED current into movie mode. Thermal regulation is integrated in Flash mode to limit the IC’s temperature and continuously provide the maximum allowed output current. The OCP8136 contain a thermal management system to protect the device; a internal over-voltage protection (OVP) circuitry prevents damaged to the OCP8136 from open LED or open circuit conditions; and a cycle-by-cycle current limit prevents damage to the OCP8136. Built-in circuitry prevents excessive inrush current during start-up. The shutdown feature reduces quiescent current to less than 1.0μA. The 2MHz switching frequency allow for the use of tiny, low profile (1uH or 2.2uH) inductors and 4.7uF ceramic capacitors. The device is available in 24-pin 4mmX4mm QFN package and is rated over the -40°C to 85°C. z Features z Input Voltage Range : 2.7V to 4.8V z Separate Two Channel Control z Drives up to 1.2A Regulated Output Current per Channel (Total 2.4A) z High Efficiency PWM Boost Converter z 2.0MHz Fixed Switching Frequency z Up to 97% Efficiency with Small Inductor 1uH z Integrated Soft-Start Eliminates Inrush Current z Under Voltage Lock-Out z Thermal management and Current Scale Back z VIN Battery Voltage Sensing z Optimize Flash Current During Low Battery z Over Voltage (Open LED) Protection z LED Short Circuit Protection z Movie Mode Dimming via Maximum 10KHz PWM Control z 800mS Flash Timer Control z Cycle by Cycle Current Limit z Separate Hardware Flash and Movie Enable z Flash Mode With 1-wire Dimming z Independently Set Flash/Movie Currents Flash Mode Current Up to 1.2A/channel Movie Mode Current Up to 500mA/channel z Two Resistors Set Flash and Movie Current Independently z Small Solution Size z Less than 1uA Shutdown Current z RoHS and Green Compliant z 24-pin, 4mm X 4mm QFN Packages z -40℃ to +85 ℃ Temperature Range z Applications z Camera Flashes and Movies z Cell Phones or Smart Phones z PDAs and Digital Camera z White LED Biasing z Mobil Handsets z Tablet PCs and Laptops/Netbooks z Camcorder Video Light (Movie Light) Page1 - 22 Ver. 1.0 Sept. 15, 2013 „ Pin Configuration QFN4040-24L (Top View) OCP8136 Figure 1, Pin Assignments of OCP8136 „ Typical Application Circuit Mov ie Enable Flash Enable RF2 6.8K PGND2 12 11 VIN2 ENF2 10 ENM2 9 GND2 8 RSETF2 7 VIN2(2.7V-4.8V) L2 1uH VIN CIN2 4.7uF OUT2 VIN1(2.7V-4.8V) L1 1uH VIN CIN1 4.7uF 13 NC 14 SW2 15 OUT2 16 VIN1 17 PGND1 18 SW1 OCP8136 6 RSETM2 LED2 5 RSETF1 4 RSETM1 3 LED1 2 NC 1 RM2 34K RF1 6.8K RM1 34K U1 D2 LED D1 LED OUT2 COUT2 4.7uF OUT1 COUT1 4.7uF 19 NC 20 OUT1 21 ENF1 22 ENM1 23 GND1 24 NC Flash Enable Mov ie Enable OUT1 Figure 2A, Typical Application Circuit of OCP8136 Page2 - 22 Ver. 1.0 Sept. 15, 2013 OCP8136 „ Pin Configuration Pin Name Pin No. I/O QFN4040-24L Pin Function LED1 2 O Channel 1 flash LED pin. Connect cathode of a flash LED to GND1. RSETM1 3 I/O Channel 1 Movie mode current setting input. A 34kΩ resistor from RSETM1 to GND1 sets the desired movie current available at LED1 up to 200mA current. RSETF1 4 I/O Channel 1 Flash mode current setting input. A 6.8kΩ resistor from RSETF1 to GND1 sets the maximum flash current available at LED1 up to 1.0A current. LED2 5 O Channel 2 flash LED pin. Connect cathode of a flash LED to GND2. RSETM2 6 I/O Channel 2 Movie mode current setting input. A 34kΩ resistor from RSETM2 to GND2 sets the desired movie current available at LED2 up to 200mA current. RSETF2 7 I/O Channel 2 Flash mode current setting input. A 6.8kΩ resistor from RSETF2 to GND2 sets the maximum flash current available at LED2 up to 1.0A current. GND2 8 P Channel 2 Analog Ground and flash ground. Channel 2 Movie mode enable pin. A low to high transition on the ENM2 pin ENM2 9 I initiates movie mode current level set by RSETM2 resistor. ENM2 is a active high control input with a internal 300kΩ resistance to GND2. Channel 2 Flash mode 1-wire dimming interface pin. A low to high transition on ENF2 10 I the ENF2 pin initiates flash mode current level set by RSETF2 resistor. ENF2 is a active high control input with a internal 300kΩ resistance to GND2. VIN2 11 P Channel 2 Power input. Connect VIN2 to the input power supply voltage. Connect a 4.7uF ceramic capacitor from VIN2 to GND2 as close as possible. PGND2 12 P Channel 2 Boost power ground pin. Connect PGND2 to GND2 at a single point as close as possible to OCP8136. SW2 14 O Channel 2 drain for internal NMOS and Synchronous PMOS Switches. Channel 2 Power output of the boost converter. Connect a 4.7uF ceramic OUT2 15 O capacitor from OUT2 to PGND2 as close as possible to the OCP8136. Connect OUT2 to the anodes of the Flash LEDs. VIN1 16 P Channel 1 Power input. Connect VIN1 to the input power supply voltage. Connect a 4.7uF ceramic capacitor from VIN1 to GND1 as close as possible. PGND1 17 P Channel 1 Boost power ground pin. Connect PGND1 to GND1 at a single point as close as possible to OCP8136. SW1 18 O Channel 1 drain for internal NMOS and Synchronous PMOS Switches. Channel 1 Power output of the boost converter. Connect a 4.7uF ceramic OUT1 20 O capacitor from OUT1 to PGND1 as close as possible to the OCP8136. Connect OUT1 to the anodes of the Flash LEDs. Channel 1 Flash mode 1-wire dimming interface pin. A low to high transition on ENF1 21 I the ENF1 pin initiates flash mode current level set by RSETF1 resistor. ENF1 is a active high control input with a