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    Wideband 4 GHz, 43 dB Isolation at 1 GHz, CMOS 1.65 V to 2.75 V, 2:1 Mux/SPDT ADG918/ADG919 FEATURES Wideband switch: −3 dB @ 4 GHz Absorptive/reflective switches High off isolation (43 dB @ 1 GHz) Low insertion loss (0.8 dB @1 GHz) Single 1.65 V to 2.75 V power supply CMOS/LVTTL control logic 8-lead MSOP and tiny 3 mm × 3 mm LFCSP packages Low power consumption (<1 μA) APPLICATIONS Wireless communications General-purpose RF switching Dual-band applications High speed filter selection Digital transceiver front end switch IF switching Tuner modules Antenna diversity switching GENERAL DESCRIPTION The ADG918/ADG919 are wideband switches using a CMOS process to provide high isolation and low insertion loss to 1 GHz. The ADG918 is an absorptive (matched) switch having 50 Ω terminated shunt legs, whereas the ADG919 is a reflective switch. These devices are designed such that the isolation is high over the dc to 1 GHz frequency range. They have on-board CMOS control logic, thus eliminating the need for external controlling circuitry. The control inputs are both CMOS and ISOLATION (dB) 0 VDD = 2.5V –10 TA = 25°C –20 –30 –40 –50 S12 –60 –70 –80 –90 S21 –100 10k 100k 1M 10M 100M 1G 10G FREQUENCY (Hz) Figure 2. Off Isolation vs. Frequency FUNCTIONAL BLOCK DIAGRAMS ADG918 RF1 RFC CTRL 50Ω RF2 50Ω ADG919 RF1 RFC RF2 CTRL 03335-001 Figure 1. LVTTL compatible. The low power consumption of these CMOS devices makes them ideally suited to wireless and general-purpose high frequency switching applications. PRODUCT HIGHLIGHTS 1. –43 dB off isolation @ 1 GHz. 2. 0.8 dB insertion loss @ 1 GHz. 3. Tiny 8-lead MSOP/LFCSP packages. –0.4 –0.6 –0.8 –1.0 –1.2 –1.4 –1.6 –1.8 –2.0 –2.2 –2.4 –2.6 –2.8 VDD = 2.5V –3.0 TA = 25°C –3.2 10k 100k 1M 10M 100M 1G 10G FREQUENCY (Hz) Figure 3. Insertion Loss vs. Frequency 03335-003 INSERTION LOSS (dB) 03335-004 Rev. C Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2003–2008 Analog Devices, Inc. All rights reserved. IMPORTANT LINKS for the ADG918_919* Last content update 08/17/2013 12:38 am PARAMETRIC SELECTION TABLES Choosing the Correct Switch or Multiplexer for Your Application Switches and Multiplexers Product Selection Guide DOCUMENTATION AN-952: ADG9xx Wideband CMOS Switches: Frequently Asked Questions AN-282: Fundamentals of Sampled Data Systems CN-0211: IF Band-Pass Filter Bank Switching Network for Wireless Infrastructure Use Circuits from the Lab™ in Your Next Design CMOS Switches Offer High Performance in Low Power, Wideband Applications RF Source Booklet EVALUATION KITS & SYMBOLS & FOOTPRINTS View the Evaluation Boards and Kits page for the ADG918 View the Evaluation Boards and Kits page for the ADG919 Symbols and Footprints for the ADG918 Symbols and Footprints for the ADG919 DESIGN COLLABORATION COMMUNITY Collaborate Online with the ADI support team and other designers about select ADI products. Follow us on Twitter: www.twitter.com/ADI_News Like us on Facebook: www.facebook.com/AnalogDevicesInc DESIGN SUPPORT Submit your support request here: Linear and Data Converters Embedded Processing and DSP Telephone our Customer Interaction Centers toll free: Americas: 1-800-262-5643 Europe: 00800-266-822-82 China: 4006-100-006 India: 1800-419-0108 Russia: 8-800-555-45-90 Quality and Reliability Lead(Pb)-Free Data SAMPLE & BUY