首页资源分类嵌入式处理器C2000 > cc2540芯片资料

cc2540芯片资料

已有 445122个资源

下载专区

上传者其他资源

    文档信息举报收藏

    标    签:cc2540

    分    享:

    文档简介

    cc2540  芯片资料

    文档预览

    CC2540F128, CC2540F256 www.ti.com SWRS084F – OCTOBER 2010 – REVISED JUNE 2013 2.4-GHz Bluetooth® low energy System-on-Chip Check for Samples: CC2540F128, CC2540F256 FEATURES 1 •23456 True Single-Chip BLE Solution: CC2540 Can Run Both Application and BLE Protocol Stack, Includes Peripherals to Interface With Wide Range of Sensors, Etc. • 6-mm × 6-mm Package • RF – Bluetooth low energy technology Compatible – Excellent Link Budget (up to 97 dB), Enabling Long-Range Applications Without External Front End – Accurate Digital Received Signal-Strength Indicator (RSSI) – Suitable for Systems Targeting Compliance With Worldwide Radio Frequency Regulations: ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan) • Layout – Few External Components – Reference Design Provided – 6-mm × 6-mm QFN40 Package • Low Power – Active Mode RX Down to 19.6 mA – Active Mode TX (–6 dBm): 24 mA – Power Mode 1 (3-μs Wake-Up): 235 μA – Power Mode 2 (Sleep Timer On): 0.9 μA – Power Mode 3 (External Interrupts): 0.4 μA – Wide Supply Voltage Range (2 V–3.6 V) – Full RAM and Register Retention in All Power Modes A • TPS62730 Compatible Low Power in Active Mode – RX Down to 15.8 mA (3 V Supply) – TX (-6 dBm): 18.6 mA (3 V Supply) A • Microcontroller – High-Performance and Low-Power 8051 Microcontroller Core – In-System-Programmable Flash, 128 KB or 256 KB – 8-KB SRAM A • Peripherals – 12-Bit ADC with Eight Channels and Configurable Resolution – Integrated High-Performance Op-Amp and Ultralow-Power Comparator – General-Purpose Timers (One 16-Bit, Two 8-Bit) – 21 General-Purpose I/O Pins (19× 4 mA, 2× 20 mA) – 32-kHz Sleep Timer With Capture – Two Powerful USARTs With Support for Several Serial Protocols – Full-Speed USB Interface – IR Generation Circuitry – Powerful Five-Channel DMA – AES Security Coprocessor – Battery Monitor and Temperature Sensor – Each CC2540 Contains a Unique 48-bit IEEE Address 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. SmartRF is a trademark of Texas Instruments. 2 Bluetooth is a registered trademark of Bluetooth SIG, Inc. 3 Supported by IAR Embedded Workbench is a trademark of IAR Systems AB. 4 ZigBee is a registered trademark of ZigBee Alliance. 5 All other trademarks are the property of their respective owners. 6 PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2010–2013, Texas Instruments Incorporated CC2540F128, CC2540F256 SWRS084F – OCTOBER 2010 – REVISED JUNE 2013 SOFTWARE FEATURES • Bluetooth v4.0 Compliant Protocol Stack for Single-Mode BLE Solution – Complete Power-Optimized Stack, Including Controller and Host – GAP – Central, Peripheral, Observer, or Broadcaster (Including Combination Roles) – ATT / GATT – Client and Server – SMP – AES-128 Encryption and Decryption – L2CAP – Sample Applications and Profiles – Generic Applications for GAP Central and Peripheral Roles – Proximity, Accelerometer, Simple Keys, and Battery GATT Services – Multiple Configuration options – Single-Chip Configuration, Allowing Application to Run on CC2540 – Network Processor Interface for Applications Running on an External Microcontroller – BTool – Windows PC Application for Evaluation, Development, and Test • Development Tools – CC2540 Mini Development Kit – SmartRF™ Software – Supported by IAR Embedded Workbench™ Software for 8051 www.ti.com APPLICATIONS • 2.4-GHz Bluetooth low energy Systems • Mobile Phone Accessories • Sports and Leisure Equipment • Consumer Electronics • Human Interface Devices (Keyboard, Mouse, Remote Control) • USB Dongles • Health Care and Medical CC2540 WITH TPS62730 • TPS62730 is a 2 MHz Step Down Converter with Bypass Mode • Extends Battery Lifetime by up to 20% • Reduced Current in TX and RX • 30 nA Bypass Mode Current to Support Low Power Modes • RF Performance Unchanged • Small Package Allows for Small Solution Size • CC2540 Controllable DESCRIPTION The CC2540 is a cost-effective, low-power, true system-on-chip (SoC) for Bluetooth low energy applications. It enables robust BLE master or slave nodes to be built with very low total bill-of-material costs. The CC2540 combines an excellent RF transceiver with an industry-standard enhanced 8051 MCU, in-system programmable flash memory, 8-KB RAM, and many other powerful supporting features and peripherals. The CC2540 is suitable for systems where very low power consumption is required. Very low-power sleep modes are available. Short transition times between operating modes further enable low power consumption. The CC2540 comes in two different versions: CC2540F128/F256, with 128 and 256 KB of flash memory, respectively. Combined with the Bluetooth low energy protocol stack from Texas Instruments, the CC2540F128/F256 forms the market’s most flexible and cost-effective single-mode Bluetooth low energy solution. 2 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: CC2540F128 CC2540F256 www.ti.com RESET_N XOSC_Q2 XOSC_Q1 P2_4 P2_3 P2_2 P2_1 P2_0 P1_7 P1_6 P1_5 P1_4 P1_3 P1_2 P1_1 P1_0 P0_7 P0_6 P0_5 P0_4 P0_3 P0_2 P0_1 P0_0 USB_N USB_P I/O CONTROLLER CC2540F128, CC2540F256 SWRS084F – OCTOBER 2010 – REVISED JUNE 2013 RESET 32-MHz CRYSTAL OSC 32.768-kHz CRYSTAL OSC DEBUG INTERFACE WATCHDOG TIMER CLOCK MUX and CALIBRATION HIGHSPEED RC-OSC 32-kHz RC-OSC SFR Bus ON-CHIP VOLTAGE REGULATOR POWER-ON RESET BROWN OUT VDD (2 V–3.6 V) DCOUPL SLEEP TIMER POWER MANAGEMENT CONTROLLER 8051 CPU CORE PDATA XRAM IRAM SFR MEMORY ARBITRATOR FLASH FLASH DMA UNIFIED IRQ CTRL ANALOG COMPARATOR OP-AMP DS ADC AUDIO/DC AES ENCRYPTION AND DECRYPTION Radio Arbiter FLASH CTRL FIFOCTRL 1 KB SRAM RADIO REGISTERS Link Layer Engine SFR Bus SYNTH USB USART 0 USART 1 TIMER 1 (16-Bit) TIMER 2 (BLE LL TIMER) TIMER 3 (8-Bit) TIMER 4 (8-Bit) DEMODULATOR MODULATOR RECEIVE TRANSMIT FREQUENCY SYNTHESIZER DIGITAL ANALOG MIXED RF_P RF_N B0301-05 Copyright © 2010–2013, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: CC2540F128 CC2540F256 CC2540F128, CC2540F256 SWRS084F – OCTOBER 2010 – REVISED JUNE 2013 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ABSOLUTE MAXIMUM RATINGS(1) Supply voltage All supply pins must have the same voltage Voltage on any digital pin Input RF level Storage temperature range ESD (2) All pads, according to human-body model, JEDEC STD 22, method A114 According to charged-device model, JEDEC STD 22, method C101 MIN MAX UNIT –0.3 3.9 V –0.3 VDD + 0.3, ≤ 3.9 V 10 dBm –40 125 °C 2 kV 750 V (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) CAUTION: ESD sensitive device. Precautions should be used when handing the device in order to