internal 300kΩ resistance to GND1. Channel 1 Movie mode enable pin. A low to high transition on the ENM1 pin ENM1 22 I initiates movie mode current level set by RSETM1 resistor. ENM1 is a active high control input with a internal 300kΩ resistance to GND1. GND1 23 P Channel 1 Analog Ground and flash ground. NC 1, 13, 19, 24 - Not Connected. GND EP P Exposed paddle (bottom). Connect EP to PGND as close as possible. Page3 - 22 Ver. 1.0 Sept. 15, 2013 „ Block Diagram OCP8136 Figure 3, Block Diagram of OCP8136 „ Absolute Maximum Ratings1 (TA=25°C, unless otherwise noted) Parameter Symbol Rating Unit VIN1/2 Pin to GND1/2 VIN -0.3 to +6.0 V All Other Pins to GND1/2 -0.3 to VIN + 0.3 V Storage Temperature Range TS -55 to +150 ℃ Operating Junction Temperature Range TJ -40 to +150 ℃ Maximum Soldering Temperature (at leads, 10 sec) TLEAD 300 ℃ „ Recommended Operating Conditions2 Parameter Symbol Rating Unit VIN1/2 Pin Voltage to GND1/2 VIN +2.7 to +4.8 V Flash LED1/2 Current IFLASH Up to 1200 mA Movie LED1/2 Current Operating Temperature Range Maximum Thermal Resistance QFN4040-24L IMOVIE TOP ΘJA Up to 500 -40 to +85 39 mA ℃ ℃/W Maximum Power Dissipation TA<25°C PD 3.0 W Note: 1: Stresses above those listed in absolute maximum ratings may cause permanent damage to the device. Functional operation at conditions other than the operating conditions specified is not implied. Only one absolute maximum rating should be applied at any one time. 2: The device is not guaranteed to function outside of its operating conditions. Page4 - 22 Ver. 1.0 Sept. 15, 2013 OCP8136 „ Electrical Characteristics (TA = -40 to +85℃ unless otherwise noted. Typical values are at TA = +25℃, VIN = VEN = 3.6V, CIN=COUT=4.7uF, L=1.0uH, RRF=6.8kΩ, RRM=34kΩ) Symbol Parameter Conditions Min. Typ. Max. Unit VIN1 or VIN2 Supply VIN Input Voltage IQ Supply Current (non switching) Supply Current (switching) ISHDN Supply Current Shutdown VUV VIN Under Voltage Lockout VUVLO Under Voltage Lockout Hysteresis VIN TH VIN Monitor Threshold TST Soft Start Time Boost DC-DC Converter (Channel 1 or 2) VOUT = 3.0V VOUT = 4.5V VENM = VENF = 0V VIN Rising 2.7 - 4.8 V - 1.2 2.5 mA - 2.0 3.5 mA - 0.1 1 μA - 2.50 2.70 V - 150 mV 3.16 3.3 3.44 V - 100 - uS RNMOS RPMOS ICL FSW DMAX TTF TTM VOVP NMOS Switch On-Resistance PMOS Switch On-Resistance Switch Current Limit Switching Frequency Maximum Duty Cycle Movie to Flash Current Settling Time Flash to Movie Current Settling Time Ouput Over Voltage Protection Output Over Voltage Hystersis INMOS=1A IPMOS=1A 3.0V < VIN < 4.2V 3.0V < VIN < 4.2V - 120 - mΩ - 120 - mΩ 3.0 3.5 4.0 A 1.8 2.0 2.2 MHz 65 75 - % - 100 - uS - 2 - uS - 5.0 - V - 0.2 - V η1 Boost Output Efficiency η2 LED Efficiency LED1/2 Current Sink IFLASH = 1.0A ILED = 400mA - 97 - % - 85 - % IFLASH Maximum Flash Current IMOVIE Maximum Movie Current ILED ACC Current Sink Current Accuracy VLED Current Sink Saturation Voltage TCT Maximum Flash ON Time ENM1/2 and ENF1/2 Enable Specifications RRF=6.8kΩ RRM=17kΩ ILED1=ILED2=1.0A ILED1=ILED2=1.0A 0.9 1.0 1.1 A 370 400 430 mA -5 1 5 % - 350 - mV 0.6 0.8 1.0 S VENL VENH REN TENM_ON EN OFF Threshold EN ON Threshold EN Pin Pull-down Resistor Movie Mode ON Delay Time VEN Falling VEN Rising 0 - 0.4 V 1.4 - VIN V 200 300 400 kΩ - 30 - uS TENM_OFF Movie Mode OFF Delay Time - 2 - uS TENF_ON Flash Mode ON Delay Time - 100 - uS TENF_OFF Flash Mode OFF Delay Time - 2 - uS ENF1/2 1-Wire Dimming THI_MIN Minimum logic high pulse width timing, ENF 0.2 - - uS TLO Minimum logic low pulse width timing, ENF 0.2 - 150 uS TOFF Minimum shutdown pulse width timing, ENF - - 600 uS Thermal Shutdown TTH Thermal Shutdown THS Thermal Shutdown Hysteresis - 150 - ℃ - 25 - ℃ Page5 - 22 Ver. 1.0 Sept. 15, 2013 OCP8136 „ Typical Characteristics—OCP8136 (Unless otherwise noted, VIN = VEN = 3.6V, CIN=COUT=4.7uF, L=1.0uH, RRF=6.8kΩ, RRM=34kΩ) Flash Mode LED Efficiency vs. Input Voltage Flash Mode Efficiency vs. Input Voltage (ILED1= ILED1=1.0A) (ILED1= ILED1=1.0A) Flash Mode Efficiency Vs. Input Voltage 100% Flash Mode Efficiency Vs. Input Voltage 100% 90% 90% 80% 80% Efficiency (%) Efficiency (%) 70% 70% 60% 60% 50% 50% 40% 40% 30% 30% 20% 20% 10% ILED1=ILED2=1.0A,Load Efficiency 0% 10% ILED1=ILED2=1.0A,Output Efficiency 0% 3.3 3.5 3.7 3.9 4.1 4.3 4.5 4.7 4.9 Input Voltage(V) 3.3 3.5 3.7 3.9 4.1 4.3 4.5 4.7 4.9 Input Voltage(V) Efficiency (%) Movie Mode LED Efficiency vs. Input Voltage (ILED1= ILED1=200mA) Moive Mode Efficiency Vs. Input Voltage 100% 90% 80% 70% 60% 50% 40% 30% 20% 10% ILED1=ILED2=200mA,Load Efficiency 0% Efficiency (%) Movie Mode Efficiency vs. Input Voltage (ILED1= ILED1=200mA) 100% Moive Mode Efficiency Vs. Input Voltage 95% 90% 85% 80% 75% 70% 65% 60% 55% ILED1=ILED2=200mA,Out Efficiency 50% 2.7 2.9 3.1 3.3 3.5 3.7 3.9 4.1 4.3 4.5 4.7 4.9 2.7 2.9 3.1 3.3 3.5 3.7 3.9 4.1 4.3 4.5 4.7 4.9 Input Voltage(V) Flash Mode LED Current vs. Input Voltage (ILED1= ILED1=1.0A) Input Voltage(V) Movie Mode LED Current vs. Input Voltage (ILED1= ILED1=0.2A) Flash Mode LED Current Vs. Input Voltage 2.0 1.8 Moive Mode LED Current Vs. Input Voltage 0.40 0.36 1.6 0.32 1.4 0.28 LED Current (A) LED Current (A) 1.2 0.24 1.0 0.20 0.8 0.16 0.6 0.12 0.4 0.08 0.2 0.0 ILED1 Output Current ILED2 Output Current 0.04 0.00 ILED1 Output Current ILED2 Output Current 3.3 3.5 3.7 3.9 4.1 4.3 4.5 4.7 4.9 2.7 2.9 3.1 3.3 3.5 3.7 