ADG918 ADG919 View Price & Packaging Request Evaluation Board Request Samples Check Inventory & Purchase Find Local Distributors Powered by TCPDF (www.tcpdf.org) * This page was dynamically generated by Analog Devices, Inc. and inserted into this data sheet. Note: Dynamic changes to the content on this page (labeled 'Important Links') does not constitute a change to the revision number of the product data sheet. This content may be frequently modified. ADG918/ADG919 TABLE OF CONTENTS Features .............................................................................................. 1 Applications....................................................................................... 1 Functional Block Diagrams............................................................. 1 General Description ......................................................................... 1 Product Highlights ........................................................................... 1 Revision History ............................................................................... 2 Specifications..................................................................................... 3 Absolute Maximum Ratings............................................................ 5 ESD Caution.................................................................................. 5 Pin Configuration and Function Descriptions............................. 6 Typical Performance Characteristics ............................................. 7 REVISION HISTORY 9/08—Rev. B to Rev. C Changes to Ordering Guide .......................................................... 16 8/08—Rev. A to Rev. B Changes to Table 1, AC Electrical Characteristics, Third Order Intermodulation Intercept............................................................... 3 Updated Outline Dimensions ....................................................... 15 Changes to Ordering Guide .......................................................... 16 Terminology .................................................................................... 10 Test Circuits..................................................................................... 11 Applications Information .............................................................. 13 Absorptive vs. Reflective Switch............................................... 13 Wireless Metering....................................................................... 13 Tuner Modules............................................................................ 13 Filter Selection ............................................................................ 13 ADG9xx Evaluation Board ........................................................... 14 Outline Dimensions ....................................................................... 15 Ordering Guide .......................................................................... 16 9/04—Changed from Rev. 0 to Rev. A Updated Format..................................................................Universal Change to Data Sheet Title...............................................................1 Change to Features ............................................................................1 Change to Product Highlights .........................................................1 Changes to Specifications.................................................................3 Change to ADG9xx Evaluation Board section........................... 