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智能建筑与物联网解决方案 英文版

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安森美半导体智能建筑与物联网解决方案 英文版

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Smart Building/Internet-of-Things Boost / Flyback Converters & Battery Management System Power Management Energy Harvester Battery Sensors • Image • Light • Proximity • Touch • Temperature Processor / MCU Non-Volatile Memory & Security Motor Control Connectivity Wireless Wired • ZigBee • S-FSK • KNX • M-BUS • HART • 6loWPAN • Proprietary • Seamlessly connected intelligent devices that sense, analyze and control the environment •Connected smart lighting, surveillance/security systems, HVAC systems, home appliances, energy management systems, vehicles, traffic control • Key building blocks include sensors/actuators, ultra low power MCUs/DSPs, connectivity, power management, security and software, chip integration and micro-packaging Page 2 Internet of Things Solutions Broad Packaging Portfolio ON Semiconductor offers advanced packaging and integration capabilities, ranging from chip scale packaging through multichip modules. This extensive portfolio of packaging technology helps customers solve their unique design challenges related to thermal performance, power density, and low profile. Shown below is a small sample from the company’s broad and deep package portfolio. PACKAGING PIM DPAK 6.0 x 6.5 mm SO8-FL 5.0 x 6.0 x 1.0 mm SOT-883 XDFN-4 1.0 x 0.6 x 0.4 mm 0.8 x 0.8 x 0.4 mm IPM Advanced 3D Packaging Custom 3D packaging connects different silicon die and discrete components together in the same package to dramatically save space and improve electrical performance by decreasing signal distances. •Stacking with or without wirebonds •Modular, scalable architectures with high degree of manufacturing testability •Mature, robust technologies and structures •RoHS-compliant and ISO-certified Capacitors AYRE SA3291 - Wireless DSP SiP for Hearing Aids Die Interposer Solder Pads Flip Chip Connections Top Substrate Solder Connections Main Substrate ON Semiconductor Page 3 CONNECTIVITY 2.4 GHz IEEE 802.15.4-2006 Wireless Transceiver Low power, fully integrated system-on-chip for secure wireless connectivity Features • Integrates ARM® Cortex-M3 32-bit µP, 640kB FLASH, 48 kB RAM, hardware accelerated MAC • AES 256 / 128 encryption engine • Peripherals: DMA, UART (x2), SPI (x2), I2C (x2), PWM, RTC, WDT, 18 GPIO, 10-bit ADC, programmable timers (x3), temperature sensor, supply voltage sensor • Programmable transmit power (up to ~8 dBm) • Receiver sensitivity less than –99 dBm • Antennae diversity • Supports external LNA & PA • <0.5 µA Timed Coma Mode Current • 6.9 mW Transmit Mode Power Consumption • 6.6 mW Receive Mode Power Consumption • VDD includes low voltage mode with operation down to 1.0 V Software Ecosystem • 2.4 GHz IEEE 802.15.4-2006 certified MAC/PHY • ZigBee PRO support included (ZHA, ZSE 1.x, ZLL, etc.) • ZigBee IP support included (SE 2.0) • 802.15.4-2006 compatible applications • Partner program for design services & support VPA RFPWR TX RX 32MO 32MI 32KO 32KI RESETN V3V V1VO V1VI FVDDHO FVDDHI INTERRUPT AND WAKEUP CONTROL ARM CORTEX −M3 NCS 36510 Instruction Data I−code BUS MATRIX D−code DMA 320 kB FLASH A 320 kB FLASH B 16 kB SRAM A 16 kB SRAM B 16 kB SRAM C System Bus AHB to APB BRIDGE SERIAL WIRE DEBUG SWDIO SWDCLK SWO SWD_RESET TEST MODES RADIO FLASH CONTROL TIMERS POWER SEQ MODULATOR DEMODULATOR MAC RF ANALOG CONTROL CLOCK CTRL PMU 32 kHz 32 MHz DVDDA DVDD AVDDn FVDDL RVDDn WATCH DOG RTC RESET CTRL PAD CONTROL UART 1 UART 2 SPI 1 SPI 2 I2C 1 I2C 2 GPIO PWM SUPPLY MONITOR SAR ADC TEMP SENSOR C R O S S B A R MUX 128 AES RANDOM NUMBER GENERATOR DIO[13] DIO[12] DIO[11 ] RESETN TEST VDDIO DIO[17:0] A[3:0] NCS36510 Block Diagram Page 4 Internet of Things Solutions XTAL_IN XTAL_OUT VSSA VSS CONNECTIVITY PLC Modems/Power Line Driver MAINS 12 V D1 R10 D2 C10 C11 D3 D4 Tr 1:2 C8 R8 12 V C9 VCC VEE R6 R7 3V3_D C6 C7 3V3_A C16 VDDA 3V3_D C17 VDD R12 NCS5651 R5 R4 TX_OUT C4 C3 Vcom Vwarn GNDuC R9 Rlim C5 3V3_D R14 R2 R3 C2 C1 TX_ENB RX_OUT RX_IN NCN49597 T_REQ TXD RXD BR0 BR1 RESB Application & Metering μC VDD1V8 3 V 3_A D5 R11 R1 CDREF REF_OUT ZC_IN C12 C13 C15 SEN EXT_CLK_E C14 Device Smart Grid Modem NCN49599 NCN49597 Smart Metering AMIS49587 Modem Power Amplifier NCS5651 Function PLC S-FSK Modem; A - D Band PLC S-FSK Modem; A - D Band PLC S-FSK Modem; A & B Band • ARM Cortex M0 • Baud rate: 4800 Bauds • S-FSK modulation • ARM Cortex M0 • Baud rate: 4800 Bauds • ARM7TDMi, 24 MHz core • Baud rate: 2400 Bauds Features • Hardware embedded MAC + PHY • Embedded 1.2 A, 2-stage power amplifier with current limitation and thermal protection • S-FSK modulation • Hardware embedded MAC + PHY • S-FSK modulation • Hardware embedded MAC + PHY Power Line Driver; Class AB • Low distortion power line driver with optimized interface for PLC modems • Capability to drive 2.0 A peak into reactive loads • Current shutdown minimizes power consumption during power down state • Rail-to-Rail Drop of Only ±1 V with Iout = 1.5 A Package(s) QFN-56 QFN-52 QFN-52 QFN-20 EP ON Semiconductor Page 5 CONNECTIVITY KNX Transceivers KNX is a standardized (EN 50090, ISO/IEC 14543), OSI-based network communications protocol for intelligent buildings. KNX is the successor to, and convergence of, three previous standards: the European Home Systems Protocol (EHS), BatiBUS, and the European Installation Bus (EIB or Instabus). KNX Open Standards • EN 50090: European Standard • ISO/IEC 14543-3: International Standard • GB/Z 20965: Chinese Standard • ANSI/ASHRAE 135: US Standard Applications • Connects appliances and sensors, especially for climate and light control to the 9600 Baud KNX twisted pair (TP) bus inside a building • TP bus provides data communication and power supply Device