3.9 4.1 4.3 4.5 4.7 4.9 Input Voltage(V) Input Voltage(V) Page6 - 22 Ver. 1.0 Sept. 15, 2013 OCP8136 „ Typical Characteristics—OCP8136 (Unless otherwise noted, VIN = VEN = 3.6V, CIN=COUT=4.7uF, L=1.0uH, RRF=6.8kΩ, RRM=34kΩ) Flash Mode Battery Current vs. Input Voltage Movie Mode Battery Current vs. Input Voltage (ILED1= ILED1=1.0A) (ILED1= ILED1=0.2A) Flash Mode Battery Current Vs. Input Voltage 3.0 Movie Mode Battery Current Vs. Input Voltage 1.00 2.8 0.90 LED Current (A) Battery Current (A) 2.6 0.80 2.4 0.70 2.2 0.60 2.0 0.50 1.8 0.40 1.6 0.30 1.4 0.20 1.2 ILED1=ILED2=1.0A,Input Current 1.0 0.10 ILED1=ILED2=200mA,Input Current 0.00 3.3 3.5 3.7 3.9 4.1 4.3 4.5 4.7 4.9 2.7 2.9 3.1 3.3 3.5 3.7 3.9 4.1 4.3 4.5 4.7 4.9 Input Voltage(V) Input Voltage(V) Flash Current Setting Voltage vs. Temperature Flash Current vs. Temperature Flash Current Setting Voltage(V) Flash Current Setting Voltage Vs. Temperature 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 VIN=3.0V 0.1 VIN=3.6V VIN=4.2V 0.0 ‐40℃ ‐20℃ 0℃ 25℃ 50℃ 85℃ 110℃ 120℃ 140℃ Temperature(℃) LED Short-circuit Current Limit vs. Input Voltage Flash Current (A) Flash Current Vs. Temperature 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 VIN=3.6V ILED1=ILED2 0.0 Temperature(℃) Under-Voltage Lock-out vs. Temperature Output Short‐Current Limit(mA) Output Short‐Current Limit Vs. Input Voltage 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 OUT AND LED1‐ Short‐Current 0.5 OUT AND LED2‐ Short‐Current 0.0 2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5 Input Voltage(V) Under‐Voltage Lock‐out(V) Under‐Voltage Lock‐out Vs. Temperature 3.0 2.9 2.8 2.7 2.6 2.5 2.4 2.3 2.2 Start‐Voltage 2.1 Under‐Voltage Lock‐out 2.0 ‐40℃ ‐20℃ 0℃ 25℃ 50℃ 85℃ Temperature(℃) Page7 - 22 Ver. 1.0 Sept. 15, 2013 OCP8136 „ Typical Characteristics—OCP8136 (Unless otherwise noted, VIN = VEN = 3.6V, CIN=COUT=4.7uF, L=1.0uH, RRF=6.8kΩ, RRM=34kΩ) Switch Operation Frequency vs. Input Voltage Switch Operation Frequency vs. Temperature (Temp=-40℃, 25℃, 85℃) (VIN=3.0/3.6/4.2V) Operation Frequency(MHz) Operation Frequency Vs. Input Voltage 2.5 2.4 2.3 2.2 2.1 2.0 1.9 1.8 1.7 1.6 ‐40℃ 25℃ 85℃ 1.5 Operation Frequency(MHz) Operation Frequency Vs.Temperature 2.5 2.4 2.3 2.2 2.1 2.0 1.9 1.8 1.7 VIN=3.0V 1.6 VIN=3.6V 1.5 2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5 Input Voltage(V) Over-Voltage Protection vs. Input Voltage (Temp=-40℃, 25℃, 85℃) ‐40℃ ‐20℃ 0℃ 25℃ 50℃ 85℃ Temperature(℃) Over-Voltage Protection vs. Temperature (VIN=3.0/3.6/4.2V) Over‐Voltage Protection(V) Over‐Voltage Protection Vs. Input Voltage 5.4 5.3 5.2 5.1 5.0 4.9 4.8 4.7 ‐40℃ 4.6 25℃ 4.5 85℃ 4.4 2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5 Input Voltage(V) Flash ON Delay Time vs. ENF1/2 1-wire Dimming (Temp=25℃) Over‐Voltage Protection(V) Over‐Voltage Protection Vs. Temperature 5.4 5.3 5.2 5.1 5.0 4.9 4.8 4.7 VIN=3.0V 4.6 VIN=3.6V 4.5 VIN=4.2V 4.4 ‐40℃ ‐20℃ 0℃ 25℃ 50℃ 85℃ Temperature(℃) VIN Monitor Threshold vs. Temperature Flash On Delay Time(uS) Flash On Delay Time vs. ENF 1‐wire Dimming 200 180 160 140 120 100 80 60 40 20 VIN=3.6V 0 0 2 4 6 8 10 12 14 16 ENF Pin 1‐wire Dimming(steps) VIN Monitor Threshold(V) VIN Monitor Threshold vs. Temperature 4.5 4.3 4.1 3.9 3.7 3.5 3.3 3.1 2.9 2.7 2.5 ‐40℃ ‐20℃ 0℃ 25℃ 50℃ 85℃ Temperature(℃) Page8 - 22 Ver. 1.0 Sept. 15, 2013 OCP8136 „ Typical Characteristics—OCP8136 (Unless otherwise noted, VIN = VEN = 3.6V, CIN=COUT=4.7uF, L=1.0uH, RRF=6.8kΩ, RRM=34kΩ) Flash Settling Current vs. Flash Settling Resistance Movie Settling Current vs. Movie Settling Resistance Flash Setting Current(mA) 1500 1350 1200 1050 900 750 600 450 300 150 0 Flash Setting Current Vs. Flash Setting Resistance LED1 LED2 0 10 20 30 40 50 60 70 80 90 100 Flash Setting Resistance(KΩ) Quiescent Current (No Switching) vs. Input Voltage (Temp=-40℃, 25℃, 85℃) Queiscent Current(No Switching) (mA) Queiscent Current(No Switching) Vs. Input Voltage 1.60 1.52 1.44 1.36 1.28 1.20 1.12 1.04 0.96 ‐40℃ 25℃ 0.88 85℃ 0.80 2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5 Input Voltage(V) Quiescent Current (No Switching) vs. Temperature (VIN=3.0/3.6/4.2V) Queiscent Current(No Switching) Vs. Temperature 1.60 Queiscent Current(No Switching) (mA) 1.52 1.44 1.36 1.28 1.20 1.12 1.04 VIN=3.0V 0.96 VIN=3.6V 0.88 VIN=4.2V 0.80 ‐40℃ ‐20℃ 0℃ 25℃ 50℃ 85℃ Temperature(℃) Queiscent Current(Switching)(mA) Queiscent Current(Switching)(mA) Movie Setting Current(mA) 1000 900 800 700 600 500 400 300 200 100 0 Movie Setting Current Vs. Setting Resistance LED1 LED2 0 10 20 30 40 50 60 70 80 90 100 Movie Setting Resistance(KΩ) Quiescent Current (Switching) vs. Input Voltage (Temp=-40℃, 25℃, 85℃) Queiscent Current(Switching) Vs. Input Voltage 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 ‐40℃ 25℃ 0.5 85℃ 0.0 2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5 Input Voltage(V) Quiescent Current (Switching) vs. Input Voltage (VIN=3.0/3.6/4.2V) Queiscent Current(Switching) Vs. Temperature 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 VIN=3.0V 1.0 VIN=3.6V 0.5 VIN=4.2V 0.0 ‐40℃ ‐20℃ 0℃ 25℃ 50℃ 85℃ Temperature(℃) Page9 - 22 Ver. 1.0 Sept. 15, 2013 OCP8136 „ Typical Characteristics—OCP8136 (Unless otherwise noted, VIN = VEN = 3.6V, CIN=COUT=4.7uF, L=1.0uH, RRF=6.8kΩ, RRM=34kΩ) Enable High Threshold vs. Input Voltage Enable Low Threshold vs. Input Voltage (Temp=-40℃, 25℃, 85℃) (Temp=-40℃, 25℃, 85℃) Enable High Threshold(V) Enable High Threshold Vs. Input Voltage 1.4 1.3 1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 ‐40℃ 0.4 25℃ 0.3 0.2 85℃ 2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5 Input Voltage(V) Flash Timeout Time vs. Input Voltage (Temp=-40℃, 25℃, 85℃) Flash Timeout Time Vs. Input Voltage 1.00 0.96 ‐40℃ 0.92 25℃ 85℃ 0.88 0.84 0.80 0.76 0.72 0.68 0.64 0.60 3.3 3.5 3.7 3.9 4.1 4.3 4.5 4.7 4.9 Input Voltage(V) Movie Current vs. ENM Pin PWM Duty Cycle (FPWM=100Hz, 500Hz, 1kHz, 5kHz, 10kHz) Movie Current Vs. ENM Pin PWM Duty Cycle 400 360 Flash Timeout Time(S) Enable Low Threshold (V) Enable Low Threshold Vs. Input Voltage 1.4 1.3 1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 ‐40℃ 0.4 25℃ 0.3 0.2 85℃ 2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5 Input Voltage(V) Flash Timeout Time vs. Temperature (VIN=3.0/3.6/4.2V) Flash Timeout Time vs. ENF Pin 1‐wire Dimming 1.00 0.96 VIN=3.6V 0.92 VIN=4.2V 0.88 VIN=4.8V 0.84 0.80 0.76 0.72 0.68 0.64 0.60 0 2 4 6 8 10 12 14 16 ENF Pin 1‐wire Dimming(steps) Flash Current vs. ENF 1-wire Dimming (VIN=3.6/4.2/4.8V) FLASH Current vs. ENF Pin 1‐wire Dimming 2.0 1.8 Flash Timeout Time(S) FLASH Current(A) Movie Current(mA) 320 1.6 280 1.4 240 1.2 200 1.0 160 100Hz 0.8 500Hz 120 80 1KHz 0.6 5KHz 0.4 VIN=3.6V VIN=4.2V 40 10KHz 0.2 VIN=4.8V 0 0.0 0% 10%20%30%40%50%60%70%80%90%100% 0 2 4 6 8 10 12 14 16 ENM Pin PWM Duty Cycle(%) ENF Pin 1‐wire Dimming(steps) Page10 - 22 Ver. 1.0 Sept. 15, 2013 OCP8136 „ Typical Characteristics—OCP8136 (Unless otherwise noted, VIN = VEN = 3.6V, CIN=COUT=4.7uF, L=1.0uH, RRF=6.8kΩ, RRM=34kΩ) Movie to Flash Mode Current Response Waveform LED Current for Movie ON Waveform (CH1=VENM, CH2=VSW, CH3=VOUT, CH4=ILED) (CH1=VENM, CH2=VSW, CH3=VOUT, CH4=ILED) LED Current for Flash Off Waveform (CH1=VENM, CH2=VENF, CH3=VSW, CH4=ILED) LED Current for Flash ON Waveform (CH1=VENF, CH2=VSW, CH3=VOUT, CH4=ILED) LED Current for Flash Off Waveform (CH1=VENM, CH2=VENF, CH3=VSW, CH4=ILED) Flash Timeout Time Waveform (CH1=VENM, CH2=VENF, CH3= VSW, CH4=ILED) Page11 - 22 Ver. 1.0 Sept. 15, 2013 OCP8136 „ Typical Characteristics—OCP8136 (Unless otherwise noted, VIN = VEN = 3.6V, CIN=COUT=4.7uF, L=1.0uH, RRF=6.8kΩ, RRM=34kΩ) Movie Mode Switch Ripple Waveform Flash Mode Switch Ripple Waveform (CH1=VIN, CH2=VSW, CH3=VOUT, CH4=ILED) (CH1=VIN, CH2=VSW, CH3=VOUT, CH4=ILED) Open-LED Protection Waveform (CH1=VSW, CH2=VOUT, CH4=ILED) Short-LED Protection Waveform (CH1=VSW, CH2=VOUT, CH4=ILED) VIN Monitor Waveform (CH1=VIN, CH2=VENF, CH3=VSW, CH4=ILED) Multi-Byte Program Waveform Page12 - 22 Ver. 1.0 Sept. 15, 2013 OCP8136 „ Functional Description The OCP8136 is a dual-channel 2MHz fixed frequency synchronous boost converter, optimized for maximum 2.4A(1.2A/channel) camera flash application and maximum 1000mA (500mA/channel) movie mode applications using high-current white LEDs in all single cell Li-ion powered products. An adaptive regulation method ensures the current for each LED remains in regulation and maximizes efficiency. The dual-channel flash LED drivers are independent. ENM1 and ENF1 pins control channel 1 flash LED driver; ENM2 and EMF2 pins control channel 2 flash LED driver. During operation when the output voltage is greater than VIN1/2–150mV, the boost converter switches and maintains at least 300mV across both current sink (LED1 and LED2). This minimum headroom voltage ensures that the current sink remain in regulation. When the input voltage rises above the LED1/2 voltage + current sink headroom voltage, the device stops switching and turns the PMOS on continuously (Pass Mode). In pass mode the difference between (VIN1/2 – ILED1/2 X RONP) and the voltage across the LED’s is dropped across the current sink. The maximum flash current is set by an external resistor RSETF1/2. The flash timer will terminate the flash current regardless of the status of the ENF1/2 pin. This can be either used as a simple flash timing pulse or can be used as safety timer in the event of control logic malfunction to prevent the LED1/2 from overheating. The movie mode current is set by an external resistor RSETM1/2. Channel current outputs in movie mode operate in the same manner as they do in flash mode. The flash timer function is disabled in movie mode to permit constant LED illumination. The ENM1/2 signal takes priority over movie-mode operation. Two simple logic control inputs (ENM1/2 and ENF1/2) enable and disable flash and movie mode operation of the OCP8136. Movie-mode and Flash-mode current levels are independently fixed by two separate resistors (RSETM1/2 and RSETF1/2). For Flash mode, a default timer can be used either to terminate a flash event or as a safety flash timer. In flash mode, the flash LED1/2 current can be programmed in 16 steps by the 1-wire dimming interface at ENF1/2 pin. One or two LEDs can be connected to the OCP8136; in the case of two LEDs the output current is matched between each diode. The OCP8136 integrate an input voltage monitor to monitor low battery conditions and can force the LED current into movie mode. The OCP8136 contain a thermal management system to protect the device; a internal over-voltage protection (OVP) circuitry prevents damaged to the OCP8136 from open LED or open circuit conditions; and a