13 Changes to Ordering Guide .......................................................... 14 8/03 Revision 0: Initial Version Rev. C | Page 2 of 16 ADG918/ADG919 SPECIFICATIONS VDD = 1.65 V to 2.75 V, GND = 0 V, input power = 0 dBm, all specifications TMIN to T , MAX unless otherwise noted. Temperature range for B Version: −40°C to +85°C. Table 1. Parameter AC ELECTRICAL CHARACTERISTICS Operating Frequency2 3 dB Frequency3 Input Power3 Insertion Loss Isolation—RFC to RF1/RF2 (CP Package) Isolation—RFC to RF1/RF2 (RM Package) Isolation—RF1 to RF2 (Crosstalk) (CP Package) Isolation—RF1 to RF2 (Crosstalk) (RM Package) Return Loss (On Channel)3 Return Loss (Off Channel)3 ADG918 On Switching Time3 Off Switching Time3 Rise Time3 Fall Time3 1 dB Compression3 Third Order Intermodulation Intercept Video Feedthrough4 DC ELECTRICAL CHARACTERISTICS Input High Voltage Input Low Voltage Input Leakage Current Symbol Conditions S21, S12 S21, S12 S21, S12 S21, S12 S21, S12 S11, S22 S11, S22 tON tOFF tRISE tFALL P–1 dB IP3 0 V dc bias 0.5 V dc bias DC to 100 MHz; VDD = 2.5 V ± 10% 500 MHz; VDD = 2.5 V ± 10% 1000 MHz; VDD = 2.5 V ± 10% 100 MHz 500 MHz 1000 MHz 100 MHz 500 MHz 1000 MHz 100 MHz 500 MHz 1000 MHz 100 MHz 500 MHz 1000 MHz DC to 100 MHz 500 MHz 1000 MHz DC to 100 MHz 500 MHz 1000 MHz 50% CTRL to 90% RF 50% CTRL to 10% RF 10% to 90% RF 90% to 10% RF 1000 MHz 900 MHz/901 MHz, 4 dBm VINH VDD = 2.25 V to 2.75 V VINH VDD = 1.65 V to 1.95 V VINL VDD = 2.25 V to 2.75 V VINL VDD = 1.65 V to 1.95 V II 0 V ≤ VIN ≤ 2.75 V B Version Min Typ 1 Max Unit dc 0.4 0.5 0.8 57 60 46 49 36 43 55 60 43 47 34 37 55 58 41 44 31 37 54 57 39 42 31 33 21 27 22 27 22 26 18 23 17 21 16 20 6.6 6.5 6.1 6.1 17 28.5 36 2.5 2 GHz 4 GHz 7 dBm 16 dBm 0.7 dB 0.8 dB 1.25 dB dB dB dB dB dB dB dB dB dB dB dB dB 10 ns 9.5 ns 9 ns 9 ns dBm dBm mV p-p 1.7 0.65 VCC ± 0.1 V V 0.7 V 0.35 VCC V ±1 μA Rev. C | Page 3 of 16 ADG918/ADG919 Parameter CAPACITANCE3 RF On Capacitance CTRL Input Capacitance POWER REQUIREMENTS VDD Quiescent Power Supply Current Symbol Conditions CRF ON CCTRL f = 1 MHz f = 1 MHz IDD Digital inputs = 0 V or VDD B Version Min Typ 1 Max Unit 1.6 pF 2 pF 1.65 0.1 2.75 V 1 μA 1 Typical values are at VDD = 2.5 V and 25°C, unless otherwise stated. 2 Point at which insertion loss degrades by 1 dB. 3 Guaranteed by design, not subject to production test. 4 The dc transience at the output of any port of the switch when the control voltage is switched from high to low or low to high in a 50 Ω test setup, measured with 1 ns rise time pulses and 500 MHz bandwidth. Rev. C | Page 4 of 16 ABSOLUTE MAXIMUM RATINGS TA = 25°C, unless otherwise noted. Table 2. Parameter Rating VDD to GND Inputs to GND Continuous Current Input Power Operating Temperature Range Industrial (B Version) Storage Temperature Range Junction Temperature MSOP Package θJA Thermal Impedance LFCSP Package θJA Thermal Impedance (2-layer board) θJA Thermal Impedance (4-layer board) Lead Temperature, Soldering (10 sec) IR Reflow, Peak Temperature (<20 sec) ESD –0.5 V to +4 V –0.5 V to VDD + 0.3 V1 30 mA 18 dBm –40°C to +85°C –65°C to +150°C 150°C 206°C/W 84°C/W 48°C/W 300°C 235°C 1 kV 1RF1 and RF2 off port inputs to ground: −0.5 V to VDD – 0.5 V. ADG918/ADG919 Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ESD CAUTION Rev. C | Page 5 of 16 ADG918/ADG919 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS VDD 1 ADG918/ 8 RF1 CTRL 2 ADG919 7 GND GND 3 TOP VIEW 6 GND RFC 4 (Not to Scale) 5 RF2 Figure 4. 