prevent permanent damage. RECOMMENDED OPERATING CONDITIONS Operating ambient temperature range, TA Operating supply voltage MIN MAX UNIT –40 85 °C 2 3.6 V ELECTRICAL CHARACTERISTICS Measured on Texas Instruments CC2540 EM reference design with TA = 25°C and VDD = 3 V PARAMETER TEST CONDITIONS Power mode 1. Digital regulator on; 16-MHz RCOSC and 32MHz crystal oscillator off; 32.768-kHz XOSC, POR, BOD and sleep timer active; RAM and register retention Icore Core current consumption Power mode 2. Digital regulator off; 16-MHz RCOSC and 32MHz crystal oscillator off; 32.768-kHz XOSC, POR, and sleep timer active; RAM and register retention Power mode 3. Digital regulator off; no clocks; POR active; RAM and register retention Low MCU activity: 32-MHz XOSC running. No radio or peripherals. No flash access, no RAM access. Timer 1. Timer running, 32-MHz XOSC used Timer 2. Timer running, 32-MHz XOSC used Peripheral current consumption Timer 3. Timer running, 32-MHz XOSC used Iperi (Adds to core current Icore for each peripheral unit activated) Timer 4. Timer running, 32-MHz XOSC used Sleep timer, including 32.753-kHz RCOSC ADC, when converting MIN TYP MAX UNIT 235 0.9 µA 0.4 6.7 mA 90 μA 90 μA 60 μA 70 μA 0.6 μA 1.2 mA 4 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: CC2540F128 CC2540F256 CC2540F128, CC2540F256 www.ti.com SWRS084F – OCTOBER 2010 – REVISED JUNE 2013 GENERAL CHARACTERISTICS Measured on Texas Instruments CC2540 EM reference design with TA = 25°C and VDD = 3 V PARAMETER TEST CONDITIONS MIN TYP WAKE-UP AND TIMING Power mode 1 → Active Digital regulator on, 16-MHz RCOSC and 32-MHz crystal oscillator off. Start-up of 16-MHz RCOSC 4 Power mode 2 or 3 → Active Digital regulator off, 16-MHz RCOSC and 32-MHz crystal oscillator off. Start-up of regulator and 16-MHz RCOSC 120 Active → TX or RX Crystal ESR = 16 Ω. Initially running on 16-MHz RCOSC, with 32-MHz XOSC OFF 410 With 32-MHz XOSC initially on 160 RX/TX turnaround 150 RADIO PART RF frequency range Programmable in 2-MHz steps 2402 Data rate and modulation format 1 Mbps, GFSK, 250 kHz deviation MAX UNIT μs μs μs μs μs 2480 MHz RF RECEIVE SECTION Measured on Texas Instruments CC2540 EM reference design with TA = 25°C, VDD = 3 V, fc = 2440 MHz 1 Mbps, GFSK, 250-kHz deviation, Bluetooth low energy mode, and 0.1% BER(1) PARAMETER Receiver sensitivity(2) Receiver sensitivity(2) Saturation (3) Co-channel rejection(3) Adjacent-channel rejection(3) Alternate-channel rejection(3) Blocking (3) Frequency error tolerance(4) Symbol rate error tolerance(5) High-gain mode Standard mode TEST CONDITIONS ±1 MHz ±2 MHz Including both initial tolerance and drift MIN –250 –80 TYP MAX –93 –87 6 –5 –5 30 –30 250 80 Spurious emission. Only largest spurious emission stated within each band. Conducted measurement with a 50-Ω single-ended load. Complies with EN 300 328, EN 300 440 class 2, FCC CFR47, Part 15 and ARIB STD-T-66 –75 Current consumption RX mode, standard mode, no peripherals active, low MCU activity, MCU at 250 kHz 19.6 RX mode, high-gain mode, no peripherals active, low MCU activity, MCU at 250 kHz 22.1 UNIT dBm dBm dBm dB dB dB dBm kHz ppm dBm mA (1) 0.1% BER maps to 30.8% PER (2) The receiver sensitivity setting is programmable using a TI BLE stack vendor-specific API command. The default value is standard mode. (3) Results based on standard gain mode (4) Difference between center frequency of the received RF signal and local oscillator frequency (5) Difference between incoming symbol rate and the internally generated symbol rate Copyright © 2010–2013, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: CC2540F128 CC2540F256 CC2540F128, CC2540F256 SWRS084F – OCTOBER 2010 – REVISED JUNE 2013 www.ti.com RF TRANSMIT SECTION Measured on Texas Instruments CC2540 EM reference design with TA = 25°C, VDD = 3 V and fc = 2440 MHz PARAMETER TEST CONDITIONS MIN TYP MAX Output power Delivered to a single-ended 50-Ω load through a balun using maximum recommended output power setting 4 Delivered to a single-ended 50-Ω load through a balun using minimum recommended output power setting –23 Programmable output power Delivered to a single-ended 50 Ω load through a balun 27 range Conducted measurement with a 50-Ω single-ended load. Complies Spurious emissions with EN 300 328, EN 300 440 class 2, FCC CFR47, Part 15 and ARIB –41 STD-T-66 (1) TX mode, –23-dBm output power, no peripherals active, low MCU activity, MCU at 250 kHz 21.1 TX mode, –6-dBm output power, no peripherals active, low MCU activity, MCU at 250 kHz 23.8 Current consumption TX mode, 0-dBm output power, no peripherals active, low MCU activity, MCU at 250 kHz 27 TX mode, 4-dBm output power, no peripherals active, low MCU activity, MCU at 250 kHz 31.6 Optimum load impedance Differential impedance as seen from the RF port (RF_P and RF_N) toward the antenna 70 + j30 UNIT dBm dB dBm mA Ω (1) Designs with antenna connectors that require conducted ETSI compliance at 64 MHz should insert an LC resonator in front of the antenna connector. Use a 1.6-nH inductor in parallel with a 1.8-pF capacitor. Connect both from the signal trace to a good RF ground. CURRENT CONSUMPTION WITH TPS62730 Measured on Texas Instruments CC2540TPS62730 EM reference design with TA = 25°C, VDD = 3 V, and fc = 2440 MHZ. 1 Mbps, GFSK, 250 kHz deviation, Bluetooth™ low energy mode, 1% BER(1) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT RX mode, standard mode, no peripherals active, low MCU activity, MCU at 1 MHZ 15.8 RX mode, high-gain mode, no peripherals active, low MCU activity, MCU at 1 MHZ 17.8 Current Consumption TX mode, -23 dBm output power, no peripherals active, low MCU activity, MCU at 1 MHZ TX mode, -6 dBm output power, no peripherals active, low MCU activity, MCU at 1 MHZ 16.5 mA 18.6 TX mode, 0 dBm output power, no peripherals active, low MCU activity, MCU at 1 MHZ 21 TX mode, 4 dBm output power, no peripherals active, low MCU activity, MCU at 1 MHZ 24.6 (1) 0.1% BER maps to 30.8% PER 6 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: CC2540F128 CC2540F256 CC2540F128, CC2540F256 www.ti.com SWRS084F – OCTOBER 2010 – REVISED JUNE 2013 32-MHz CRYSTAL OSCILLATOR Measured on Texas Instruments CC2540 EM reference design with TA = 25°C and VDD = 3 V PARAMETER TEST CONDITIONS Crystal frequency Crystal frequency accuracy requirement (1) ESR Equivalent series resistance C0 Crystal shunt capacitance CL Crystal load capacitance Start-up time Power-down guard time The crystal oscillator must be in power down for a guard time before it is used again. This requirement is valid for all modes of operation. The need for power-down guard time can vary with crystal type and load. (1) Including