DC=DC Converters 20 V Fixed 3.3 V Adj 3.3 to 21 V Regulator NCN5120 4 4 4 Note 1: LLC = Logical Link Control layer of the OSI-based communications network. Embedded MAC + LLC1 4 KNX Host Interface Digital SPI/UART Analog UART 4 4 Package QFN-40 Main Distribution 230 V TP (Twisted Pair) Physical Communication Media Switch Lighting Sun Blinds 230 V PL (Power-Line) Heating Monitoring 230 V RF (Radio Frequency) or IR (Infrared) Washing Oven Machine Page 6 Internet of Things Solutions Wired M-BUS Transceiver Features • Satisfies physical requirements for M-BUS, described in EN 13757-2 and EN 1434-3 • UART communication speeds up to 38400 baud • Integrated 3.3 V VDD LDO regulator (extended peak current of 15 mA) • Supports powering slave device from the bus or from external power supply • SOIC-16 and QFN-20 packages CVDD μC VS VIO VDD TXI TX RX RXI PFb RIS NCN5150 BUSL2 VB BUSL1 RBUS1 TVS1 RBUS2 SC GND RIDD STC RIS CSC RIDD CSTC MBUS General Application Diagram CONNECTIVITY ON Semiconductor Page 7 CONNECTIVITY Process Sensor Modems AMIS-49200 & AMIS-49250 Fieldbus Physical Layer Medium Access Units • Compatible to both FOUNDATION Fieldbus H1 (Type 111 and Type 112 per FF-816) and PROFIBUS PA standards • Enables Fieldbus to completely power field devices using the integrated power supply block • Data rate: 31.25 kbps voltage mode • Low current consumption 500 μA typ • LQFP-44 and NQFP-44 packages Microprocessor with RAM and ROM Link Controller Fieldbus MAU Fieldbus Segment Industrial HART Protocol Modems • Single-chip, half-duplex 1200 bps FSK modem • Bell 202 shift frequencies of 1200 Hz and 2200 Hz • Transmit-signal wave shaping • Receive band-pass filter HART Modems Input Device Frequency NCN5193 460.8 kHz, 920 kHz,or 1.8 MHz NCN5192 460.8 kHz, 920 kHz,or 1.8 MHz A5191HRT 460.8 kHz Temp Range DAC (°C) Package Integrated 16-bit Sigma-Delta –40 to +85 QFN-32 Integrated 16-bit Sigma-Delta –40 to +85 QFN-32 External –40 to +85 QFN-32, LQFP-32, PLCC-28 VDDA 1.8 V − 3.5 V RESET VPOR KICK VDD VDDA RxAFI RxAF RxAP RxAN μC RxD CD TxD RTS CS DATA SCLK 3.6864 MHz CLK1 CLK2 XOUT XIN NCN5193 CBIAS VSS MODE AREF CDREF TxA DAC JUMP DACREF TEST2 TEST1 HART IN VDDA VDDA HART & 4 – 20 mA OUT Page 8 Internet of Things Solutions CONNECTIVITY CAN Transceivers for Long Networks, >500 m VBAT Features • ISO 11898-2 compliant • Up to 1 Mb/s communication speed • Delivers low transmit data rate in networks exceeding 1 km • Functional in 12 V and 24 V systems 5 V−reg CD 100 nF CAN BUS 1 VCC Vref EN1 10 12 8 13 CANH1 EN2 2 Rx0 7 Tx0 4 Text 3 AMIS–42770 RLT 14 CANL1 60 19 CANH2 RLT Rint 9 5 6 15 16 17 18 CANL2 60 GND CAN BUS 2 CAN Transceivers Device Type AMIS42770 Dual AMIS42670 Single AMIS42671 Single AMIS42673 Single AMIS42675 Single Description High-Speed CAN Repeater High-Speed CAN Transceiver for Long Networks High-Speed CAN Transceiver for Long Networks High-Speed CAN Transceiver for Long Networks High-Speed CAN Transceiver for Long Networks Package SOIC-20 SOIC-8 SOIC-8 SOIC-8 SOIC-8 ON Semiconductor Page 9 CONNECTIVITY Motion Detector Passive Infrared Controller (PIR) — NCS36000 •Passive infrared controller circuit for the lighting and occupancy sensing market •Amplifies and conditions signal from PIR sensor Features • 3.0 – 5.75 V operation • Integrated low noise 2-stage amplifiers • Internal voltage reference to drive sensor • Internal oscillator with external RC • Single or dual pulse detection • Digital filter to minimize false alarms • Direct drive of LED and relay Benefits • Lower BOM cost than comparable discrete solutions • Extremely flexible solution • Customer can customize digital filtering • Customer can customize analog processing • Designed for wide range of occupancy sensors VREF OP1_P OP1_N OP1_O OP2_N OP2_O OSC VSS VDD LDO & Voltage 2 References Amplifier Circuit Window 2 Comparator System Oscillator Digital Control Circuit MODE xLED_EN LED OUT NCS36000 Old Solution NCS36000 Solution Page 10 Internet of Things Solutions 1SMA58A CONNECTIVITY Power-Over-Ethernet (PoE) Controllers Features – NCP1083 NCP1083, consisting of fully compliant PoE functionality and DC-DC controller, may be used to drive LED lamps. Additionally, lamps may be controlled remotely through PoE. • Emits white color of ~2700°K • LED lamp overall maximum power output 33 W • Peak efficiency ~89% • LED lamp powered by PSE directly over NCP1083 load switch circuitry; DC-DC controller can provide 3.3 V, 5 V or 15 V power supply IEEE 802.3at + Auxiliary, 40 W • Auxiliary input voltage range from 9.0 V to 57 V • Integrated DC-DC converter controller implements highly efficient power conversion at low output voltages in conjunction with auxiliary voltage input • LED drivers operate in buck operation mode, switching frequency about 1.05 MHz, PWM dimming frequency 16 kHz • DC-DC controller working frequency up to 500 kHz, flyback topology used • Under-voltage startup level set to 38 V, or programmble down to 8.5 V; current limit 970 mA • Delivers 25.5 W for PoE+ IEEE 802.3at and up to 40 W in proprietary applications • Supports IEEE two event classification • Best-in-class cable ESD and thermal characteristics VAUX(+) Data Pairs Spare Pins MBRS1100 VPORTP CLASS VDDL INRUSH NCP1083 ILIM1 nCLASS_AT UVLO GATE AUX VPORTIN RTN COMP VAUX(–) MBRS1100 VOUT TL431 Device NCP1080 NCP1081 NCP1082 NCP1083 NCP1090 NCP1091 NCP1092 NCP1093 NCP1094 Description PoE-PD Controller and DC-DC Converter PoE-PD Controller and DC-DC Converter PoE-PD Controller and DC-DC Converter, with Auxiliary Supply Support PoE-PD Controller and DC-DC Converter, with Auxiliary Supply Support PoE-PD Interface Controller PoE-PD Interface Controller with Programmable UVLO PoE-PD Interface Controller with Vaux Support PoE-PD Interface Controller PoE-PD Interface Controller with Vaux Support Topology Flyback Flyback Flyback Flyback — — — — — Control Mode Current Current Current Current — — — — — VCC Min (V) 0 0 0 0 0 0 0 0 0 VCC Max (V) 57 57 57 57 57 57 57 57 57 Pd Typ (W) 15 40 15 40 15 15 15 25 25 Ron Typ (Ω) 0.6 0.6 0.6 0.6 0.5 0.5 0.5 0.5 0.5 Package TSSOP-20 TSSOP-20 TSSOP-20 TSSOP-20 SOIC-8, TSSOP-8 SOIC-8, TSSOP-8 SOIC-8, TSSOP-8 DFN-10 DFN-10 ON Semiconductor Page 11 CONNECTIVITY Features • ISO & EMV compliance • ESD protection on card pins up to +8kV (Human Body Model) Smart Card Interfaces Microcontroller DATAPORT CONTROL VDD 100 uF VDD R1 R2 VDDP 10 uF 100 nF VDDP VDD INT NCN8024R PORADJ CMDVCC 5V/3V CLKDIV1 CLKDIV2 CLKIN CRD_PRES CRD_PRES 100 nF CRD_VCC CRD_RST CRD_CLK CRD_AUX1 CRD_AUX2 CRD_IO 220 GND nF RSTIN I/Ouc AUX1uc AUX2uc CRD_GND GNDP GND GND SMART CARD DET DET GND 1 2 3 4 Vcc RST CLK C4 GND Vpp I/O C8 5 GND 6 7 8 Device NCN6001 Smart Card NCN8024R NCN8025/A (SAM/SIM) NCN8026 (SAM/SIM) SAM NCN4555 Ports 1 1 1/3 1 1 Control Interface SPI Parallel Parallel Parallel Parallel Card Type A, B, C A, B A, B, C A, B, C B, C VDD mC Interface Power (V) Supply Sequencer 2.7 – 5.5 Inductive DC-DC Yes Card Detect Yes 2.7 – 5.5 LDO Yes Yes 2.7 – 5.5 LDO Yes Yes 1.6 – 5.5 LDO Yes Yes 1.8 – 5.5 LDO No No Clock Divider Yes Standards Package(s) ISO7816; EMV4.3 TSSOP-20, TLLGA-20 Yes ISO7816; EMV4.3 SOIC-28W Yes ISO7816; EMV4.3; UICC QFN-16, QFN-24 Yes ISO7816; EMV4.3; UICC; SIM QFN-24 No UICC; SIM QFN-16 Page 12 NCN8024R Demo Board Internet of Things Solutions Mainstream CMOS Image Sensors Device MT9V115 MT9V124 ASX350AT ASX340AT ASX340CS MT9V128 MT9V024 MT9V034 ARX550AT AR0140AT AR0140CS AR0141 AR0130 AR0132AT AR0134 MT9M021/31 MT9M024/34 MT9M114 MT9M001 MT9D131 AR0261 AR0262CP AS0260 AR0331 AR0330 AR0543 MT9P004 MT9P006 MT9P031 AR0842CP AR0833 AR0835 MT9J003 AR1011HS AR1335 MT9F002 AR1820HS Sensor/ SOC SOC SOC SOC SOC SOC SOC Sensor Sensor Sensor Sensor Sensor Sensor Sensor Sensor Sensor Sensor Sensor SOC Sensor SOC Sensor Sensor SOC Sensor Sensor Sensor Sensor Sensor Sensor Sensor Sensor Sensor Sensor Sensor Sensor Sensor Sensor Resolution (MP) VGA VGA VGA VGA VGA VGA WVGA WVGA 0.5 1.0 1.2 1.2 1.2 1.2 1.2 1.2 1.2 1.3 1.3 1.9 2.1 2.1 2.1 3.1 3.5 5.0 5.0 5.0 5.0 8.0 8.0 8.0 10 10 13 14 18 Optical Format 1/13” 1/13” 1/5” 1/4” 1/4” 1/3” 1/3” 1/3” 1/5” 1/4” 1/4” 1/4” 1/3” 1/3” 1/3” 1/3” 1/3” 1/6” 1/2” 1/3.2” 1/6” 1/6” 1/6” 1/3” 1/3” 1/4” 1/3.2” 1/2.5” 1/2.5” 1/4” 1/3.2” 1/3.2” 1/2.3” 1” 1/3.2” 1/2.3” 1/2.3” 1. ERS = Electronic Rolling Shutter, GRR = Global Reset Release, GS = Global Shutter Frame Rate 30 fps 30 fps 60 fps digital, 30 fps analog 60 fps digital, 30 fps analog 60 fps 60 fps 60 fps 60 fps 66 fps 60 fps 1.2 45 fps, 720p60 1.2 45 fps, 720p60 1.2 45 fps, 720p60 1.2 45 fps, 720p 60 fps 1.2 54 fps, 720p60 1.2 45 fps, 720p60 1.2 45 fps, 720p60 1.3 30 fps, VGA 75 fps 30 fps 1.9 15 fps, SVGA 30 fps 1080p60 1080p 60 fps 30 fps 1080p60 1080p60 5 15 fps, 1080P 30fps 5 15 fps, 1080p30 5 15 fps, 720p60 5 15 fps, 720p60 8 30fps, 1080P 30fps 8 30 fps, 1080P 30fps 8 42 fps, 1080P 60fps 10 15 fps, 1080p60 60 fps 13 30 FPS, 1080p 60 fps 14 13 fps 18 24 fps, 1080p 120 fps Pixel Size (mm) Shutter Type1 1.8 ERS 1.8 ERS 3.8 ERS 5.6 ERS 5.6 ERS 6.0 ERS 6.0 GS 6.0 GS 3.8 ERS 3.0 ERS 3.0 ERS 3.0 ERS 3.8 ERS 3.8 ERS 3.8 GS 3.8 GS 3.8 ERS 1.9 ERS 5.2 ERS 2.8 ERS 1.4 ERS 1.4 ERS 1.4 ERS 2.2 ERS, GRR 2.2 ERS, GRR 1.4 ERS 1.8 ERS, GRR 2.2 ERS, GRR 2.2 ERS, GRR 1.1 ERS 1.4 ERS, GRR 1.4 ERS, GRR 1.7 ERS, GRR 3.4 ERS 1.1 ERS 1.4 ERS, GRR 1.3 ERS, GRR CFA Color Color Color Color Color Color Color, Mono, RCCC Color, Mono Color, RCCC Color Color Color, Mono Color, Mono Color, Mono, RCCC Color, Mono Mono Color, Mono Color Mono Color Color Clarity+ Color Color Color Color Color Color Color, Mono Clarity+ Color Color Color, Mono Color Color Color Color Operating Temp (°C) -30 to +70 -30 to +70 -40 to +105 -40 to +105 -30 to +70 -40 to +105 -40 to +105 -30 to +70 -40 to +105 -40 to +105 -30 to +85 -30 to +85 -30 to +70 -40 to +105 -30 to +70 -30 to +70 -30 to +70 -30 to +70 0 to +70 -30 to +70 -30 to +70 -30 to +70 -30 to +70 -30 to +85 -30 to +70 -30 to +70 -30 to +70 -30 to +70 -30 to +70 -30 to +70 -30 to +70 -30 to +70 -30 to +70 -30 to +70 -30 to +70 -30 to +70 -30 to +70 SENSING ON Semiconductor Page 13 Co-Processors for Mainstream CMOS Image Sensors Automotive/Industrial Co-Processors AP0100 Applications Home Security, Surveillance, Automotive Sensors Supported MT9M024/34, AR0130, AR0140CS, AR0132AT, AR0140AT, ARX550AT Maximum Resolution 1.2 MP Frame Rate 1.2 MP 45 fps 720p60 Demosaic Gamma correction Auto white balance Color Pipe Features Defect correction Noise reduction Auto exposure Flicker detection HDR with ALTM YES Dewarp (Yes or No) YES Up to 165 degrees Spatial Transform Engine Software Add-on YES, Multiple viewing options, PTZ Overlays YES GPIOs Up to 5 Sensor Interfaces 2-lane HiSPi, 12-bit parallel Output Interfaces NTSC/PAL, 16-bit parallel Input Clock 6-30 MHz Output Clock 27 MHz (NTSC/PAL) 84 MHz parallel Operating Temp –30 to +70°C (CS Version) –40 to +105°C (AT Version) Package VFBGA-100 AP0101 Home Security, Surveillance, Automotive MT9M024/34, AR0140CS, AR0132AT, AR0140AT, ARX550AT 1.2 MP 1.2 MP 45 fps Demosaic Gamma correction Auto white balance Defect correction Noise reduction Auto exposure Flicker detection YES NO NO NO Up to 5 12-bit parallel 16-bit parallel 6-30 MHz 84 MHz parallel –30 to +70°C (CS Version) –40 to +105°C (AT Version) VFBGA-81 Mobile Applications Co-Processors AP1302 Full Featured Image Processor Main Camera Up to 13 MP @ 30 fps Secondary Camera Up to 1080 @ 60 fps MobileHDR Support 4 Clarity+ Processing 4 Bayer Output 4 JPEG Output 4 YUV Output 4 Gamma Correction 4 Face Detection/ Smile Detection 4 SENSING Page 14 Internet of Things Solutions Internet of Things (IoT) Video Development Kit for Home Automation – smart lock, home security, smart