cycle-by-cycle current limit prevents damage to the OCP8136. Built-in circuitry prevents excessive inrush current during start-up. The shutdown feature reduces quiescent current to less than 1.0μA. The 2MHz switching frequency allow for the use of tiny, low profile (1uH or 2.2uH) inductors and 4.7uF ceramic capacitors. Pass Mode On turn-on when output voltage charges up to (VIN1/2 -150mV), the OCP8136 will decide if the part operates in Pass Mode or Boost Mode. If the voltage difference between VOUT1/2 and VLED1/2 is less than 300mV, the device operates in Boost Mode. If the difference between VOUT1/2 and VLED1/2 is greater than 300mV, the device operates in Pass Mode. In Pass Mode the boost converter stops switching and the synchronous PMOS turns fully on bringing VOUT1/2 up to (VIN1/2 – ILED1/2 X RONP). In pass mode the inductor current is not limited by the peak current limit. In this situation the output current must be limited to 2.0A. Over-Voltage Protection (Open-LED Protection) The output voltage is limited to typically 5.0V. In situations such as the current source open, the OCP8136 will raise the output voltage to try to keep the LED1/2 current at its target value. When VOUT1/2 reaches 5.0V the over-voltage comparator will trip and turn off both the internal NMOS and PMOS. When VOUT1/2 falls below 4.8V (typical), the OCP8136 will begin switching again. When the output reaches 5.0V, the OCP8136 automatically changes to light load mode operation to maintain output regulation at light load or no load condition. This is the discontinuous mode operation, and is normal behavior for a switching regulator. At this point, the LEDs are ready to be flashed. Auto-Disable Feature (Short-LED Protection) The OCP8136 is equipped with an auto-disable feature for each LED channel. After the IC is enabled and started up, a test current of 2mA (typical) is forced through each sink channel. The channel will be disabled if the voltage of that particular sink pin does not drop to a certain threshold. This feature is very convenient for disabling an unused channel or during an LED fail-short event. This small test current should be added to the set output current in both flash and movie mode conditions. Under-Voltage Lockout The OCP8136 contains under-voltage-lockout (UVLO) circuitry that disables the IC until VIN is greater than 2.50V. Page13 - 22 Ver. 1.0 Sept. 15, 2013 OCP8136 MOSFET Current Limit The OCP8136 features current limit of 3.5A. When the current limit is reached, the OCP8136 stops switching for the remainder of the switching cycle. Since the 3.5A current limit is sensed in the NMOS switch there is no mechanism to limit the current when the device operates in Pass Mode. In situations where there could potentially be large load currents at OUT1/2, and the OCP8136 is operating in Pass Mode, the load current must be limited to 2A. Flash Mode Operation By strobing the ENF1/2 input pin low-to-high, a flash pulse and the internal timer are initiated. The maximum flash current in the OCP8136 is set by an external resistor, RSETF1/2. The flash timer will terminate the flash current regardless of the status of the ENF1/2 pin. This can be either used as a simple flash timing pulse or can be used as a safety timer in the event of a control logic malfunction to prevent the LED1/2 from overheating. FLASH Timeout Protection: Due to the high currents typically available in Flash mode, it is necessary to protect the white LED from damage if left on too long. The OCP8136 has a timeout in Flash mode of about 0.6 seconds to 1.0 seconds after which it will shut down operation. Operation will not begin again in Flash mode until the ENM1/2 pin low and Flash pin have been set Low and then High again. Movie Mode Operation The movie mode is enabled when the ENM1/2 input pin transitions from low to high and will remain on until input is pulled back to a low logic level. The movie-mode current level is set by an external resistor connected between RSETM1/2 and GND1/2. Channel current outputs (LED1 and LED2) in movie mode operate in the same manner as they do in flash mode, only at a current level as set by the RSETM1/2 resistor. The flash timer function is disabled in movie mode to permit constant LED illumination. The ENF1/2 signal takes priority over movie-mode operation. If both ENM1/2 and ENF1/2 are high, the LED1/2 current will be set to movie-mode current. Table 1: Mode Truth Table ENM1/2 0 0 1 1 ENF1/2 0 1 0 1 Status Shut Down Flash Mode Movie Mode Movie Mode Over Temperature Protection Thermal protection disables the OCP8136 when internal power dissipation becomes excessive, as it disables both MOSFETs. The junction over-temperature threshold is 150°C with 25°C of temperature hysteresis. The output voltage automatically recovers when the over-temperature fault condition is removed. Intelligent Temperature Control In flash mode, intelligent temperature control is achieved by increasing chip temperature in the rang of approximately 110°C to 150°C, when the internal temp. reach 110°C, the flash setting current start to decrease; when temp. reach 150°C, the flash current decrease to zero. Figure 4, Intelligent Temperature Control Page14 - 22 Ver. 1.0 Sept. 15, 2013 OCP8136 Input Voltage Monitor The OCP8136 has an internal comparator at IN which monitors the input voltage and can