8-Lead MSOP (RM-8) and 8-Lead 3 mm x 3 mm LFCSP (CP-8); Exposed Pad Tied to Substrate, GND 03335-002 Table 3. Pin Function Descriptions Pin No. Mnemonic Function 1 VDD Power Supply Input. These parts can be operated from 1.65 V to 2.75 V, and VDD should be decoupled to GND. 2 CTRL Logic Control Input. See Table 4. 3, 6, 7 GND Ground Reference Point for All Circuitry on the Part. 4 RFC COMMON RF Port for Switch. 5 RF2 RF2 Port. 8 RF1 RF1 Port. Table 4. Truth Table CTRL Signal Path 0 RF2 to RFC 1 RF1 to RFC Rev. C | Page 6 of 16 TYPICAL PERFORMANCE CHARACTERISTICS INSERTION LOSS (dB) INSERTION LOSS (dB) –0.2 –0.4 –0.6 –0.8 VDD = 2.25V –1.0 VDD = 2.5V VDD = 2.75V –1.2 –1.4 –1.6 –1.8 –2.0 –2.2 –2.4 –2.6 –2.8 –3.0 TA = 25°C –3.2 10k 100k 1M 10M 100M 1G 10G FREQUENCY (Hz) Figure 5. Insertion Loss vs. Frequency over Supplies (RF1/RF2, S12, and S21) –0.30 –0.35 VDD = 2.75V –0.40 –0.45 –0.50 –0.55 VDD = 2.25V VDD = 2.5V –0.60 –0.65 –0.70 –0.75 TA = 25°C –0.80 10k 100k 1M 10M 100M 1G 10G FREQUENCY (Hz) Figure 6. Insertion Loss vs. Frequency over Supplies (RF1/RF2, S12, and S21) (Zoomed Figure 5 Plot) –0.2 –0.4 –0.6 –0.8 –1.0 VDD = 1.8V VDD = 1.65V VDD = 1.95V –1.2 –1.4 –1.6 –1.8 –2.0 –2.2 –2.4 –2.6 –2.8 –3.0 TA = 25°C –3.2 10k 100k 1M 10M 100M 1G 10G FREQUENCY (Hz) Figure 7. Insertion Loss vs. Frequency over Supplies (RF1/RF2, S12, and S21) INSERTION LOSS (dB) 03335-021 ISOLATION (dB) 03335-019 ISOLATION (dB) 03335-017 INSERTION LOSS (dB) ADG918/ADG919 03335-018 –0.2 –0.4 –0.6 –0.8 +25°C –1.0 –1.2 –1.4 –1.6 –1.8 –2.0 –2.2 –2.4 –2.6 –2.8 –3.0 VDD = 2.5V –3.2 10k 100k +85°C 1M 10M 100M FREQUENCY (Hz) –40°C 1G 10G Figure 8. Insertion Loss vs. Frequency over Temperature (RF1/RF2, S12, and S21) 0 VDD = 1.65V TO 2.75V –10 TA = 25°C –20 –30 –40 S12 –50 –60 –70 –80 S21 –90 10k 100k 1M 10M 100M 1G 10G FREQUENCY (Hz) Figure 9. Isolation vs. Frequency over Supplies (RF1/RF2, ADG918) 0 –10 VDD = 1.65V TO 2.75V TA = 25°C –20 –30 –40 –50 S12 –60 –70 –80 –90 S21 –100 10k 100k 1M 10M 100M 1G 10G FREQUENCY (Hz) Figure 10. Isolation vs. Frequency over Supplies (RF1/RF2, ADG919) 03335-020 03335-022 Rev. C | Page 7 of 16 03335-024 ADG918/ADG919 ISOLATION (dB) –10 VDD = 2.5V –20 –30 –40 S12 (+85°C) –50 –60 S12 (+25°C) –70 S12 (–40°C) –80 –90 S21 –100 (–40°C, +25°C, +85°C) 10k 100k 1M 10M 100M 1G 10G FREQUENCY (Hz) 03335-023 Figure 11. Isolation vs. Frequency over Temperature (RF1/RF2, ADG919) 0 TA = 25°C –5 VDD = 2.5V –10 RETURN LOSS (dB) –15 OFF SWITCH (ADG918) –20 –25 –30 ON SWITCH –35 –40 10k 100k 1M 10M 100M 1G 10G FREQUENCY (Hz) Figure 12. Return Loss vs. Frequency (RF1/RF2, S11) 03335-026 CROSSTALK (dB) –10 –15 TA = 25°C –20 VDD = 2.5V –25 –30 –35 –40 –45 –50 –55 –60 –65 –70 –75 –80 10k 100k 1M 10M 100M 1G 10G FREQUENCY (Hz) Figure 13. Crosstalk vs. Frequency (RF1/RF2, S12, S21) 03335-028 IP3 (dBm) CH1 CH2/3 CH1 = CTRL = 1V/DIV CH2 = RF1 = 100mV/DIV CH3 = RF2 = 100mV/DIV TRISE = 6.1ns TFALL = 6.1ns Figure 14. Switch Timing CTRL RFC CH1 500mV CH2 1mVΩ CH2 p-p 2.002mV m 10.0ns Figure 15. Video Feedthrough 40 35 30 25 20 15 10 5 VDD = 2.5V TA = 25°C 0 250 350 450 550 650 750 850 FREQUENCY (MHz) Figure 16. IP3 vs. Frequency 03335-027 03335-029 Rev. C | Page 8 of 16 P–1dB (dBm) 03335-025 20 18 16 14 12 10 8 6 4 2 VDD = 2.5V TA = 25°C 0 0 250 500 750 1000 1250 1500 FREQUENCY (MHz) Figure 17. P-1 dB vs. Frequency ADG918/ADG919 Rev. C | Page 9 of 16 ADG918/ADG919 TERMINOLOGY VDD Most positive power supply potential. IDD Positive supply current. GND Ground (0 V) reference. CTRL Logic control input. VINL Maximum input voltage for Logic 0. VINH Minimum input voltage for Logic 1. IINL (IINH) Input current of the digital input. CIN Digital input capacitance. tON Delay between applying the digital control input and the output switching on. tOFF Delay between applying the digital control input and the output switching off. tRISE Rise time; time for the RF signal to rise from 10% to 90% of the on level. tFALL Fall time; time for the RF signal to fall from 90% to 10% of the on level. Off Isolation The attenuation between the input and output ports of the switch when the switch control voltage is in the off condition. Insertion Loss The attenuation between the input and output ports of the switch when the switch control voltage is in the on condition. P–1 dB 1 dB compression point. The RF input power level at which the switch insertion loss increases by 1 dB over its low level value. It is a measure of how much power the on switch can handle before the insertion loss increases by 1 dB. IP3 Third order intermodulation intercept. This is a measure of the power in false tones that occur when closely spaced tones are passed through a switch, whereby the nonlinearity of the switch causes these false tones to be generated. Return Loss The amount of reflected power relative to the incident power at a port. Large return loss indicates good matching. By measuring return loss, the VSWR (voltage standing wave ratio) can be calculated from conversion charts. VSWR indicates the degree of matching present at a switch RF port. Video Feedthrough Spurious signals present at the RF ports of the switch when the control voltage is switched from high to low or low to high without an RF signal present. Rev. C | Page 10 of 16 TEST CIRCUITS Setups for the ADG918 are similar. VDD 0.1µF VDD RFC RFx VS CTRL GND VOUT RL 50Ω VCTRL VOUT 50% 90% 50% 10% tON tOFF Figure 18. Switch Timing: tON, tOFF VDD 0.1µF VDD RFC VS CTRL RFx VOUT 50% 50% RL 50Ω VCTRL 10% VOUT 90% 90% 10% GND tRISE Figure 19. Switch tFALL VDD 0.1µF RFC CTRL VCTRL VDD ADG919 RF1 50Ω VS RL VOUT 50Ω RF2 50Ω NETWORK ANALYZER GND OFF ISOLATION = 20log VOUT VS Figure 20. Off Isolation 03335-011 03335-010 03335-009 ADG918/ADG919 03335-012 VDD 0.1µF VDD ADG919 RFC RF1 50Ω VOUT RL 50Ω NETWORK ANALYZER CTRL VCTRL GND RF2 50Ω VS VOUT INSERTION LOSS = 20log VS Figure 21. Insertion Loss VDD 0.1µF RFC 50Ω CTRL VCTRL VDD ADG919 RF1 RF2 GND VOUT CROSSTALK = 20log VS Figure 22. Crosstalk NETWORK ANALYZER 50Ω VS VOUT RL 50Ω VDD 0.1µF OSCILLOSCOPE RFC CTRL VCTRL VDD ADG919 NC RF1 GND NC RF2 Figure 23. Video Feedthrough 03335-013 03335-014 Rev. C | Page 11 of 16 ADG918/ADG919 VDD 0.1µF SPECTRUM ANALYZER RFC CTRL VCTRL VDD ADG919 RF1 50Ω RF SOURCE GND COMBINER RF2 RF SOURCE Figure 24. IP3 VDD 0.1µF SPECTRUM ANALYZER RFC CTRL VCTRL VDD ADG919 RF1 50Ω GND RF RF2 SOURCE VS Figure 25. P-1 dB 03335-015 03335-016 Rev. C | Page 12 of 16 APPLICATIONS INFORMATION The ADG918/ADG919 are ideal solutions