lighting, smart door bell, smart appliances Features • 1080p, Video on Demand (VOD), Live Streaming, Cloud Connectivity, WiFi, BLE, Ethernet, remote control of device, Android and ios app for control, open source APIs • Based on AR0230 (2MP/1080p) – Superior Low Light, Flexible interfaces (Parallel, HiSpi), High Dynamic Range • Pending 2Q15 Major Components ON Semiconductor AR0230 Gainspan Wi-Fi Module Bluetooth Module TI DM368 PIR Motion Sensor Microphone LEDs USB Port Battery Storage Description 2 MP/1080p CMOS image sensor with superior low light performance GS2011M module streams data over Wi-Fi Noridc BLE nRF51822 ARM9 core, high performance digital media system on chip Triggers camera functions on motion detection Omnidirectional microphones For power, video streaming Provides power to board, firmware upgrades 4200 mAH Lithium-ion battery Micro SD card slot SENSING ON Semiconductor Page 15 Interline Transfer CCD Image Sensors With an integrated electronic shutter, Interline Transfer CCD image sensors provide real time imaging in applications where a mechanical shutter or strobe illumination is either not required or desired. With progressive scan readouts, they are particularly well suited for machine vision, microscopy, fluoroscopy, and other applications that demand the highest imaging performance. All 5.5 mm and most 7.4 mm devices share common pin-out and electrical connections, allowing a single camera design to support a full family of products. SENSING Features • Progressive scan with electronic shutter and anti-blooming support • High resolution • High sensitivity • Low image lag and smear 5.5 mm Interline Transfer CCD Image Sensors Resolution Pixel Diagonal Device (MPix) Pixel Count (mm) (mm) KAI-0330 VGA 648 x 484 9 7.3 KAI-0340 VGA 640 x 480 7.4 5.9 KAI-0373 WVGA 768 x 484 11.6 x 13.6 11.1 KAI-011502 0.9 1280 x 720 5.5 8.1 KAI-1003 1 1024 x 1024 12.8 18.5 KAI-1010 1 1008 x 1018 9 12.9 KAI-1020 1 1000 x 1000 7.4 10.5 KAI-010502 1 1024 x 1024 5.5 8 KAI-2001 1.9 1600 x 1200 7.4 14.8 KAI-2020 1.9 1600 x 1200 7.4 14.8 KAI-020502 1.9 1600 x 1200 5.5 11.1 KAI-021702 2.1 1920 x 1080 7.4 16.3 KAI-021502 2.1 1920 x 1080 5.5 12.1 KAI-040702 4.2 2048 x 2048 7.4 21.4 KAI-040502 4.1 2336 x 1752 5.5 16.1 KAI-080512 8.1 3296 x 2472 5.5 22.7 KAI-11002 10.7 4008 x 2672 9 43.4 KAI-16000 15.8 4872 x 3248 7.4 43.3 KAI-160502 16 4896 x 3264 5.5 32.4 KAI-160702 15.7 4864 x 3232 7.4 43.2 KAI-290502 28.8 6576 x 4384 5.5 43.5 1. CFA Options – Bayer Color (C), Monochrome (M), and TRUESENSE Sparse CFA (S). 2. Pin and Electrically Compatible Lens 1/2” 1/3” 2/3” 1/2” 4/3” 1” 2/3” 1/2” 1” 1” 2/3” 1” 2/3” 4/3” 1” 4/3” 35 mm 35 mm APS-H 35 mm 35 mm CFA1 C/M C/M C/M C/M/S M M C/M C/M C/M C/M C/M C/M/S C/M/S C/M/S C/M/S C/M/S C/M C/M C/M/S C/M/S C/M/S FPS Max 120 210 30 138 30 30 50 120 30 30 68 60 64 28 32 16 5 3 8 8 4 Evaluation Kit 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 Page 16 Internet of Things Solutions Full Frame CCD Image Sensors From the intricacies of microscopy to the far reaches of astrophotography, Full Frame CCD image sensors deliver high performance results. With high quantum efficiency across the entire visible spectrum, these sensors are ideal for demanding imaging applications that can accommodate a mechanical shutter or strobe illumination, such as electronic still photography, medical X-ray, and inspection. Features • High resolution • Support for large sensor formats • Simple, two-phase clocking • Very low dark current for long exposures • Vertical and horizontal binning Device Resolution (MPix) KAF-0261 VGA KAF-0402 WVGA KAF-1001 1 KAF-1603 1.6 KAF-3200 3.3 KAF-4320 4.3 KAF-6303 6.3 KAF-8300 8.3 KAF-09000 9.3 KAF-16801 16.8 KAF-16803 16.8 KAF-40000 40 KAF-50100 50.1 1. CFA Options – Bayer Color (C), Monochrome (M). Pixel Count 512 x 512 768 x 512 1024 x 1024 1536 x 1024 2184 x 1510 2084 x 2084 3088 x 2056 3326 x 2504 3056 x 3056 4096 x 4096 4096 x 4096 7304 x 5478 8176 x 6132 Pixel (mm) 20 9 24 9 6.8 24 9 5.4 12 9 9 6 6 Full Frame CCD Image Sensors Diagonal (mm) 14.5 8.3 34.8 16.6 18 70.7 33.4 22.5 51.9 52.1 52.1 54.8 61.3 Lens 1” 1/2" APS-H 1” 4/3” 645 APS-H 4/3” 645 1.3x 645 1.3x 645 1.3x 645 1.3x 645 1.1x CFA1 M M M M M M M C/M M M M C C/M FPS Max 15 20 3 2.2 2.5 2 0.6 2.9 0.4 0.4 0.2 1.3 1 Evaluation Kit 3 3 3 3 3 3 3 3 3 SENSING ON Semiconductor Page 17 Linear CCD Image Sensors Linear CCD image sensors combine high resolution with high dynamic range, making them ideal for use in applications such as flatbed scanners, high-speed document scanners and copiers, machine vision cameras, and satellite imaging. Features • High dynamic range • Pinned photodiodes for low lag and low dark current • Channel independent electronic exposure control • Single output per color, including multi-readout register architectures • High data rates Linear CCD Image Sensors Device Pixel Count KLI-2104 4196 x 1, 2098 x 3 KLI-2113 2098 x 3 KLI-4104 8160 x 1, 4080 x 3 KLI-8023 8002 x 3 1. CFA Options – Bayer Color (C), Monochrome (M). Pixel (mm) 7.0, 14.0 14 5.0, 10.0 9 Diagonal (mm) 29.4 29.4 40.8 72 CFA1 Luma+C C/M Luma+C/M C/M Evaluation Kit 3 3 3 SENSING Page 18 Internet of Things Solutions High Sensitivity CMOS Image Sensors With resolutions of 300 K, 500 K and 1.3 Megapixels (MPix) respectively, the PYTHON 300, 500 and 1300 are designed to address the needs of general purpose industrial image sensing applications such as machine vision, inspection and motion monitoring, as well as security and surveillance applications including intelligent transportation systems (ITS). ON Semiconductor’s new global shutter image sensors combine flexibility in configuration and resolution with high speed and high sensitivity for the industrial imaging market. The pixel in these PYTHON sensors allows the capture of fast moving scenes without