aging and temperature dependency, as specified by [1] MIN TYP MAX UNIT 32 MHz –40 40 ppm 6 1 10 0.25 60 Ω 7 pF 16 pF ms 3 ms 32.768-kHz CRYSTAL OSCILLATOR Measured on Texas Instruments CC2540 EM reference design with TA = 25°C and VDD = 3 V PARAMETER TEST CONDITIONS MIN Crystal frequency Crystal frequency accuracy requirement (1) –40 ESR Equivalent series resistance C0 Crystal shunt capacitance CL Crystal load capacitance Start-up time TYP 32.768 40 0.9 12 0.4 MAX 40 130 2 16 UNIT kHz ppm kΩ pF pF s (1) Including aging and temperature dependency, as specified by [1] 32-kHz RC OSCILLATOR Measured on Texas Instruments CC2540 EM reference design with Tω = 25°C and VDD = 3 V. PARAMETER TEST CONDITIONS MIN Calibrated frequency(1) Frequency accuracy after calibration Temperature coefficient(2) Supply-voltage coefficient(3) Calibration time(4) TYP 32.753 ±0.2% 0.4 3 2 MAX UNIT kHz %/°C %/V ms (1) The calibrated 32-kHz RC oscillator frequency is the 32-MHz XTAL frequency divided by 977. (2) Frequency drift when temperature changes after calibration (3) Frequency drift when supply voltage changes after calibration (4) When the 32-kHz RC oscillator is enabled, it is calibrated when a switch from the 16-MHz RC oscillator to the 32-MHz crystal oscillator is performed while SLEEPCMD.OSC32K_CALDIS is set to 0. Copyright © 2010–2013, Texas Instruments Incorporated Submit Documentation Feedback 7 Product Folder Links: CC2540F128 CC2540F256 CC2540F128, CC2540F256 SWRS084F – OCTOBER 2010 – REVISED JUNE 2013 www.ti.com 16-MHz RC OSCILLATOR Measured on Texas Instruments CC2540 EM reference design with TA = 25°C and VDD = 3 V PARAMETER TEST CONDITIONS MIN Frequency (1) Uncalibrated frequency accuracy Calibrated frequency accuracy Start-up time Initial calibration time(2) TYP 16 ±18% ±0.6% 10 50 MAX UNIT MHz μs μs (1) The calibrated 16-MHz RC oscillator frequency is the 32-MHz XTAL frequency divided by 2. (2) When the 16-MHz RC oscillator is enabled, it is calibrated when a switch from the 16-MHz RC oscillator to the 32-MHz crystal oscillator is performed while SLEEPCMD.OSC_PD is set to 0. RSSI CHARACTERISTICS Measured on Texas Instruments CC2540 EM reference design with TA = 25°C and VDD = 3 V PARAMETER TEST CONDITIONS MIN TYP Useful RSSI range(1) Absolute uncalibrated RSSI accuracy(1) High-gain mode Standard mode High-gain mode –99 to –44 –90 to –35 ±4 Step size (LSB value) 1 (1) Assuming CC2540 EM reference design. Other RF designs give an offset from the reported value. MAX UNIT dBm dB dB FREQUENCY SYNTHESIZER CHARACTERISTICS Measured on Texas Instruments CC2540 EM reference design with TA = 25°C, VDD = 3 V and fc = 2440 MHz PARAMETER TEST CONDITIONS MIN TYP MAX Phase noise, unmodulated carrier At ±1-MHz offset from carrier At ±3-MHz offset from carrier At ±5-MHz offset from carrier –109 –112 –119 UNIT dBc/Hz ANALOG TEMPERATURE SENSOR Measured on Texas Instruments CC2540 EM reference design with TA = 25°C and VDD = 3 V PARAMETER TEST CONDITIONS MIN Output Temperature coefficient Voltage coefficient Initial accuracy without calibration Measured using integrated ADC, internal band-gap voltage reference, and maximum resolution Accuracy using 1-point calibration Current consumption when enabled TYP 1480 4.5 1 ±10 ±5 0.5 MAX UNIT 12-bit /1°C / 0.1 V °C °C mA 8 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: CC2540F128 CC2540F256 CC2540F128, CC2540F256 www.ti.com SWRS084F – OCTOBER 2010 – REVISED JUNE 2013 OP-AMP CHARACTERISTICS TA = 25°C, VDD = 3 V, . All measurement results are obtained using the CC2540 reference designs post-calibration. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Chopping Configuration, Register APCFG = 0x07, OPAMPMC = 0x03, OPAMPC = 0x01 Output maximum voltage VDD – 0.1 V Output minimum voltage 0.1 V Open-loop gain 108 dB Gain-bandwidth product 2 MHz Slew rate 2.6 V/μs Input maximum voltage VDD V Intput minimum voltage 0 mV Input offset voltage 40 μV CMRR Common-mode rejection ratio 90 dB Supply current 0.4 mA Input noise voltage f = 0.01 Hz to 1 Hz f = 0.1 Hz to 10 Hz 1.1 nV/√(Hz) 1.7 Non-Chopping Configuration, Register APCFG = 0x07, OPAMPMC = 0x00, OPAMPC = 0x01 Output maximum voltage VDD – 0.1 V Output minimum voltage 0.1 V Open-loop gain 108 dB Gain-bandwidth product 2 MHz Slew rate 2.6 V/μs Input maximum voltage VDD V Intput minimum voltage 0 mV Input offset voltage 3.2 mV CMRR Common-mode rejection ratio 90 dB Supply current 0.4 mA Input noise voltage f = 0.01 Hz to 1 Hz f = 0.1 Hz to 10 Hz 60 nV/√(Hz) 65 COMPARATOR CHARACTERISTICS TA = 25°C, VDD = 3 V. All measurement results are obtained using the CC2540 reference designs, post-calibration. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Common-mode maximum voltage VDD V Common-mode minimum voltage –0.3 Input offset voltage 1 mV Offset vs temperature 16 µV/°C Offset vs operating voltage 4 mV/V Supply current 230 nA Hysteresis 0.15 mV Copyright © 2010–2013, Texas Instruments Incorporated Submit Documentation Feedback 9 Product Folder Links: CC2540F128 CC2540F256 CC2540F128, CC2540F256 SWRS084F – OCTOBER 2010 – REVISED JUNE 2013 ADC CHARACTERISTICS TA = 25°C and VDD = 3 V PARAMETER Input voltage External reference voltage External reference voltage differential Input resistance, signal Full-scale signal(1) ENOB (1) Effective number of bits THD Useful power bandwidth Total harmonic distortion Signal to nonharmonic ratio CMRR DNL Common-mode rejection ratio Crosstalk Offset Gain error Differential nonlinearity INL Integral nonlinearity SINAD (–THD+N) Signal-to-noise-and-distortion www.ti.com TEST CONDITIONS VDD is voltage on AVDD5 pin VDD is voltage on AVDD5 pin VDD is voltage on AVDD5 pin Simulated using 4-MHz clock speed Peak-to-peak, defines 0 dBFS Single-ended input, 7-bit setting Single-ended input, 9-bit setting Single-ended input, 10-bit setting Single-ended input, 12-bit setting Differential input, 7-bit setting Differential input, 9-bit setting Differential input, 10-bit setting Differential input, 12-bit setting 10-bit setting, clocked by RCOSC 12-bit setting, clocked by RCOSC 7-bit setting, both single and differential Single ended input, 12-bit setting, –6 dBFS (1) Differential input, 12-bit setting, –6 dBFS (1) Single-ended input, 12-bit setting(1) Differential input, 12-bit setting(1) Single-ended input, 12-bit setting, –6 dBFS (1) Differential input, 12-bit setting, –6 dBFS (1) Differential input, 12-bit setting, 1-kHz sine (0 dBFS), limited by ADC resolution Single ended input, 12-bit setting, 1-kHz sine (0 dBFS), limited by ADC resolution Midscale 12-bit setting, mean(1) 12-bit setting, maximum(1) 12-bit setting, mean(1) 12-bit setting, maximum(1) 12-bit setting, mean, clocked by RCOSC 12-bit setting, max, clocked by RCOSC Single ended input, 7-bit setting(1) Single ended input, 9-bit setting(1) Single ended input, 10-bit setting(1) Single ended input, 12-bit setting(1) Differential input, 7-bit setting(1) Differential input, 9-bit setting(1) Differential input, 10-bit setting(1) Differential input, 12-bit setting(1) MIN TYP MAX UNIT 0 VDD V 0 VDD V 0 VDD V 197 kΩ 2.97 V 5.7 7.5 9.3 10.3 6.5 bits 8.3 10 11.5 9.7 10.9 0–20 kHz –75.2 dB –86.6 70.2 79.3 78.8 dB 88.9 >84 dB >84 dB –3 mV 0.68% 0.05 LSB 0.9 4.6 13.3 LSB 10 29 35.4 46.8 57.5 66.6 dB 40.7 51.6 61.8 70.8 (1) Measured with 300-Hz sine-wave input and VDD as reference. 