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AD技巧:如何设计符合EMI要求的PCB

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  • 日期: 2018-09-03
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标签: PCB

PCB(Printed Circuit Board),中文名称为印制电路板,是电子元器件的支撑体,也是电子元器件电气连接的提供者。由于它是采用电子印刷术制作的,故被称为“印刷”电路板。PCB是电子工业的重要部件之一,几乎每种电子设备,小到电子手表、计算器,大到计算机,通讯电子设备,军用武器系统,只要有集成电路等电子元器件,都要使用印制电路板。

AD技巧:如何设计符合EMI要求的PCB

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R Printed Circuit Board Design Techniques for EMC Compliance 2 cid222 Printed Circuit Board Design Techniques for EMC Compliance R Printed Circuit Board Design Techniques for EMC Compliance R Printed Circuit Board Design Techniques for EMC Compliance 1 I 1 EMC 8G2 P FK5 Q FK5 R cid252FK6 S cid218U 6 G 7 LAYERcid204FY8 X 9 X Fourlayer boards 11 PX T 12 QX 14 RX 16 20H RULE 16 P MV 18 X MV 1......

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(cid:252)F›K.....................................................................................................................6 S (cid:218)U ........................................................................................................................................6  G ..........................................................................................................................7  LAYER(cid:204)˝FY»..............................................................................................................8 X  .......................................................................................................................................9 X Four-layer boards ................................................................................................11 PX T .....................................................................................................................................12 QX $ .....................................................................................................................................14 RX  .....................................................................................................................................16  20-H RULE ....................................................................................................................................16 P MV ......................................................................................................................................18 X  MV .................................................................................................................................18 X  MV .................................................................................................................................19 Q MVa...........................................................................................................................21 R  (cid:255) IMAGE PLANE ...........................................................................................................22 S Y˚ PARTITIONING.......................................................................................................................25 T ( LOGIC FAMILIES ...............................................................................................................26 U )\º VELOCITY OF PROPAGATION ...............................................................................29 V  CRITICAL FREQUENCIES (cid:219)/20 ....................................................................29 P a BYPASSING AND DECOUPLING......................................................................31  ARESONANCE...........................................................................................................31  HJFß(cid:253) CAPACITOR PHYSICAL CHARACTERISTICS......................................33 P HJ/F/a.......................................................................................................................36 Q HJ ..................................................................................................................................37 R aMV (cid:255)H...................................................................................................................38 S HJFM‹º...............................................................................................................40 T PLACEMENT ;¸ ..................................................................................................................40 X  (cid:255) .................................................................................................................................40 X HJ .....................................................................................................................................41 PX 7H .................................................................................................................................43 Q CLOCK  ...................................................................................................................................45 3>DB  R¸ ., Œfi_ Printed Circuit Board Design Techniques for EMC Compliance  PLACEMENT ; ..................................................................................................................45  MV (cid:255) ....................................................................................................................................46 P JI ......................................................................................................................................47 Q )0 PROPAGATION DELAY ...................................................................................................50 R H ..................................................................................................................................51 S  DECOUPLING ....................................................................................................................52 T TRACE Fº...............................................................................................................................53 U JZ»-bJ .............................................................................................................................53 V  TRACE Fº ......................................................................................................................55 X Microstrip ................................................................................................................................56 X  F stripline ...................................................................................................................57   ROUTING LAYERS .........................................................................................................58 X  Routing layers.............................................................................................................58 X J--S F".......................................................................................................61  DY/Y GUARD/SHUNT TRACES ...........................................................................61  (cid:237) CROSSTALK.......................................................................................................................65 P TRACE TERMINATION ................................................................................................................68 Q H...................................................................................................................72 R COMPONENTS Q;....................................................................................................................74 S TRACE FY$a 3-W  ......................................................................................................75 R )#aS [M INTERCONNECTS AND I/O........................................................................77  Y˚ PARTITIONING.......................................................................................................................77 X D*F9 Functional SubSystems ...............................................................................78 X [E Quiet areas..................................................................................................................78 PX S FJ  .............................................................................................................79  $aY˚aISOLATION AND PARTITIONMOATING ..................................................79 X  a$ Isolation in moating ............................................................................80 X  aafl Bridge in a moat--partitoning ................................................................82 P aMV FILTERING AND GROUNDING.....................................................................................84 X  Filtering ..........................................................................................................................84 X MVI/O [MJ ...............................................................................................................87 Q  F I/O LAYOUT..............................................................................................................88 R VIDEO   ...............................................................................................................................91 S AUDIO  ...............................................................................................................................94 T UD ENERGY HAZARD PROTECTION FUSING ...............................................................96 U CREEPAGE a CLEARANCE ...................................................................................................97 S E¸UD ELECTROSTATIC DISCHARGE PROTECTION ............................................98 3>DB  R¸ ., Œfi_ Printed Circuit Board Design Techniques for EMC Compliance   BASICS..........................................................................................................................98 T BACKPLANES a DAUGHTER CARDS ..................................................................................104   BASICS................................................................................................................................104  YaY˚ TRACES AND PARTITIONS........................................................................................105 X 60 a 100FYJF............................................................................................106 P BACKPLANE F(cid:204) ....................................................................................................................107 X I ...............................................................................................................................107 X X/ ...........................................................................................................................112 PX [MJ4(cid:239)Slots/................................................................................................112 Q S [M ....................................................................................................................................113 R (cid:204) ............................................................................................................................................113 S   ....................................................................................................................................114 T TRACE Fº8F$.....................................................................................................114 U (cid:237) ............................................................................................................................................115 V VFI.............................................................................................................................115  W BACKPLANE FMVJ ( SLOTS ) ..........................................................................116 U  ADDITIONAL DESIGN TECHNIQUES .......................................................118  F .............................................................................................................................118  _/a FERRITE Q;..............................................................................................................119 P MFMV GROUNNDED HEATSINKS ....................................................................................121 Q $ ................................................................................................................................125 R BNC [MJ ...............................................................................................................................125 S FILM ........................................................................................................................126 V DESIGN TECHNIGUES (cid:222)—K7 A......................................................................................131  G(cid:204)«.................................................................................................................131  a.............................................................................................................................132 P CLOCK C ........................................................................................................................133 Q S [Ma)#).................................................................................................................135 R ESD E¸UD ....................................................................................................................137 S BACKPLANE AND DAUGHTER CARDS ..........................................................................................138 T ].........................................................................................................................139 X F  ...................................................................................................................139 X Ferrite aF/a ...............................................................................................................139 PX MMV Grounded Heatsinks..........................................................................................140 QX $ Lithium Battery Circuits....................................................................................140 RX BNC connector.......................................................................................................................140 3>DB 
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3ABC
实战资料,相当不错。
2018-09-08 17:06:46回复
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