distortion by combining a read noise of less than 9 e-, with 7.7 V/lux sensitivity and frame rates as high as 850 fps. Features • CDS global shutter technology with single digit noise performance • True HW scalable family concept • High configurability and fast adaptability • High frame rates • Multiple regions of interest • High dynamic range • High NIR sensitivity Device Resolution (MPix) PYTHON 300 0.3 PYTHON 500 0.5 PYTHON 1300 1.3 PYTHON 2000 2 PYTHON 5000 5 1. CFA Options – Bayer Color (C), Monochrome (M). Pixel Count (H x V) 640 x 480 800 x 600 1280 x 1024 1920 x 1200 2592 x 2048 Pixel (mm) 4.8 4.8 4.8 4.8 4.8 Diagonal (mm) 3.8 4.8 7.9 10.9 15.9 Lens ¼” 1/3.6” ½” 2/3” 1” CFA1 C/M C/M C/M C/M C/M FPS Max 840 560 210 245 105 Evaluation Kit 3 3 3 3 3 The KAC-12040 and KAC-06040 CMOS image sensors provide both global shutter and low noise rolling shutter modes, combined with programmable bit depth (8 to 14 bit) with a flexible readout architecture that supports interspersed video streams. This feature enables the use of multiple regions of interest that can simultaneously monitor both wide areas and local regions. These devices are ideal for machine vision, surveillance, ITS, and analytical microscopy. Features • Global shutter, low noise rolling shutter • Programmable bit depth • Interspersed video streams • Multiple regions of interest • High frame rates • High NIR sensitivity KAC-06040 KAC-12040 Device Resolution (MPix) KAC-06040 6 KAC-12040 12 1. CFA Options – Bayer Color (C), Monochrome (M). Pixel Count (H x V) 2832 x 2128 4000 x 3000 Pixel (mm) 4.7 4.7 Diagonal (mm) 16.7 23.5 Lens 1” 4/3” Evaluation CFA1 FPS Max Kit C/M 160 3 C/M 70 3 SENSING ON Semiconductor Page 19 Ambient Light & Proximity Sensors Features • Design flexibility/customization (i.e., EEPROM if desired for trimming) • 0.0125 lux detection with customizable filtering (i.e., Photopic Light Response) • Dark current and temperature compensation • Lowest power consumption per resolution bit • I2C Interface (including High Speed Mode) and no effect on bus during power down Vin = 3.3 V hν 1k VDD SDA Ambient 1 μF Light Sensor VSS SCL 1k SDA MCU SCL LED Drivers LEDs Voltage Supply Approximates Human Eye Response 0.1 μF VCC 16-Bit I2C ADC Bus SCL SD CPU LV0104CS Control Logic GND Simple 2-Wire I2C Interface Voltage Supply 0.1 μF VCC Amp When the Sunlight is Strong, Extending the Dynamic Range by Lowering Gain SW OUT Gain Cont. I/O CPU ADC LA0151CS GND Current-Voltage Conversion Device LA0151CS LA0152CS LV0104CS LV0111CF NOA1212 NOA1305 NOA3302 Special Features 2-Stage Gain Switching Standby Function Integrated Sleep Mode Standby Function Dark Current Compensation Dark Current Compensation Proximity Sensor IO Typ @ EV = 100 Lux (mA) 8 (high gain) 8 21 51 (high gain) - Output Interface Analog, linear current Analog, linear current I2C, 16-bit ADC Analog, logarithmic current Analog, linear current I2C, 16-bit ADC I2C, 16-bit ADC Vin Range (V) 2.2 - 5.5 2.2 - 5.5 2.3 - 3.6 2.3 - 5.5 2 - 5.5 2.4 - 3.6 2.3 - 3.6 TA Range (°C) -30 to +85 -30 to +85 -30 to +85 -30 to +85 -40 to +85 -40 to +85 -40 to +80 Package ODCSP-4 ODCSP-4 ODCSP-4 ODCSP-4J CUDFN-6 CUDFN-6 CWDFN-8 SENSING Page 20 Internet of Things Solutions Capacitive Touch Sensors Design Friendly, Low-Cost Operation, High Reliability • Adhesive free • Long sensor trace • Wide range operational temperature • No extra components • High noise immunity  • Reduce manufacturing cost and improve reliability by eliminating existing adhesive process  • Provide flexible PCB design  • Available in high-temperature environment  • Reduce BOM  • Improve stability and reliability Acrylic Thickness: 3.0 mm Air Gap: 1.5 mm SENSING ON Semiconductor Page 21 Capacitive Touch Sensors Overview The LC717A00/10 is a high-performance and low-cost capacitance-digital-converter LSI for electrostatic capacitive touch sensor, especially focused on usability. It has 8/16 channels of capacitance-sensor input. This makes it ideal for various switch applications. The calibration function and the judgment of ON/OFF are automatically performed internal to the LSI, reducing development time. A detection result (ON/OFF) for each input can be read out by the serial interface (I2C compatible bus or SPI). Moreover, LC717A00 outputs a detection result (ON/OFF) by changing the Pout output level. Also, the measurement value of each input can be read out as 8-bit digital data. Gain and other parameters can also be adjusted via serial interface. Features • Detection system: Differential capacitance detection (mutual capacitance type) • Input capacitance resolution: Can detect capacitance changes in the femto-Farad order • LC717A00 measurement interval (8 differential inputs) • 18 ms typical at initial configuration • 3 ms typical at minimum interval configuration • LC717A10 measurement interval (16 differential inputs) • 30 ms typical at initial configuration • 6 ms typical at minimum interval configuration • External components for measurement: Not required • LC717A00 current consumption: 320 mA typical (VDD = 2.8 V); 740 µA typical (VDD = 5.5 V) • LC717A10 current consumption: 570 mA typical (VDD = 2.8 V); 1.3 mA typical (VDD = 5.5 V) • Supply voltage: 2.6 V to 5.5 V • Detection operations: Switch • Packages: VCT-28 for LC717A00/10AR; SSOP-30 for LC717A00/10AJ • Interface: I2C compatible bus or SPI selectable Cref Cin0 Cin1 Cin2 Cin3 Cin4 Cin5 Cin6 Cin7 nCS SCL/SCK SDA/SI SA/SO MUX 1st AMP 2nd AMP A/D CONVERTER I2C/SPI CONTROL LOGIC POR OSCILLATOR LC717A00 Block Diagram Pout0 Pout1 Pout2 Pout3 Pout4 Pout5 Pout6 Pout7 Cdrv ERROR INTOUT nRST GAIN VDD VSS Cin0 Cin1 Cin2 Cin3 Cin4 Cin5 Cin6 Cin7 Cin8 Cin9 Cin10 Cin11 Cin12 Cin13 Cin14 Cin15 Cref CrefAdd MUX 1st AMP 2nd AMP A/D CONVERTER CONTROL LOGIC MUX POR OSCILLATOR I2C/SPI LC717A10 Block Diagram VDD VSS Cdrv INTOUT nRST