force the LED1/2 current into Movie mode if VIN1/2 falls below the VIN1/2 Monitor Threshold of 3.3V (typical). When VIN1/2 falls below the VIN1/2 Monitor threshold, the LEDs will be forced into the Movie current setting. To reset the LED1/2 current to its previous level, VIN1/2 must go above the VIN1/2 Monitor threshold. To avoid noise from falsely triggering the VIN Monitor, this mode incorporates a 250μs de-glitch timer. With the VIN1/2 Monitor active, VIN1/2 must go below the VIN1/2 Monitor Threshold (VIN_TH), and remain below it, for 250μs before the LEDs are forced into Movie mode. Figure 5, VIN Monitor Waveform 1-wire Dimming Control The ENF1/2 pin of OCP8136 has integrated a 1-wire dimming control logic circuit, which is designed for maximum design flexibility and compatibility with various types of system controls. The flash current interface accepts a series of pulses into the ENF1/2 pin to program the output current, from 1/16 to 16/16 of the maximum flash current. The number of rising edges is detected internally and decoded as illustrated in Table 2 (Flash Current Setting Table). Using the simplest control method, output current can be turned on and off between 1/16 of IFLASH_MAX and 0mA, by pulling the ENF1/2 pin high or low, while ENM1/2 is low. The next level of control is achieved by injecting a series of pulses into the ENF1/2 pin to program the sink current at 16 levels. When the ENF1/2 is pulled high while the ENM1/2 is low, the LED1/2 current will be ramped up to the flash-mode current level (1/16 to 16/16 of the maximum flash current) which is programmed by RSETF1/2 resistor and the number of pulses on ENF1/2. About ENF1/2 pulse dimming timing, please see figure 7. Table 2: Flash Current Setting Table DATA I_Dx(mA) DATA I_Dx(mA) 1 1/16* IFLASH MAX 9 2 2/16* IFLASH MAX 10 3 3/16* IFLASH MAX 11 4 4/16* IFLASH_MAX 12 9/16* IFLASH MAX 10/16* IFLASH MAX 11/16* IFLASH MAX 12/16* IFLASH_MAX 5 5/16* IFLASH_MAX 13 13/16* IFLASH_MAX 6 6/16* IFLASH_MAX 14 14/16* IFLASH_MAX 7 7/16* IFLASH_MAX 15 15/16* IFLASH_MAX 8 8/16* IFLASH_MAX 16 16/16* IFLASH_MAX Page15 - 22 Ver. 1.0 Sept. 15, 2013 OCP8136 „ Application Information Typical Application Circuits Mov ie Enable Flash Enable RF2 6.8K PGND2 12 VIN2 11 ENF2 10 9 ENM2 GND2 8 RSETF2 7 VIN2(2.7V-4.8V) L2 1uH VIN CIN2 4.7uF OUT2 VIN1(2.7V-4.8V) L1 1uH VIN CIN1 4.7uF 13 NC 14 SW2 15 OUT2 16 VIN1 17 PGND1 18 SW1 OCP8136 RSETM2 6 LED2 5 RSETF1 4 RSETM1 3 2 LED1 NC 1 RM2 34K RF1 6.8K RM1 34K U1 D2 LED D1 LED OUT2 COUT2 4.7uF OUT1 COUT1 4.7uF 19 NC 20 OUT1 21 ENF1 22 ENM1 23 GND1 24 NC Flash Enable Mov ie Enable OUT1 Figure 6, Typical Application Circuit of OCP8136 Flash Disable In mobile GSM systems where the phone remains in constant contact with the base station by regular communication, ENF1/2 should been pulled down to prevent both the camera flash and PA transmission pulses from occurring simultaneously. This avoids potential dips to the Li-ion battery voltage below the system’s under-voltage lockout threshold (UVLO). Flash LED Connection The OCP8136 supports up to two 1.2A Flash WLEDs. The two LEDs are connected from OUT1/2 pin to LED1/2 pins respectively. LED Selection The OCP8136 is specifically designed to drive ultra bright flash LEDs with typical forward voltage of 2.5V to 4.2V within 1.2A forward current. Movie Mode LED Current The movie mode is enabled when the ENM1/2 input pin transitions from low to high and will remain on until input is pulled back to a low logic level. The movie-mode current level is set by an external resistor connected between RSETM1/2 and GND1/2. Channel current outputs (LED1 and LED2) in movie mode operate in the same manner as they do in flash mode, only at a current level as set by the RSETM1/2 resistor. The flash timer function is disabled in movie mode to permit constant LED illumination. The ENF1/2 signal takes priority over movie-mode operation. The OCP8136 movie mode current settling can be programmable by the external resistor RSETM1/2: I MOVIE ( LED1) = I MOVIE ( LED 2) = 6800 RRSETM 1/ 2 Flash Mode LED Current LED1 and LED2 can be programmed up to a maximum total flash current of 2.4A or up to 1.2A per channel. The output currents in LED1 and LED2 are equal. The maximum flash current in each LED1 and LED2 is set by the RSETF1/2 resistor. For the desired flash current in each output, the resistor value can be calculated using the following equation: Page16 - 22 Ver. 1.0 Sept. 15, 2013 OCP8136 I = I = R 6800 FLASH (LED1) _ MAX FLASH ( LED 2) _ MAX RSETF 1 / 2 Once the maximum current is set, the flash current can be programmed through 1-wire control on ENF1/2 pin as following describe. Please see figure 7. Figure 7, LED1/2 Flash Brightness Control by Pulse Dimming With the minimum spec of 200ns for TLO and THI, the OCP8153 can interface with a signal as fast as 2.5MHz on ENF1/2 pin. The maximum spec for TLO is 150uS. Assuming a 50% duty cycle signal, the slowest control the OCP8153 flash current can react to is 3.33kHz. There are two ways to adjust the output’s On/Off state or current level. The first way is by simply adding the number of pulses according to Table 2 (Flash Current Setting Table). For example, add six more pulses when changing from 5/16 to 11/16 of the maximum flash current. However, decreasing the current level can be accomplished two