for low power, high frequency applications. The low insertion loss, high isolation between ports, low distortion, and low current consumption of these parts make them excellent solutions for many high frequency switching applications. The most obvious application is in a transmit/receive block, as shown in the wireless metering block diagram in Figure 26. Other applications include switching between high frequency filters, an ASK generator, an FSK generator, and an antenna diversity switch in many tuner modules. ABSORPTIVE VS. REFLECTIVE SWITCH The ADG918 is an absorptive (matched) switch with 50 Ω terminated shunt legs, and the ADG919 is a reflective switch with 0 Ω terminated shunts to ground. The ADG918 absorptive switch has a good VSWR on each port, regardless of the switch mode. An absorptive switch should be used when there is a need for a good VSWR that is looking into the port but not passing the through signal to the common port. The ADG918 is therefore ideal for applications that require minimum reflections back to the RF source. It also ensures that the maximum power is transferred to the load. The ADG919 reflective switch is suitable for applications where high off port VSWR does not matter and the switch has some other desired performance feature. It can be used in many applications, including high speed filter selection. In most cases, an absorptive switch can be used instead of a reflective switch, but not vice versa. WIRELESS METERING The ADG918 can be used in wireless metering applications. It can be used in conjunction with the ADF7020 transceiver IC for ADG918/ADG919 a utility metering transceiver application, providing the required isolation between the transmit and receive signals. The SPDT configuration isolates the high frequency receive signal from the high frequency transmit. ANTENNA LNA ADG918 03335-005 TX/RX SWITCH PA Figure 26. Wireless Metering TUNER MODULES The ADG918 can be used in a tuner module to switch between the cable TV input and the off-air antenna. This part is also ideal for use as an antenna diversity switch, switching different antenna to the tuner. VGA 03335-006 ANTENNA CABLE ADG918/ ADG919 TUNER Figure 27. Tuner Modules FILTER SELECTION The ADG919 can be used as a 2:1 demultiplex to switch high frequency signals between different filters and also to multiplex the signal to the output. RFIN RFC ADG919 RF1 RF2 RF1 RF2 ADG919 RFOUT RFC 03335-007 Figure 28. Filter Selection Rev. C | Page 13 of 16 ADG918/ADG919 ADG9xx EVALUATION BOARD The ADG9xx evaluation board allows designers to evaluate the high performance wideband switches with a minimum of effort. In addition to the evaluation board, the user requires only a power supply and a network analyzer. An application note is available with the evaluation board and gives complete information about operating the evaluation board. The RFC port (see Figure 29) is connected through a 50 Ω transmission line to the top left SMA connector J1. RF1 and RF2 are connected through 50 Ω transmission lines to the top two SMA connectors, J2 and J3 respectively. A through transmission line connects J4 and J5 and is used to estimate the loss of the PCB over the environmental conditions being evaluated. The board is constructed of a 4-layer, FR4 material with a dielectric constant of 4.3 and an overall thickness of 0.062 inches. Two