nCS SCL/SCK SDA/SI SA0/SO SA1 SENSING Page 22 Internet of Things Solutions Temperature Sensors VDD 3.0 V To 5.5 V CBYPASS A2 5 ADDRESS (SET AS DESIRED) A1 A0 6 7 NCT75 1 SDA 2 SERIAL INTERFACE SCL 3 OS/ALERT 4 GND Typical Application Diagram NOTE: SDA, SCL AND OS/ALERT PINS REQUIRE PULL-UP RESISTORS TO VDD Data Transmission ICC Max VCC Max VCC Min T Min Device Sensor Type Standard (mA) (V) (V) (°C) NCT175 Local SMBus 0.575 3 5.5 -55 NCT203 Local I2C 44 µA 1.6 2.75 -40 NCT275 Local SMBus 0.575 3 5.5 -55 NCT75 Local SMBus 0.575 3 5.5 -55 NCT218 Remote I2C — 1.6 2.75 — NCT210 Local & Remote SMBus 0.37 3 5.5 -65 NCT214 Local & Remote SMBus 0.35 3 3.6 -40 NCT72 Local & Remote I2C 0.35 2.8 3.6 -40 Temperature T Max Error (°C) (°C) Package 125 ±1 Micro8™ 125 ±1.75 WDFN-8, WLCSP-8 125 ±1 WLCSP-6 125 ±1 DFN-8, Micro8, SOIC-8 — — WDFN-8, WLCSP-8 125 ±3 QSOP-16 125 ±1 WDFN-10 125 ±1 DFN-8, WDFN-8 SENSING ON Semiconductor Page 23 JFETs for Infrared (IR) Sensing JFET Thermal Energy 1 D 2 S R 3 G Infrared Sensor for White Goods, Security, and Lighting Device TF412S TF414 2SK3738 2SK3796 2SK545 2SK3666 VGDO Min (V) 30 40 40 30 40 30 IDSS Min (mA) 1.2 0.05 0.05 0.6 0.055 0.6 IDSS Max (mA) 3 0.13 0.13 3 0.095 3 |yfs| Typ (mS) 5 0.11 0.13 6.5 0.13 6.5 Ciss Typ (pF) 4 0.7 1.7 4 1.7 4 Crss Typ (pF) 1.1 0.3 0.7 1.1 0.7 1.1 Package SOT-883 SOT-883 SOT-490 SOT-490 CP (SOT-23) CP (SOT-23) SENSING Page 24 Internet of Things Solutions Device NMLU1210 Full Bridge Rectifier for Wireless Charging Features – NMLU1210 • Full Bridge Rectification block - up of 3.2 A of operation • Low RDS(ON) minimizes conduction losses • Low profile UDFN-8 package (4 x 4 x 0.55 mm) MOSFET SCHOTTKY VLL ID RDS(ON) Max @ VGS = 10 V VR VF IF (V) (A) (W) (V) (A) (A) 20 3.2 0.017 20 0.45 3.2 Package(s) UDFN-8 Vout C1 Vout C2 L1_1 AC Input GND1 A1 A2 D1 D2 S1 G1 G2 S2 GND1 GND2 L1_2 GND2 DC Output AC-DC Drivers + Controller + V/I Sensing Transmitter NMLU1210 AC-DC DC-DC Step Down and Control Receiver POWER MANAGEMENT ON Semiconductor Page 25 LC709203F High Accuracy Fuel Gauge LSI Fuel Gauge for 1 Cell Li+ with Low Power and with No Sense Register Conventional Display With LC709203F Features • Accuracy of remaining capacity ±2.8% (0 ~ +50°C) • Active mode current of 15 μA • Hibernate mode current of 2 μA • Standby mode current (RAM retention) of 0.1 µA • No need for sense register for current detection Standby Time 120 h Call Time 75 min 77% Detailed Display of Remaining Capacity Correct Operating Time 100 100 0°C 90 Room Temp 50°C 90 Ideal 80 80 70 70 60 60 50 50 40 40 30 Load: 50 mA 20 Battery: DB-L50 Typ 1900 mAh 10 30 Room Temp 20 Battery: DB-L50 Typ 1900 mAh 10 0 100 90 80 70 60 50 40 30 20 10 0 Real (%) Ideal vs. Display (by Temperature) 0 100 90 80 70 60 50 40 30 Real (%) Ideal vs. Display (by Load) Discharge Characteristics 500 mA 750 mA 1000 mA 1250 mA 1500 mA Ideal 20 10 0 Disp (%) Disp (%) POWER MANAGEMENT Page 26 Internet of Things Solutions NL Power Supply/Management, Voltage Regulation POWER SUPPLY/MANAGEMENT High Voltage AC-DC Switching Regulator DC-DC Converters LDO Voltage Regulators Device NCP1010~15 NCP1070~77 NCP1027~28 AC-DC NCP1124/26/29 NCP1136* NCP1050~5 NCP3170 NCP3063/4 Function Features Self-Supply High Voltage Monolithic Switching • Dynamic self-supply, no need of an auxiliary winding Regulator for Low Power Offline Power Supplies • Current-mode fixed frequency (options of 65 kHz, 100 kHz, 130 kHz) High Voltage Monolithic Switching Regulator for Medium Power Offline Power Supplies • 700 V, 5.8 W FET current-mode fixed frequency (65 kHz, 100 kHz) • 650 V, 9/6/2 W rugged FET current-mode fixed frequency (65 kHz, 100 kHz) • 800 V, 3.8 W rugged FET current-mode fixed frequency (65 kHz, 100 kHz) High Voltage Gated Oscillator Monolithic Switching Regulator 3 A Switching Regulator 1.5 A Switching Regulator or utilize as controller for up to 5 A • Oscillator frequency (options of 44 kHz, 100 kHz, 136 kHz) dithering with controlled slew rate driver for reduced EMI • Startup circuit eliminates the need for transformer auxiliary bias winding • Output voltage adjustable to 0.8 V • 500 kHz or 1 MHz switching frequency • Capable of 40 V input • Up to 250 kHz switching frequency DC-DC LM2594/5/6 0.5 A/1.0 A/3 A Switching Regulators • Capable of 40 V input • Fixed 150 kHz switching frequency NCP3020/11 NCP1034 * Pending 2Q15. PWM Controller PWM Controller • 4.7-28 V input voltage range • EN/PG/SYNC features • Fixed 300/400/600 kHz switching frequency • Capable of up to 100 V input • Adjustable switching frequency (50-500 kHz) Package PDIP-7, SOT-223 PDIP-7 PDIP-7, SOT-223 SOIC-8 SOIC-8 TO-220, DPAK, SOIC-8, PDIP-8 SOIC-8, TSSOP-14 SOIC-16 POWER MANAGEMENT ON Semiconductor Page 27 Power MOSFETs for Circuit Breakers and Metering Power Supplies AC Input Voltage Features • High reliability • Low power dissipation • Avalanche ruggedness • High-speed switching Rectifier Bridge Driver Transformer/ Primary Side Clamper Circuit Output 1 Output 2 DC Output 1 DC Output 2 Feedback Circuit Low Saturation Voltage BJT for Over Current Sensing Circuit 2SC6144SG: 50 V/10 A TO-220F-3FS 2SC5707: 50 V/8 A TP, TP-FA Power Source Voltage ≤AC 120 V ≤AC 240 V AC 380 V to 480 V AC 590 V to 690 V Device FW276 SF T1423 2SK4196LS 2SK4096LS BFL4036 BFL4037 2SK4085LS 2SK4124 SF T1440 SF T1458 2SK4197FS 2SK4198FS 2SK4099LS 2SK4087LS 2SK4125 2SK4088LS BFL4004 BFL4026 BFL4001 2SK3745LS 2SK4177 2SK3746 2SK3747 2SK3748 NDFPD1N150C NDFP03N150C NDTL03N150C NDUL03N150C NDUL09N150C WPH4003 VDDS ID RDS(ON) (Ω) @ 10 V Ciss Qg G-S Protection (V) (A) Typ Max (pF) (nC) Diode Package 450 0.7 8.6 11.2 55 3.5 Built in SOIC-8 500 2 3.8 4.9 175 8.7 Built in DPAK 500 5.5 1.2 1.56 360 14.6 — TO-220F 500 8 0.65 0.85 600 24 — TO-220F 500 14 0.4 0.52 1000 38.4 Built in TO-220F 500 16 0.33 0.43 1200 48.6 Built in TO-220F 500 16 0.33 