ways, allowing for more flexible programming. Since the data in Table 2 (Flash Current Setting Table) automatically circles around after 16 pulses, adding 5+16-15=6 pulses changes from 15/16 (DATA 15) to 5/16 (DATA 5) of the maximum flash current. The second way is to RF the IC by pulling ENF1/2 pin low for more than 600μs (guaranteed shutdown), and then inputting the desired number of pulses. Example: going from 15/16 (DATA 15) to 5/16 (DATA 5) - Option 1: send in 6 pulses (5+16-15=6); - Option 2: pull ENF1/2 low for more than 600μs and then send in 5 pulses. A flash event is initiated by asserting the ENF1/2 pin while ENM1/2 is at logic low level. A flash event is automatically terminated when ENF1/2 is de-asserted for more than 600μs or when ENM1/2 is asserted. In flash mode, intelligent temperature control is achieved by increasing chip temperature in the rang of approximately 110°C to 150°C. Once the IC’s temperature goes above 110℃, the sink current will be automatically decreased according to the thermal regulation control loop. This can prevent the IC from triggering thermal shutdown and causing the LED to flicker. Depending on the thermal layout of the PCB and the flash mode current setting, the OCP8153 sink current can be lower than the programmed value due to the thermal regulation protection feature. Flash Safety Timeout The OCP8136 includes a timer circuit that enables the flash current for 800mS of time. This feature eliminates the need for an external, housekeeping baseband controller to contain a safety delay routine. It also serves as a protection feature to minimize thermal issues with the flash LEDs in the event an external controller’s flash software routine experiences hang-up or freeze. Shutdown The current sink devices (LED1 and LED2) are the power returns for all loads, there is no leakage current through load if the current sink devices are disabled. When ENF1/2 and ENF1/2 are both held at logic low level, the OCP8136 is disabled and draws less than 1uA of leakage current from VIN1/2. Inductor Selection The selection of the inductor affects steady state operation as well as transient behavior and loop stability. These factors make it the most important component in power regulator design. There are three important inductor specifications, inductor value, DC resistance and saturation current. Considering inductor value alone is not enough. The inductor value determines the inductor ripple current. Choose an inductor that can handle the necessary peak current without saturating, according to half of the peak-to-peak ripple current given by IP equation, pause the inductor DC current given by: Page17 - 22 Ver. 1.0 Sept. 15, 2013 OCP8136 I IN _ DC = VOUT ∗ I OUT VIN ∗η Inductor peak-to-peak current ripple: I L _ PP = VIN ∗ (VOUT − VIN ) VOUT ∗ L ∗ FS Inductor peak current: I L _ PPEAK = I IN + I L _ PP 2 = VOUT ∗ I LED VIN ∗η + VIN ∗ (VOUT − VIN ) 2 ∗VOUT ∗ L ∗ FS Inductor values can have ±20% tolerance with no current bias. When the inductor current approaches saturation level, its inductance can decrease 20% to 35% from the 0A value depending on how the inductor vendor defines saturation current. Using an inductor with a smaller inductance value forces discontinuous PWM when the inductor current ramps down to zero before the end of each switching cycle. This reduces the boost converter’s maximum output current, causes large input voltage ripple and reduces efficiency. Large inductance value provides much more output current and higher conversion efficiency. For these reasons, a 1μH to 2.2μH inductor value range is recommended. The inductor parameters, current rating, DCR and physical size, should be considered. The DCR of inductor with lowest DCR is chosen for highest efficiency. The saturation current rating of inductor must be greater than the switch peak current, typically 4.5A. These factors affect the efficiency, output load capability, output voltage ripple, and cost. A 1μH inductor optimized the efficiency for most application while maintaining low inductor peak to peak ripple. Customers need to verify the inductor in their application if it is different from the recommended values. For a given inductor type, smaller inductor size leads to an increase in DCR winding resistance and, in most cases, increased thermal impedance. Winding resistance degrades boost converter efficiency and increases the inductor’s operating temperature: PLOSS ( INDUCTOR) = I2 RMS * DCR Output Capacitor Selection The ceramic capacitor is ideal for OCP8136 application. X5R or X7R types are recommended because they hold their capacitance over wide voltage and temperature ranges than other Y5V or Z5U types. The input capacitor can reduced peak current and noise at power source. For proper operation the output capacitor must be at least a 10μF ceramic. Larger capacitors such as a 22μF or multiple capacitors in parallel can be used if lower output voltage ripple is desired. To estimate the output voltage ripple considering the ripple due to capacitor discharge (ΔVQ) and the ripple due to the capacitors ESR (ΔVESR) use the following equations. The output capacitor is mainly selected to meet the requirements for the output ripple and loop stability. This ripple voltage is related to the capacitor’s capacitance and its equivalent series resistance (ESR). Assuming