10 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: CC2540F128 CC2540F256 CC2540F128, CC2540F256 www.ti.com SWRS084F – OCTOBER 2010 – REVISED JUNE 2013 ADC CHARACTERISTICS (continued) TA = 25°C and VDD = 3 V PARAMETER Conversion time Power consumption Internal reference VDD coefficient Internal reference temperature coefficient Internal reference voltage TEST CONDITIONS 7-bit setting 9-bit setting 10-bit setting 12-bit setting MIN TYP MAX UNIT 20 36 μs 68 132 1.2 mA 4 mV/V 0.4 mV/10°C 1.24 V CONTROL INPUT AC CHARACTERISTICS TA = –40°C to 85°C, VDD = 2 V to 3.6 V. PARAMETER TEST CONDITIONS System clock, fSYSCLK tSYSCLK = 1/ fSYSCLK The undivided system clock is 32 MHz when crystal oscillator is used. The undivided system clock is 16 MHz when calibrated 16-MHz RC oscillator is used. RESET_N low duration See item 1, Figure 1. This is the shortest pulse that is recognized as a complete reset pin request. Note that shorter pulses may be recognized but do not lead to complete reset of all modules within the chip. Interrupt pulse duration See item 2, Figure 1.This is the shortest pulse that is recognized as an interrupt request. MIN TYP 16 MAX UNIT 32 MHz 1 µs 20 ns RESET_N Px.n 1 2 Figure 1. Control Input AC Characteristics T0299-01 Copyright © 2010–2013, Texas Instruments Incorporated Submit Documentation Feedback 11 Product Folder Links: CC2540F128 CC2540F256 CC2540F128, CC2540F256 SWRS084F – OCTOBER 2010 – REVISED JUNE 2013 SPI AC CHARACTERISTICS TA = –40°C to 85°C, VDD = 2 V to 3.6 V PARAMETER TEST CONDITIONS t1 SCK period Master, RX and TX Slave, RX and TX SCK duty cycle Master t2 SSN low to SCK Master Slave t3 SCK to SSN high Master Slave t4 MOSI early out t5 MOSI late out t6 MISO setup t7 MISO hold SCK duty cycle Master, load = 10 pF Master, load = 10 pF Master Master Slave t10 MOSI setup t11 MOSI hold t9 MISO late out Slave Slave Slave, load = 10 pF Master, TX only Operating frequency Master, RX and TX Slave, RX only Slave, RX and TX www.ti.com MIN TYP MAX UNIT 250 ns 250 50% 63 ns 63 63 ns 63 7 ns 10 ns 90 ns 10 ns 50% ns 35 ns 10 ns 95 ns 8 4 MHz 8 4 SCK SSN MOSI MISO X t2 t3 D0 t6 t7 D0 t4 t5 X D1 X Figure 2. SPI Master AC Characteristics T0478-01 12 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: CC2540F128 CC2540F256 www.ti.com CC2540F128, CC2540F256 SWRS084F – OCTOBER 2010 – REVISED JUNE 2013 SCK SSN MISO MOSI X t2 t3 D0 t10 t11 D0 t8 t9 X D1 X Figure 3. SPI Slave AC Characteristics T0479-01 Copyright © 2010–2013, Texas Instruments Incorporated Submit Documentation Feedback 13 Product Folder Links: CC2540F128 CC2540F256 CC2540F128, CC2540F256 SWRS084F – OCTOBER 2010 – REVISED JUNE 2013 DEBUG INTERFACE AC CHARACTERISTICS TA = –40°C to 85°C, VDD = 2 V to 3.6 V PARAMETER TEST CONDITIONS fclk_dbg t1 t2 t3 Debug clock frequency (see Figure 4) Allowed high pulse on clock (see Figure 4) Allowed low pulse on clock (see Figure 4) EXT_RESET_N low to first falling edge on debug clock (see Figure 6) t4 Falling edge on clock to EXT_RESET_N high (see Figure 6) t5 EXT_RESET_N high to first debug command (see Figure 6) t6 Debug data setup (see Figure 5) t7 Debug data hold (see Figure 5) t8 Clock-to-data delay (see Figure 5) Load = 10 pF www.ti.com MIN TYP MAX UNIT 12 MHz 35 ns 35 ns 167 ns 83 ns 83 ns 2 ns 4 ns 30 ns Time DEBUG_ CLK P2_2 t1 t2 1/fclk_dbg Figure 4. Debug Clock – Basic Timing T0436-01 Time DEBUG_ CLK P2_2 RESET_N t3 t4 t5 Figure 5. Debug Enable Timing T0437-01 14 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: CC2540F128 CC2540F256 www.ti.com CC2540F128, CC2540F256 SWRS084F – OCTOBER 2010 – REVISED JUNE 2013 Time DEBUG_ CLK P2_2 DEBUG_DATA (to CC2540) P2_1 DEBUG_DATA (from CC2540) P2_1 t6 t7 Figure 6. Data Setup and Hold Timing t8 T0438-02 TIMER INPUTS AC CHARACTERISTICS TA = –40°C to 85°C, VDD = 2 V to 3.6 V PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Synchronizers determine the shortest input pulse that can be Input capture pulse duration recognized. The synchronizers operate at the current system clock rate 1.5 (16 MHz or 32 MHz). tSYSCLK DC CHARACTERISTICS TA = 25°C, VDD = 3 V PARAMETER Logic-0 input voltage Logic-1 input voltage Logic-0 input current Logic-1 input current I/O-pin pullup and pulldown resistors Logic-0 output voltage, 4- mA pins Logic-1 output voltage, 4-mA pins TEST CONDITIONS Input equals 0 V Input equals VDD Output load 4 mA Output load 4 mA MIN TYP MAX UNIT 0.5 V 2.5 V –50 50 nA –50 50 nA 20 kΩ 0.5 V 2.4 V Copyright © 2010–2013, Texas Instruments Incorporated Submit Documentation Feedback 15 Product Folder Links: CC2540F128 CC2540F256 CC2540F128, CC2540F256 SWRS084F – OCTOBER 2010 – REVISED JUNE 2013 DEVICE INFORMATION PIN DESCRIPTIONS The CC2540 pinout is shown in Figure 7 and a short description of the pins follows. CC2540 RHA Package (Top View) www.ti.com DCOUPL DVDD1 P1_6 P1_7 P2_0 P2_1 P2_2 P2_3 / XOSC32K_Q2 P2_4 / XOSC32K_Q1 AVDD6 DGND_USB USB_P USB_N DVDD_USB P1_5 P1_4 P1_3 P1_2 P1_1 DVDD2 40 39 38 37 36 35 34 33 32 31 1 30 2 29 3 28 4 27 5 GND 26 6 Ground Pad 25 7 24 8 23 9 22 10 21 11 12 13 14 15 16 17 18 19 20 R_BIAS AVDD4 AVDD1 AVDD2 RF_N RF_P AVDD3 XOSC_Q2 XOSC_Q1 AVDD5 P1_0 P0_7 P0_6 P0_5 P0_4 P0_3 P0_2 P0_1 P0_0 RESET_N P0076-05 NOTE: The exposed ground pad must be connected to a solid ground plane, as this is the ground connection for the chip. Figure 7. Pinout Top View 16 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: CC2540F128 CC2540F256 CC2540F128, CC2540F256 www.ti.com PIN NAME AVDD1 AVDD2 AVDD3 AVDD4 AVDD5 AVDD6 DCOUPL DGND_USB DVDD_USB DVDD1 DVDD2 GND P0_0 P0_1 P0_2 P0_3 P0_4 P0_5 P0_6 P0_7 P1_0 P1_1 P1_2 P1_3 P1_4 P1_5 P1_6 P1_7 P2_0 P2_1 P2_2 P2_3/ XOSC32K_Q2 P2_4/ XOSC32K_Q1 RBIAS RESET_N RF_N RF_P USB_N USB_P XOSC_Q1 XOSC_Q2 SWRS084F – OCTOBER 2010 – REVISED JUNE 2013 PIN DESCRIPTIONS PIN PIN TYPE DESCRIPTION 28 Power (analog) 2-V–3.6-V analog power-supply connection 27 Power (analog) 2-V–3.6-V analog power-supply connection 24 Power (analog) 2-V–3.6-V analog power-supply connection 29 Power (analog) 2-V–3.6-V analog power-supply connection 21 Power (analog) 2-V–3.6-V analog power-supply connection 31 Power (analog) 2-V–3.6-V analog power-supply connection 40 Power (digital) 1.8-V digital power-supply decoupling. Do not use for supplying external circuits. 