ground layers with grounded planes provide ground for the RF transmission lines. The transmission lines were designed using a coplanar waveguide with ground plane model using a trace width of 0.052 inches, a clearance to ground plane of 0.030 inches, a dielectric thickness of 0.029 inches, and a metal thickness of 0.014 inches. Figure 29. ADG9xx Evaluation Board Top View 03335-008 Rev. C | Page 14 of 16 OUTLINE DIMENSIONS 3.20 3.00 2.80 8 3.20 3.00 2.80 1 5 5.15 4.90 4.65 4 PIN 1 0.65 BSC 0.95 0.85 1.10 MAX 0.75 0.15 0.38 0.00 0.22 0.80 0.23 0.08 8° 0° 0.60 0.40 COPLANARITY SEATING 0.10 PLANE COMPLIANT TO JEDEC STANDARDS MO-187-AA Figure 30. 8-Lead Mini Small Outline Package [MSOP] (RM-8) Dimensions shown in millimeters PIN 1 INDICATOR 3.25 3.00 SQ 2.75 TOP VIEW 0.60 MAX 0.60 MAX 0.50 BSC 2.95 2.75 SQ 2.55 5 8 EXPOSED PAD (BOTTOM VIEW) 1.60 1.45 1.30 12° MAX 0.90 MAX 0.85 NOM SEATING PLANE 0.70 MAX 0.65 TYP 0.30 0.23 0.18 0.50 0.40 0.30 0.05 MAX 0.01 NOM 0.20 REF 4 1 PIN 1 1.89 INDICATOR 1.74 1.59 EXPOSED PAD IS CONNECTED INTERNAL LY. FOR INCREASED RELIABILIT Y OF THE SOLDER JOINTS AND MAXIMUM THERMAL CAPABILITY IT IS RECOMMENDED THAT THE PAD BE SOLDERED TO THE GROUND PLANE. Figure 31. 8-Lead Lead Frame Chip Scale Package [LFCSP_VD] 3 mm x 3 mm Body, Very Thin, Dual Lead (CP-8-2) Dimensions shown in millimeters 061507-B ADG918/ADG919 Rev. C | Page 15 of 16 ADG918/ADG919 ORDERING GUIDE Model ADG918BRM ADG918BRM-500RL7 ADG918BRM-REEL ADG918BRM-REEL7 ADG918BRMZ1 ADG918BRMZ-500RL71 ADG918BRMZ-REEL1 ADG918BRMZ-REEL71 ADG918BCP-500RL7 ADG918BCP-REEL7 ADG918BCPZ-500RL71 ADG918BCPZ-REEL71 ADG919BRM ADG919BRM-500RL7 ADG919BRM-REEL ADG919BRM-REEL7 ADG919BRMZ1 ADG919BRMZ-REEL1 ADG919BRMZ-REEL71 ADG919BCP-500RL7 ADG919BCP-REEL7 ADG919BCPZ-REEL71 EVAL-ADG918EBZ1 EVAL-ADG919EBZ1 Temperature Range –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C Package Description 8-Lead Mini Small Outline Package (MSOP) 8-Lead Mini Small Outline Package (MSOP) 8-Lead Mini Small Outline Package (MSOP) 8-Lead Mini Small Outline Package (MSOP) 8-Lead Mini Small Outline Package (MSOP) 8-Lead Mini Small Outline Package (MSOP) 8-Lead Mini Small Outline Package (MSOP) 8-Lead Mini Small Outline Package (MSOP) 8-Lead Lead Frame Chip Scale Package (LFCSP_VD) 8-Lead Lead Frame Chip Scale Package (LFCSP_VD) 8-Lead Lead Frame Chip Scale Package (LFCSP_VD) 8-Lead Lead Frame Chip Scale Package (LFCSP_VD) 8-Lead Mini Small Outline Package (MSOP) 8-Lead Mini Small Outline Package (MSOP) 8-Lead Mini Small Outline Package (MSOP) 8-Lead Mini Small Outline Package (MSOP) 8-Lead Mini Small Outline Package (MSOP) 8-Lead Mini Small Outline Package (MSOP) 8-Lead Mini Small Outline Package (MSOP) 8-Lead Lead Frame Chip Scale Package (LFCSP_VD) 8-Lead Lead Frame Chip Scale Package (LFCSP_VD) 8-Lead Lead Frame Chip Scale Package (LFCSP_VD) Evaluation Board Evaluation Board Package Option RM-8 RM-8 RM-8 RM-8 RM-8 RM-8 RM-8 RM-8 CP-8-2 CP-8-2 CP-8-2 CP-8-2 RM-8 RM-8 RM-8 RM-8 RM-8 RM-8 RM-8 CP-8-2 CP-8-2 CP-8-2 1 Z = RoHS Compliant Part, # denotes RoHS compliant product, may be top or bottom marked. Branding W4B W4B W4B W4B W4B# W4B# W4B# W4B# W4B W4B W4B# W4B# W5B W5B W5B W5B S1X S1X S1X W5B W5B S1X ©2003–2008 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D03335-0-9/08(C) Rev. C | Page 16 of 16

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