a capacitor with zero ESR, the minimum capacitance needed for a given ripple can be calculated by: COUT = I OUT ∗ (VOUT − VIN ) VOUT ∗VRIPPLE ∗ FS Where, VRIPPLE = peak-to-peak output ripple. The additional output ripple component caused by ESR is calculated using: VRIPPLE _ ESR = [( I OUT *VOUT VIN ) + VIN * (VOUT − VIN 2 * FS * L *VOUT ) ] * RESR Due to its low ESR, VRIPPLE_ESR can be neglected for ceramic capacitors, but must be considered if tantalum or electrolytic capacitors are used. Input Capacitor Selection Choosing the correct size and type of input capacitor helps minimize the input voltage ripple caused by the switching of the OCP8136’s boost converter, and reduces noise on the boost converters input terminal that can feed through and disrupt internal analog signals. In the Typical Application Circuit a 10μF ceramic input capacitor works well. It is important to place the input capacitor as close as possible to the OCP8136’s input (IN) terminals. This reduces the series resistance and inductance that can inject noise into the device due to the input switching currents. Page18 - 22 Ver. 1.0 Sept. 15, 2013 OCP8136 Thermal Considerations The maximum IC junction temperature should be restricted to 125°C under normal operating conditions. This restriction limits the power dissipation of the OCP8136. Calculate the maximum allowable dissipation, PD(max), and keep the actual dissipation less than or equal to PD(max). The maximum-power-dissipation limit is determined using following equation: PD(MAX ) = 125℃ − TA RθJA Where, TA is the maximum ambient temperature for the application. R θ JA is the thermal resistance junction-to-ambient given in Power Dissipation Table. Layout Considerations The high switching frequency and large switching currents of the OCP8136 make the choice of layout important. The following steps should be used as a reference to ensure the device is stable and maintains proper LED current regulation across its intended operating voltage and current range. 1. Place CIN on the top layer (same layer as the OCP8136) and as close to the device as possible. The input capacitor conducts the driver currents during the low side MOSFET turn-on and turn-off and can see current spikes over 1.2A in amplitude. Connecting the input capacitor through short wide traces to both the IN and GND terminals will reduce the inductive voltage spikes that occur during switching and which can corrupt the VIN line. 2. Place COUT on the top layer (same layer as the OCP8136) and as close as possible to the OUT and GND terminal. The returns for both CIN and COUT should come together at one point, and as close to the GND pin as possible. Connecting COUT through short wide traces will reduce the series inductance on the OUT and GND terminals that can corrupt the VOUT and GND line and cause excessive noise in the device and surrounding circuitry. 3. Connect the inductor on the top layer close to the SW pin. There should be a low-impedance connection from the inductor to SW due to the large DC inductor current, and at the same time the area occupied by the SW node should be small so as to reduce the capacitive coupling of the high dV/dt present at SW that can couple into nearby traces. 4. Avoid routing logic traces near the SW node so as to avoid any capacitively coupled voltages from SW onto any high-impedance logic lines such as ENM, ENF, RF and RM. A good approach is to insert an inner layer GND plane underneath the SW node and between any nearby routed traces. This creates a shield from the electric field generated at SW. 5. For Flash LEDs that are routed relatively far away from the OCP8136, a good approach is to sandwich the forward and return current paths over the top of each other on two layers. This will help in reducing the inductance of the LED current paths. Consider additional PCB exposed area for the flash LEDs to maximize heatsinking capability. This may be necessary when using high current application and long flash duration application. Page19 - 22 Ver. 1.0 Sept. 15, 2013 OCP8136 „ Ordering Information OCP8136XXX Package: Q: QFN4040-24L Packing: Temperature Grade: A: Tape & Reel D: -40~85℃ Part Number Driver Capability Package Type Package Qty Temperature Eco Plan OCP8136QAD 2.4A or 2*1.2A QFN4040-24L 13-in reel 3000pcs/reel -40~85℃ Green „ Marking Information Lead Cu QFN4040-24L Pin 1 Sign OCS XXXX XXXX Logo Part Number Internal code Page20 - 22 Ver. 1.0 Sept. 15, 2013 „ Package Information QFN4040-24L: OCP8136 Symbol A A1 A3 D E D1 E1 k b L e Dimensions In Millimeters Min. Nom. Max. 0.70 0.75 0.80 0.00 - 0.05 0.203(BSC) 3.900 4.000 4.100 3.900 4.000 4.100 2.600 2.700 2.800 2.600 2.700 2.800 0.200(BSC) 0.18 0.25 0.30 0.30 0.40 0.50 0.500(BSC) Dimensions In Inches Min. Nom. Max. 0.028 0.029 0.031 0.00 - 0.002 0.008(BSC) 0.154 0.157 0.161 0.154 0.157 0.161 0.102 0.106 0.110 0.102 0.106 0.110 0.008(BSC) 0.007 0.010 0.012 0.012 0.016 0.020 0.020(BSC) Page21 - 22 Ver. 1.0 Sept. 15, 2013 „ Packing Information OCP8136 Package Type Carrier Width(W) Pitch(P) Reel Size(D) QFN4040-24L 12.0±0.1 mm 8.0±0.1 mm 330±1 mm Note: Carrier Tape Dimension, Reel Size and Packing Minimum Packing Minimum 3000pcs Page22 - 22 Ver. 1.0 Sept. 15, 2013

Top_arrow
回到顶部
EEWORLD下载中心所有资源均来自网友分享,如有侵权,请发送举报邮件到客服邮箱bbs_service@eeworld.com.cn 或通过站内短信息或QQ:273568022联系管理员 高进,我们会尽快处理。