1 Ground pin Connect to GND 4 Power (digital) 2-V–3.6-V digital power-supply connection 39 Power (digital) 2-V–3.6-V digital power-supply connection 10 Power (digital) 2-V–3.6-V digital power-supply connection — Ground The ground pad must be connected to a solid ground plane. 19 Digital I/O Port 0.0 18 Digital I/O Port 0.1 17 Digital I/O Port 0.2 16 Digital I/O Port 0.3 15 Digital I/O Port 0.4 14 Digital I/O Port 0.5 13 Digital I/O Port 0.6 12 Digital I/O Port 0.7 11 Digital I/O Port 1.0 – 20-mA drive capability 9 Digital I/O Port 1.1 – 20-mA drive capability 8 Digital I/O Port 1.2 7 Digital I/O Port 1.3 6 Digital I/O Port 1.4 5 Digital I/O Port 1.5 38 Digital I/O Port 1.6 37 Digital I/O Port 1.7 36 Digital I/O Port 2.0 35 Digital I/O Port 2.1 34 Digital I/O Port 2.2 33 Digital I/O, Analog I/O Port 2.3/32.768 kHz XOSC 32 Digital I/O, Analog I/O Port 2.4/32.768 kHz XOSC 30 Analog I/O External precision bias resistor for reference current 20 Digital input Reset, active-low 26 RF I/O Negative RF input signal to LNA during RX Negative RF output signal from PA during TX 25 RF I/O Positive RF input signal to LNA during RX Positive RF output signal from PA during TX 3 Digital I/O USB N 2 Digital I/O USB P 22 Analog I/O 32-MHz crystal oscillator pin 1 or external-clock input 23 Analog I/O 32-MHz crystal oscillator pin 2 Copyright © 2010–2013, Texas Instruments Incorporated Submit Documentation Feedback 17 Product Folder Links: CC2540F128 CC2540F256 CC2540F128, CC2540F256 SWRS084F – OCTOBER 2010 – REVISED JUNE 2013 www.ti.com BLOCK DIAGRAM A block diagram of the CC2540 is shown in Figure 8. The modules can be roughly divided into one of three categories: CPU-related modules; modules related to power, test, and clock distribution; and radio-related modules. In the following subsections, a short description of each module is given. RESET_N XOSC_Q2 XOSC_Q1 P2_4 P2_3 P2_2 P2_1 P2_0 P1_7 P1_6 P1_5 P1_4 P1_3 P1_2 P1_1 P1_0 P0_7 P0_6 P0_5 P0_4 P0_3 P0_2 P0_1 P0_0 RESET 32-MHz CRYSTAL OSC 32.768-kHz CRYSTAL OSC DEBUG INTERFACE WATCHDOG TIMER CLOCK MUX and CALIBRATION HIGHSPEED RC-OSC 32-kHz RC-OSC SFR Bus ON-CHIP VOLTAGE REGULATOR POWER-ON RESET BROWN OUT VDD (2 V–3.6 V) DCOUPL SLEEP TIMER POWER MANAGEMENT CONTROLLER 8051 CPU CORE PDATA XRAM IRAM SFR DMA UNIFIED IRQ CTRL ANALOG COMPARATOR OP-AMP MEMORY ARBITRATOR DS ADC AUDIO/DC AES ENCRYPTION AND DECRYPTION Radio Arbiter FLASH FLASH FLASH CTRL FIFOCTRL 1 KB SRAM RADIO REGISTERS Link Layer Engine I/O CONTROLLER SFR Bus SYNTH USB_N USB_P USB DEMODULATOR USART 0 USART 1 RECEIVE TIMER 1 (16-Bit) TIMER 2 (BLE LL TIMER) TIMER 3 (8-Bit) TIMER 4 (8-Bit) DIGITAL ANALOG MIXED Figure 8. CC2540 Block Diagram FREQUENCY SYNTHESIZER MODULATOR TRANSMIT RF_P RF_N B0301-05 18 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: CC2540F128 CC2540F256 CC2540F128, CC2540F256 www.ti.com BLOCK DESCRIPTIONS SWRS084F – OCTOBER 2010 – REVISED JUNE 2013 CPU and Memory The 8051 CPU core is a single-cycle 8051-compatible core. It has three different memory access busses (SFR, DATA, and CODE/XDATA), a debug interface, and an 18-input extended interrupt unit. The memory arbiter is at the heart of the system, as it connects the CPU and DMA controller with the physical memories and all peripherals through the SFR bus. The memory arbiter has four memory-access points, access of which can map to one of three physical memories: an SRAM, flash memory, and XREG/SFR registers. It is responsible for performing arbitration and sequencing between simultaneous memory accesses to the same physical memory. The SFR bus is drawn conceptually in Figure 8 as a common bus that connects all hardware peripherals to the memory arbiter. The SFR bus in the block diagram also provides access to the radio registers in the radio register bank, even though these are indeed mapped into XDATA memory space. The 8-KB SRAM maps to the DATA memory space and to parts of the XDATA memory spaces. The SRAM is an ultralow-power SRAM that retains its contents even when the digital part is powered off (power modes 2 and 3). The 128/256 KB flash block provides in-circuit programmable non-volatile program memory for the device, and maps into the CODE and XDATA memory spaces. Peripherals Writing to the flash block is performed through a flash controller that allows page-wise erasure and 4-bytewise programming. See User Guide for details on the flash controller. A versatile five-channel DMA controller is available in the system, accesses memory using the XDATA memory space, and thus has access to all physical memories. Each channel (trigger, priority, transfer mode, addressing mode, source and destination pointers, and transfer count) is configured with DMA descriptors that can be located anywhere in memory. Many of the hardware peripherals (AES core, flash controller, USARTs, timers, ADC interface, etc.) can be used with the DMA controller for efficient operation by performing data transfers between a single SFR or XREG address and flash/SRAM. Each CC2540 contains a unique 48-bit IEEE address that can be used as the public device address for a Bluetooth device. Designers are free to use this address, or provide their own, as described in the Bluetooth specfication. The interrupt controller services a total of 18 interrupt sources, divided into six interrupt groups, each of which is associated with one of four interrupt priorities. I/O and sleep timer interrupt requests are serviced even if the device is in a sleep mode (power modes 1 and 2) by bringing the CC2540 back to the active mode. The debug interface implements a proprietary two-wire serial interface that is used for in-circuit debugging. Through this debug interface, it is possible to erase or program the entire flash memory, control which oscillators are enabled, stop and start execution of the user program, execute instructions on the 8051 core, set code breakpoints, and single-step through instructions in the code. Using these techniques, it is possible to perform incircuit debugging and external flash programming elegantly. The I/O controller is responsible for all general-purpose I/O pins. The CPU can configure whether peripheral modules control certain pins or whether they are under software control, and if so, whether each pin is configured as an input or output and if a pullup or pulldown resistor in the pad is connected. Each peripheral that connects to