0.43 1200 46.6 — TO-220F 500 20 0.33 0.43 1200 — — TO-3P 600 1.5 6.2 8.1 130 6.3 Built in DPAK 600 1 10 13 73 4.7 Built in DPAK 600 3.5 2.5 3.25 260 11 — TO-220F 600 5 1.8 2.34 360 14.3 — TO-220F 600 8.5 0.72 0.94 750 29 — TO-220F 600 14 0.47 0.61 1200 46 — TO-220F 600 17 0.47 0.61 1200 — — TO-3P 650 11 0.65 0.85 1000 37.6 — TO-220F 800 6.5 1.9 2.5 710 36 — TO-220F 900 5 2.8 3.6 650 33 — TO-220F 900 6.5 2.1 2.7 850 44 — TO-220F 1500 2 10 13 380 37.5 Built in TO-220F 1500 2 10 13 380 — Built in TO-263 (D2PAK) 1500 2 10 13 380 — Built in TO-3P 1500 2 10 13 380 — Built in TO-3PF 1500 4 5 7 790 80 Built in TO-3PF 1500 0.1 100 150 80 4.2 — TO-220F 1500 2.5 8 10.5 650 34 — TO-220F 1500 2.5 8 10.5 650 34 — TO-3P 1500 2.5 8 10.5 650 34 — TO-3PF 1500 9 2.2 3 2400 130 — TO-3PF 1700 3 8.2 10.5 850 48 — TO-3PF POWER MANAGEMENT Page 28 Internet of Things Solutions LDO Regulators Device Dropout Typ Iout @ 3.3 V Iq (mA) (mV) (mA) NCP785A 10 - 12 NCP508 50 180 145 NCP715 50 350 4.7 NCP716 80 350 4.7 NCP120 150 30 80 NCP571 150 450 40 NCP170 150 240 0.5 NCP700B 200 118 70 NCP702 200 140 10 NCP752 200 130 12 NCP160 250 120 20 NCP703 300 180 12 NCP130 300 60 80 NCP161 450 120 20 NCP3335A 500 250 190 NCP3334 500 250 190 NCP705 500 250 12 NCP5500 500 230 300 NCP133 500 140 80 NCP59748 1.5 60 - NCP59744 3 100 - PSRR @ 120 Hz (dB) 80 70 52 52 72 40 82 68 68 100 68 75 100 75 75 70 75 72 70 70 Vin Max (V) 450 13 24 24 6 12 5.5 5.5 6 6 6 6 6 6 18 18 6 18 6 6 6 Vout (V) 3.3, 5.0, 12, 15 1.5, 1.8, 2.5, 2.8, 3.0, 3.3 1.2, 1.5, 1.8, 2.5, 3.0, 3.3, 5.0 1.2, 1.5, 1.8, 2.5, 3.0, 3.3, 5.0 0.8, 1.05, 1.1, 1.15, 1.2, 1.5, 1.8, 2.1 0.8, 0.9, 1.0, 1.2 1.2, 1.5, 1.8, 2.5, 2.8, 3.0, 3.3 1.8, 2.8, 3.0, 3.3 1.8, 2.8, 3.0, 3.3 1.8, 2.8, 3.0, 3.3 1.8, 2.5, 2.8, 2.85, 3.0, 3.3, 3.5, 4.5, 5.0, 5.14 1.8, 2.8, 3.0, 3.3 0.8, 1.05, 1.1, 1.15, 1.2, 1.5, 1.8, 2.1 1.8, 2.5, 2.8, 2.85, 3.0, 3.3, 3.5, 4.5, 5.0, 5.14 Adj., 1.5, 1.8, 2.5, 2.8, 2.85, 3.0, 3.3, 5.0 Adj. 0.8, 1.8, 2.8, 3.0, 3.3 Adj., 1.5, 5.0 Adj, 0.9, 1.0, 1.05, 1.1, 1.15, 1.2, 1.25, 1.3, 1.8 Adj. Adj. Package(s) SOT-89-3 SC-70-5, WDFN-6 SC-70-5, XDFN6 SC-70-5, XDFN6 XDFN-6 TSOP-5, DFN-6 SOT-563, uDFN-4 WDFN-6, TSOP-5 XDFN-6, TSOP-5 SOT-23-5, XDFN-6 XDFN-4, WLCSP-4 XDFN-6, TSOP-5 XDFN-6 XDFN-4, WLCSP-4 Micro8, DFN-10 SOIC-8 SOT-223-6, WDFN-6 DPAK-5, SOIC-8 XDFN-6 DFN-10, QFN-20 QFN-20 POWER MANAGEMENT ON Semiconductor Page 29 MOTOR CONTROL Motor Drive for Small Motor Control CPU Motor Driver for Zoom Motor Driver for Focus Motor Driver for Lens Shift (Up/Down, Left/Right) Motor Driver for Iris Lens Unit Lens Features • Integrated active flyback protection • Thermal and UVLO fault detection • Over-current fault detection on LV8711T Motor Controllers Device LV8400V LV8711T LV8712T LV8713T Type Brush DC Stepper/Brush DC Stepper Stepper VM Max (V) 16 18 18 18 VCC Max (V) 6 6 6 6 IO Max (A) 1.2 0.8 0.8 0.8 IO Peak Max (A) 3.8 1 1 1 Step Resolution — 1/2 1/8 1/32 Control Type Parallel Parallel Clock Clock Regulator Current Sense Output None No External Resistor Yes External Resistor Yes External Resistor Yes Package SSOP-16 TSSOP-24 TSSOP-24 TSSOP-24 Page 30 Internet of Things Solutions MOTOR CONTROL MOSFETs and MOSFET Drivers for Motor Control MOSFET Features • Low RDS(on) improves efficiency by reducing conduction loss • Low Gate Charge reduces dynamic power loss • Extensive voltage lineup MOSFET Driver High Side Driver Low Side Driver MOSFET Driver High Side Driver M Low Side Driver Power MOSFETs VDS ID Device Channel (V) (A) ATP208 N ATP401 N 2SK4066 N NDBA170N06A N NDBA180N10B N CPH3461 N PCP1405 N SFT1452 N NDDP010N25AZ N FW297 N+N FW276 N+N FW4604 P+N ECH8690 P+N FW389 P+N ATP107 P ATP108 P ATP304 P BBS3002 P SMP3003 P BMS3004 P 40 90 60 100 60 100 60 170 100 180 250 0.35 250 0.6 250 3 250 10 60 4.5 450 0.7 30 -4.5/6 60 -3.5/4.7 100 -2/2 -40 -50 -40 -70 -60 -100 -60 -100 -75 -100 -75 -68 MOSFET Drivers Device TND523SS TND524VS TND525SS TND314S TND315S TND316S TND321VD TND322VD TND323VD Description Single Input High Voltage High Side MOSFET Driver Single Input High Voltage High Side MOSFET Driver Dual Input High Voltage High and Low Side MOSFET Driver Dual Low Side Driver(Dual Inverter) Dual Low Side Driver(Dual Buffer) Dual Low Side Driver(Inverter and Buffer) Dual Low Side Driver(Dual Inverter) Dual Low Side Driver(Dual Buffer) Dual Low Side Driver(Inverter and Buffer) Number of Drivers 1 1 2 2 2 2 2 2 2 RDS(on) (mW) 6 3.7 4.7 3.3 2.8 6500 6500 2400 420 58 12100 65/39 94/55 300/225 17 10.4 6.5 5.8 8 8.5 Vin Max (V) 625 625 625 25 25 25 25 25 25 Qg (nC) 83 300 220 280 95 2.1 2.1 4.2 16 14 3.7 7.5/9.1 15/18 21/10 47 79.5 250 280 280 300 Package ATPAK ATPAK D2PAK, I2PAK D2PAK D2PAK CPH-3 PCP-1 (SOT-89) DPAK, IPAK DPAK, IPAK SOIC-8 SOIC-8 SOIC-8 ECH-8 SOIC-8 ATPAK ATPAK ATPAK D2PAK, I2PAK D2PAK, I2PAK TO-220F-3FG Drive Source/Sink Typ (mA) 200/400 200/400 200/400 1000/1000 1000/1000 1000/1000 800/1000 800/1000 800/1000 Package SOIC-8 VEC-8 SOIC-8 SOIC-8 SOIC-8 SOIC-8 VEC-8 VEC-8 VEC-8 ON Semiconductor Page 31 PROCESSING Mixed-Signal Custom Solutions Value Proposition • Experienced resources and assets to bring customers’ design objectives successfully to market • Ability to integrate customers’ IP into single-chip solution, thereby protecting the IP • Flexible cost models to reduce customers’ total cost Low or High Voltage Analog Signals Example: Sensor: • Magnetic Flux • Temperature • Light • Sound • Pressure • Acceleration • Angular Rate High Voltage (40 to 80 V) Low Voltage (<3.3 V) Power/ Battery Management Filtering Amplification Analog/ Digital Conversion Sensor Interface ASIC Supporting Logic • CAN, LIN • I2C-bus • USB • KNX • M-BUS • RF Wired Communications Wireless Radio Low or High Voltage Design Engineering • Approximately 200 expert mixed-signal designers with extensive SoC and SiP experience • Robust custom development