the I/O pins can choose between two different I/O pin locations to ensure flexibility in various applications. The sleep timer is an ultralow-power timer that can either use an external 32.768-kHz crystal oscillator or an internal 32.753-kHz RC oscillator. The sleep timer runs continuously in all operating modes except power mode 3. Typical applications of this timer are as a real-time counter or as a wake-up timer to get out of power modes 1 or 2. A built-in watchdog timer allows the CC2540 to reset itself if the firmware hangs. When enabled by software, the watchdog timer must be cleared periodically; otherwise, it resets the device when it times out. Copyright © 2010–2013, Texas Instruments Incorporated Submit Documentation Feedback 19 Product Folder Links: CC2540F128 CC2540F256 CC2540F128, CC2540F256 SWRS084F – OCTOBER 2010 – REVISED JUNE 2013 www.ti.com Timer 1 is a 16-bit timer with timer/counter/PWM functionality. It has a programmable prescaler, a 16-bit period value, and five individually programmable counter/capture channels, each with a 16-bit compare value. Each of the counter/capture channels can be used as a PWM output or to capture the timing of edges on input signals. It can also be configured in IR generation mode, where it counts timer 3 periods and the output is ANDed with the output of timer 3 to generate modulated consumer IR signals with minimal CPU interaction. Timer 2 is a 40-bit timer used by the Bluetooth low energy stack. It has a 16-bit counter with a configurable timer period and a 24-bit overflow counter that can be used to keep track of the number of periods that have transpired. A 40-bit capture register is also used to record the exact time at which a start-of-frame delimiter is received/transmitted or the exact time at which transmission ends. There are two 16-bit timer-compare registers and two 24-bit overflow-compare registers that can be used to give exact timing for start of RX or TX to the radio or general interrupts. Timer 3 and timer 4 are 8-bit timers with timer/counter/PWM functionality. They have a programmable prescaler, an 8-bit period value, and one programmable counter channel with an 8-bit compare value. Each of the counter channels can be used as PWM output. USART 0 and USART 1 are each configurable as either an SPI master/slave or a UART. They provide double buffering on both RX and TX and hardware flow control and are thus well suited to high-throughput full-duplex applications. Each USART has its own high-precision baud-rate generator, thus leaving the ordinary timers free for other uses. When configured as SPI slaves, the USARTs sample the input signal using SCK directly instead of using some oversampling scheme, and are thus well-suited for high data rates. The AES encryption/decryption core allows the user to encrypt and decrypt data using the AES algorithm with 128-bit keys. The AES core also supports ECB, CBC, CFB, OFB, CTR, and CBC-MAC, as well as hardware support for CCM. The ADC supports 7 to 12 bits of resolution with a corresponding range of bandwidths from 30-kHz to 4-kHz, respectively. DC and audio conversions with up to eight input channels (I/O controller pins) are possible. The inputs can be selected as single-ended or differential. The reference voltage can be internal, AVDD, or a singleended or differential external signal. The ADC also has a temperature-sensor input channel. The ADC can automate the process of periodic sampling or conversion over a sequence of channels. The operational amplifier is intended to provide front-end buffering and gain for the ADC. Both inputs as well as the output are available on pins, so the feedback network is fully customizable. A chopper-stabilized mode is available for applications that need good accuracy with high gain. The ultralow-power analog comparator enables applications to wake up from PM2 or PM3 based on an analog signal. Both inputs are brought out to pins; the reference voltage must be provided externally. The comparator output is connected to the I/O controller interrupt detector and can be treated by the MCU as a regular I/O pin interrupt. 20 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: CC2540F128 CC2540F256 CC2540F128, CC2540F256 www.ti.com SWRS084F – OCTOBER 2010 – REVISED JUNE 2013 TYPICAL CHARACTERISTICS RX CURRENT IN WAIT FOR SYNC vs TEMPERATURE 20.5 32.5 Gain = Standard Setting Input = -70 dBm VCC = 3 V 20 32 TX CURRENT vs TEMPERATURE TX Power Setting = 4 dBm VCC = 3 V Current (mA) Current (mA) 19.5 31.5 19 31 Level (dBm) 18.5 -40 -20 0 20 40 60 80 Temperature (°C) G001 Figure 9. RX SENSITIVITY vs TEMPERATURE -83 -84 Gain = Standard Setting VCC = 3 V -85 -86 -87 -88 -89 -90 -91 -92 -40 -20 0 20 40 60 Temperature (°C) Figure 11. 80 G003 19.7 19.68 19.66 19.64 RX CURRENT IN WAIT FOR SYNC vs SUPPLY VOLTAGE Gain = Standard Setting Input = -70 dBm TA = 25°C 19.62 19.6 19.58 19.56 19.54 19.52 19.5 2 2.2 2.4 2.6 2.8 3 3.2 3.4 Supply Voltage (V) Figure 13. 3.6 G005 Current (mA) Level (dBm) 30.5 -40 -20 0 20 40 60 80 Temperature (°C) G002 Figure 10. TX POWER vs TEMPERATURE 7 TX Power Setting = 4 dBm 6 VCC = 3 V 5 4 3 2 1 0 -40 -20 0 20 40 60 80 Temperature (°C) G004 Figure 12. TX CURRENT vs SUPPLY VOLTAGE 32 31.9 TA = 25°C TX Power Setting = 4 dBm 31.8 31.7 31.6 31.5 31.4 31.3 31.2 31.1 31 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 Supply Voltage (V) G006 Figure 14. Current (mA) Copyright © 2010–2013, Texas Instruments Incorporated Submit Documentation Feedback 21 Product Folder Links: CC2540F128 CC2540F256 CC2540F128, CC2540F256 SWRS084F – OCTOBER 2010 – REVISED JUNE 2013 Level (dBm) Level (dBm) TYPICAL CHARACTERISTICS (continued) RX SENSITIVITY vs SUPPLY VOLTAGE TX POWER vs SUPPLY VOLTAGE -87 5 -87.2 Gain = Standard Setting TA = 25°C -87.4 4.8 TA = 25°C TX Power Setting = 4 dBm 4.6 -87.6 4.4 -87.8 4.2 -88 4 -88.2 3.8 -88.4 3.6 -88.6 3.4 -88.8 3.2 -89 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 Supply Voltage (V) G007 Figure 15. 3 2 2.2 2.4 2.6 2.8 3 3.2 Supply Voltage (V) Figure 16. www.ti.com 3.4 3.6 G008 Level (dBm) Rejection (dB) -87 -87.2 -87.4 -87.6 RX SENSITIVITY vs FREQUENCY Gain = Standard Setting TA = 25°C VCC = 3 V -87.8 -88 -88.2 -88.4 -88.6 -88.8 -89 2400 2410 2420 2430 2440 2450 2460 Frequency (MHz) Figure 17. 2470 2480 G009 RX INTERFERER REJECTION (SELECTIVITY) vs INTERFERER FREQUENCY 60 50 40 30 20 10 0 -10 2400 2410 2420 Gain = Standard Setting TA = 25°C VCC = 3 V Wanted Signal at 2426 MHz with -67 dBm Level 2430 2440 2450 2460 2470 2480 Frequency (MHz) G010 Figure 18. Level (dBm) TX POWER vs FREQUENCY 5 4.8 TA = 25°C TX Power Setting = 4 dBm 4.6 VCC = 3 V 4.4 4.2 4 3.8 3.6 3.4 3.2 3 2400 2410 2420 2430 2440 2450 2460 Frequency (MHz) Figure 19. 2470 2480 G011 22 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: CC2540F128 CC2540F256 CC2540F128, CC2540F256 www.ti.com SWRS084F – OCTOBER 2010 – REVISED JUNE 2013 TYPICAL CHARACTERISTICS (continued) Table 1. Output Power and Current Consumption(1)(2) Typical Output Power (dBm) 4 0 –6 –23 Typical Current Consumption (mA) 32 27 24 21 Typical Current Consumption With TPS62730 (mA) 24.6 21 18.5 16.5 (1) Measured on Texas Instruments CC2540 EM reference design with TA = 25°C, VDD = 3 V and fc = 2440 MHz. See SWRU191 for recommended register settings (2) Measured on Texas Instruments CC2540TPS62730 EM reference design with TA = 25°C, VDD = 3 V and fc = 2440 MHz. See SWRU191 for recommended register settings Current (mA) Current Savings (%) Current (mA) Current Savings (%) TYPICAL CURRENT SAVINGS CC2540 Current Consumption TX 4dBm 35 40 CC2540 Current Consumption RX SG CLKCONMOD0x80 25 40 30 35 35 30 20 25 30 25 20 15 20 DC/DC ON 15 DC/DC OFF 15 % Current Savings 10 10 10 5 5 5 25 DC/DC ON 20 DC/DC OFF Current Savings 15 10 5 0 2.1 2.4 2.7 3 Supply (V) 0 3.3 3.6 0 2.1 2.4 2.7 3 Supply (V) 0 3.3 3.6 Figure 20. Current Savings in TX at Room Temperature Figure 21. Current Savings in RX at Room Temperature The application note (SWRA365) has information regarding the CC2540 and TPS62730 como board and the current savings that can be achieved using the como board. Copyright © 2010–2013, Texas Instruments Incorporated Submit Documentation Feedback 23 Product Folder Links: CC2540F128 CC2540F256 CC2540F128, CC2540F256 SWRS084F – OCTOBER 2010 – REVISED JUNE 2013 APPLICATION INFORMATION www.ti.com Few external components are required for the operation of the CC2540. A typical application circuit is shown in Figure 22. 32-kHz Crystal(1) 2-V to 3.6-V Power Supply C401 C331 XTAL2 C321 DCOUPL 40 DVDD1 39 P1_6 38 P1_7 37 P2_0 36 P2_1 35 P2_2 34 P2_3/XOSC32K_Q2 33 P2_4/XOSC32K_Q1 32 AVDD6 31 1 DGND_USB 2 USB_P 3 USB_N 4 DVDD_USB 5 P1_5 6 P1_4 7 P1_3 8 P1_2 9 P1_1 10 DVDD2 CC2540 DIE ATTACH PAD RBIAS 30 AVDD4 29 AVDD1 28 AVDD2 27 RF_N 26 RF_P 25 AVDD3 24 XOSC_Q2 23 XOSC_Q1 22 AVDD5 21 R301 L251 C251 C252 C261 L261 C262 Antenna (50 W) L252 L253 C253 11 P1_0 12 P0_7 13 P0_6 14 P0_5 15 P0_4 16 P0_3 17 P0_2 18 P0_1 19 P0_0 20 RESET_N Power Supply Decoupling Capacitors are Not Shown Digital I/O Not Connected C221 XTAL1 C231 (1) 32-kHz crystal is mandatory when running the chip in low-power modes, except if the link layer is in the standby state (Vol. 6 Part B Section 1.1 in [1]). NOTE: Different antenna alternatives will be provided as reference designs. Figure 22. CC2540 Application Circuit S0383-03 Table 2. Overview of External Components (Excluding Supply Decoupling Capacitors) Component C221 C231 C251 C252 C253 C261 C262 C321 C331 Description 32-MHz xtal loading capacitor 32-MHz xtal loading capacitor Part of the RF matching network Part of the RF matching network Part of the RF matching network Part of the RF matching network Part of the RF matching network 32-kHz xtal loading capacitor 32-kHz xtal loading capacitor Value 12 pF 12 pF 18 pF 1 pF 1 pF 18 pF 1 pF 15 pF 15 pF 24 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: CC2540F128 CC2540F256 CC2540F128, CC2540F256 www.ti.com SWRS084F – OCTOBER 2010 – REVISED JUNE 2013 Table 2. Overview of External Components (Excluding Supply Decoupling Capacitors) (continued) Component C401 L251 L252 L253 L261 R301 Description Decoupling capacitor for the internal digital regulator Part of the RF matching network Part of the RF matching network Part of the RF matching network Part of the RF matching network Resistor used for internal biasing Value 1 µF 2 nH 1 nH 3 nH 2 nH 56 kΩ Input/Output Matching When using an unbalanced antenna such as a monopole, a balun should be used to optimize performance. The balun can be implemented using low-cost discrete inductors and capacitors. The recommended balun shown consists of C262, L261, C252, and L252. Crystal An external 32-MHz crystal, XTAL1, with two loading capacitors (C221 and C231) is used for the 32-MHz crystal oscillator. See 32-MHz CRYSTAL OSCILLATOR for details. The load capacitance seen by the 32-MHz crystal is given by: CL = 1 1 1 + Cparasitic C221 + C231 (1) XTAL2 is an optional 32.768-kHz crystal, with two loading capacitors (C321 and C331) used for the 32.768-kHz crystal oscillator. The 32.768-kHz crystal oscillator is used in applications where both very low sleep-current consumption and accurate wake-up times are needed. The load capacitance seen by the 32.768-kHz crystal is given by: CL = 1 1 1 + Cparasitic C321 + C331 (2) A series resistor may be used to comply with the ESR requirement. On-Chip 1.8-V Voltage Regulator Decoupling The 1.8-V on-chip voltage regulator supplies the 1.8-V digital logic. This regulator requires a decoupling capacitor (C401) for stable operation. Power-Supply Decoupling and Filtering Proper power-supply decoupling must be used for optimum performance. The placement and size of the decoupling capacitors and the power supply filtering are very important to achieve the best performance in an application. TI provides a compact reference design that should be followed very closely. References 1. Bluetooth® Core Technical Specification document, version 4.0 http://www.bluetooth.com/SiteCollectionDocuments/Core_V40.zip 2. CC253x System-on-Chip Solution for 2.4-GHz IEEE 802.15.4 and ZigBee® Applications/CC2540 System-on- Chip Solution for 2.4-GHz Bluetooth low energy Applications (SWRU191) 3. Current Savings in CC254x Using the TPS62730 (SWRA365) Copyright © 2010–2013, Texas Instruments Incorporated Submit Documentation Feedback 25 Product Folder Links: CC2540F128 CC2540F256 CC2540F128, CC2540F256 SWRS084F – OCTOBER 2010 – REVISED JUNE 2013 www.ti.com Additional Information Texas Instruments offers a wide selection of cost-effective, low-power RF solutions for proprietary and standardbased wireless applications for use in industrial and consumer applications. Our selection includes RF transceivers, RF transmitters, RF front ends, and System-on-Chips as well as various software solutions for the sub-1- and 2.4-GHz frequency bands. In addition, Texas Instruments provides a large selection of support collateral such as development tools, technical documentation, reference designs, application expertise, customer support, third-party and university programs. The Low-Power RF E2E Online Community provides technical support forums, videos and blogs, and the chance to interact with fellow engineers from all over the world. With a broad selection of product solutions, end application possibilities, and a range of technical support, Texas Instruments offers the broadest low-power RF portfolio. We make RF easy! The following subsections point to where to find more information. Texas Instruments Low-Power RF Web Site • Forums, videos, and blogs • RF design help • E2E interaction Join us today at www.ti.com/lprf-forum. Texas Instruments Low-Power RF Developer Network Texas Instruments has launched an extensive network of low-power RF development partners to help customers speed up their application development. The network consists of recommended companies, RF consultants, and independent design houses that provide a series of hardware module products and design services, including: • RF circuit, low-power RF, and ZigBee® design services • Low-power RF and ZigBee module solutions and development tools • RF certification services and RF circuit manufacturing Need help with modules, engineering services or development tools? Search the Low-Power RF Developer Network tool to find a suitable partner. www.ti.com/lprfnetwork Low-Power RF eNewsletter The Low-Power RF eNewsletter keeps the user up-to-date on new products, news releases, developers’ news, and other news and events associated with low-power RF products from TI. The Low-Power RF eNewsletter articles include links to get more online information. Sign up today on www.ti.com/lprfnewsletter 26 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: CC2540F128 CC2540F256 CC2540F128, CC2540F256 www.ti.com REVISION HISTORY SWRS084F – OCTOBER 2010 – REVISED JUNE 2013 Changes from Revision Original (October 2010) to Revision A Page • Changed several items in Features list ................................................................................................................................ 1 • Changed upper limit of storage temperature range .............................................................................................................. 4 • Changed ESD rating for charged-device model ................................................................................................................... 4 • Changed adjacent-channel rejection from 5 dB to –5 dB ..................................................................................................... 5 Changes from Revision A (May 2011) to Revision B Page • Added the TPS62730 Compatible Features List .................................................................................................................. 1 • Added the CC2540 WITH TPS62730 Applications .............................................................................................................. 2 • Added CURRENT CONSUMPTION WITH TPS62730 characteristics ................................................................................ 6 • Changed Table 1 ................................................................................................................................................................ 23 • Added the TYPICAL CURRENT SAVINGS section ........................................................................................................... 23 Changes from Revision B (July 2011) to Revision C Page • Changed on page 2, under CC2540...item 2 from Application Run Time to Battery Lifetime .............................................. 2 • Corrected block diagram ....................................................................................................................................................... 3 • In the OP-AMP CHARACTERISTICS table, changed several values in the TYP column ................................................... 9 Changes from Revision C (November 2011) to Revision D Page • Changed the Temperature coefficient Unit value From: mV/°C To: / 0.1°C ......................................................................... 8 • Changed Figure 22 text From: Optional 32-kHz Crystal To: 32-kHz Crystal ..................................................................... 24 Changes from Revision D (August 2012) to Revision E Page • Changed the "Internal reference voltage" TYP value From 1.15 V To: 1.24 V .................................................................. 11 Changes from Revision E (November 2012) to Revision F Page • Changed the RF TRANSMIT SECTION, Output power TYP value From: –20 To: –23 ....................................................... 6 • Changed the RF TRANSMIT SECTION, Programmable output power range TYP value From: 24 To: 27 ........................ 6 Copyright © 2010–2013, Texas Instruments Incorporated Submit Documentation Feedback 27 Product Folder Links: CC2540F128 CC2540F256 PACKAGE OPTION ADDENDUM www.ti.com 5-Feb-2014 PACKAGING INFORMATION Orderable Device CC2540F128RHAR CC2540F128RHAT CC2540F256RHAR CC2540F256RHAT Status Package Type Package Pins Package Eco Plan (1) Drawing Qty (2) ACTIVE VQFN RHA 40 2500 Green (RoHS & no Sb/Br) ACTIVE VQFN RHA 40 250 Green (RoHS & no Sb/Br) ACTIVE VQFN RHA 40 2500 Green (RoHS & no Sb/Br) ACTIVE VQFN RHA 40 250 Green (RoHS & no Sb/Br) Lead/Ball Finish (6) CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU MSL Peak Temp Op Temp (°C) (3) Level-3-260C-168 HR Level-3-260C-168 HR Level-3-260C-168 HR Level-3-260C-168 HR (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. Device Marking (4/5) CC2540 F128 CC2540 F128 CC2540 F256 CC2540 F256 (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Samples Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 5-Feb-2014 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 www.ti.com TAPE AND REEL INFORMATION PACKAGE MATERIALS INFORMATION 10-Mar-2014 *All dimensions are nominal Device Package Package Pins Type Drawing CC2540F128RHAR CC2540F128RHAT CC2540F256RHAR CC2540F256RHAT VQFN RHA 40 VQFN RHA 40 VQFN RHA 40 VQFN RHA 40 SPQ 2500 250 2500 250 Reel Reel A0 B0 K0 P1 W Pin1 Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1 (mm) 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q2 180.0 16.4 6.3 6.3 1.5 12.0 16.0 Q2 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q2 180.0 16.4 6.3 6.3 1.5 12.0 16.0 Q2 Pack Materials-Page 1 www.ti.com PACKAGE MATERIALS INFORMATION 10-Mar-2014 *All dimensions are nominal Device CC2540F128RHAR CC2540F128RHAT CC2540F256RHAR CC2540F256RHAT Package Type VQFN VQFN VQFN VQFN Package Drawing Pins RHA 40 RHA 40 RHA 40 RHA 40 SPQ 2500 250 2500 250 Length (mm) 336.6 213.0 336.6 213.0 Width (mm) 336.6 191.0 336.6 191.0 Height (mm) 28.6 55.0 28.6 55.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2014, Texas Instruments Incorporated

    Top_arrow
    回到顶部
    EEWORLD下载中心所有资源均来自网友分享,如有侵权,请发送举报邮件到客服邮箱bbs_service@eeworld.com.cn 或通过站内短信息或QQ:273568022联系管理员 高进,我们会尽快处理。