process • Dedicated project managers track & report development progress Signal Processing • Microcontroller • DSP Actuator Example: • Flexible customer development engagement — from full turnkey to subcontractor production services Memory • Coil Driver • Class-D Amp • DAC • Display Driver • EEPROM • OTP • SRAM • ROM Mechanical or Electrical System: • Stepper Motors • Transducers • MOSFETs & BJTs • Relays • Speakers • Lamps • LCD/LED Displays • Design expertise in: » Sensor interface » Wireless systems » Medical imaging » Energy management » Building & home control IP & Fab Processes • ≥55 nm, analog-focused CMOS/BCDMOS process technologies utilizing internal fabs and external foundry partners • Low, medium, high voltages — ≤1 V to 90 V • Low current optimization — active & standby • Low noise design — “count the electrons” • High temperature — ≤200°C (profile, for selected technologies) • Integrated low power wireless • Non-Volatile Memory (EEPROM, OTP), RAM & ROM • Embedded digital IP • Robust ESD protection • Extensive building block ‘starting points’ consisting of amplifiers, references, DACs, ADCs, linear & switching regulators, power management, etc. Category Serial Interfaces Microprocessors Memory Clocking Communication Encryption Data Converters Wireless IP Power Management References Analog and High Voltage Interfaces Signal Conditioning Mixed Signal Intellectual Property (IP) USB 3.0/2.0/1.1, HDMI, MIPI, I2C, SPI, CAN, UART ARM, RCore DSP, R8051, AMBA/AHB/APB Peripherals SRAM, DPRAM, ROM, EEPROM, OTP, FLASH Oscillators, PLLs, DLLs Wireless (Proprietary & Standards), Wired (KNX, PLC and others) ECC, AES, 3-DES, DES, RSA DAC, ADC (8 - 20 bits, 1 KSPS – 120 MSPS) PGA, LNA, PLLs, Correlators, DSP Efficient Switching Regulators, LDOs, Charge Pumps, Thermal Protection Precision Bandgaps, Current References, Temperature Sensors High-Voltage Drivers, Display and LCD Drivers, Class D Amplifiers PGA, Instrumentation Amps, Digital and Analog Filters Page 32 Internet of Things Solutions PROCESSING General and LCD MCUs MCU Features •Pins: 10 – 100 •Operation Voltage: 1.8 – 5.5 (V) μA •ROM: 4 – 512 KBytes •Stand-by IDD: 0.02 µA •RAM: 256 – 24,576 Bytes •RTC (Clock) IDD: 0.45 µA •ADC: 3 – 16 channels (with low power model) Device ROM RAM Type (kByte) (Byte) I/Os PWMs UARTs LC87FBG08A 8-bit General 8 256 21 2 1 LC87FBK08A 8-bit General 8 256 21 2 — LC87FBL08A 8-bit General 8 256 26 2 — LC87FBH08A 8-bit General 8 256 26 2 1 LC87F2R04A 8-bit General 4 128 21 — — LC87BK08A* 8-bit General 8 256 21 2 — LC87F2416A 8-bit General 16 512 26 2 1 LC87F2J32A 8-bit General 32 1024 41 2 1 LC87F2W48A 8-bit General 50 1536 40 2 1 LC87F2C64A 8-bit General 64 2048 73 4 2 LC87FC096A 8-bit General 96 4096 55 6 2 LC87F2608A 8-bit General 8 512 7 1 — LC87F0808A 8-bit General 8 256 30 6 1 LC87F0N04A 8-bit General 4.5 128 12 4 — LC87F0G08A 8-bit General 8 256 18 3 — LC87F0A08A 8-bit General 8 256 30 2 — LC87F5VP6A 8-bit General 256 10240 89 4 2 LC88F58B0A 16-bit General 128 6144 54 2 2 LC88F52H0A 16-bit General 512 24576 90 4 4 LC87F7932B 8-bit LCD 32 2048 49 2 1 LC87F7J32A 8-bit LCD 32 1024 51 2 1 LC87F76C8A 8-bit LCD 128 4096 71 2 1 LC87F7DC8A 8-bit LCD 128 4096 91 2 2 LC87F7NC8A 8-bit LCD 128 4096 91 2 2 LC87F7NJ2A 8-bit LCD 192 8192 91 2 2 LC87F7NP6A 8-bit LCD 256 8192 91 2 2 * Mask ROM Device; Contact ON Semiconductor for additional information. ADC 12/8-bit x 9ch 12/8-bit x 8ch 12/8-bit x 11ch 12/8-bit x 11ch 12/8-bit x 8ch 12/8-bit x 8ch 12/8-bit x 10ch 12/8-bit x 14ch 12/8-bit x 14ch 12/8-bit x 16ch 12/8-bit x 11ch 12/8-bit x 3ch 10/8-bit x 10ch 10/8-bit x 6ch 12/8-bit x 7ch 12/8-bit x 8ch 8-bit x 15ch 12/8-bit x 11ch 12/8-bit x 16ch 12/8-bit x 7ch 12/8-bit x 12ch 12/8-bit x 12ch 12/8-bit x 15ch 12/8-bit x 15ch 12/8-bit x 15ch 12/8-bit x 15ch LVD POR Features Package ✔ ✔ High accuracy internal OSC (±2.0%); all operation is minimum 1.8 V SSOP-24, VCT-24 ✔✔ High accuracy internal OSC (±3.0%); Support Mask Type SSOP-24 ✔✔ High accuracy internal OSC (±3.0%) QFP-36 ✔✔ High accuracy internal OSC (±3.0%) QFP-36 ✔✔ Small scale 8bit MCU; Remote Control Receiver Circuit SSOP-24 ✔✔ Mask ROM edition of LC87FBK08A SSOP-24 —— Premium market segment QFP-36 ✔✔ Premium market segment SQFP-48, QIP-48 ✔— Premium market segment SQFP-48 ✔✔ RTC; low power consumption QFP-80 ✔✔ 12bit PWM x 6 QIP-64E ✔✔ High speed 12-bit PWM; Analog Comparator MFP-10SK ✔ ✔ MCPWM; High speed ADC (10-bit); Analog Comparator/Amplifier x 2 QFP-36 ✔✔ MCPWM; High speed ADC (10-bit); Analog Comparator x 2 SSOP-16 —— MCPWM, OP-AMP, Analog comparator SSOP-24 ✔✔ OP-AMP, Analog comparator, Constant current output port QFP-36 —— Large scale memory QIP-100E —✔ Motor control signal generator SQFP-64 —✔ DAC; PWM; RTC; SIO x 5; UART x 4 TQFP-100 —✔ 32 x 4 segment driver; RTC; low power consumption SQFP-64 ✔✔ 24 x 4 segment driver; support 5 V/3 V for LCD-panel TQFP-64 —— 32 x 4 segment driver QFP-80 —— 54 x 4 segment driver; many segment drivers QIP-100E —— 54 x 4 segment driver; large scale memory QIP-100E —— 54 x 4 segment driver; large scale memory QIP-100E —— 54 x 4 segment driver; large scale memory QIP-100E MCUs for USB MCU Features •USB 2.0 full-speed / low speed functions •Integrated voltage regulator •USB device function / USB host function •USB D+ line pull-up function Device LC87F1A32A LC87F1M16A LC87F1K64A LC87F17C8A LC87F1HC8A LC87F1JJ2A LC87F1JJ4A LC87F1JJ8A Type 8-bit USB 8-bit USB 8-bit USB 8-bit USB 8-bit USB 8-bit USB 8-bit USB 8-bit USB ROM RAM (kByte) (Byte) I/Os PWMs UARTs 32 2048 39 2 1 16 1024 38 2 1 64 8192 39 2 1 128 8192 39 2 1 128 16384 39 2 1 192 16384 39 2 1 192 20480 39 2 1 192 24576 39 2 1 ADC 12/8-bit x 12ch 12/8-bit x 20ch 12-bit x 12ch 12/8-bit x 12ch 8-bit x 12ch 8-bit x 12ch 8-bit x 12ch 8-bit x 12ch LVD POR —— ✔✔ ✔✔ 44 —— —— —— —— Features IR reciever UART & SCUART; high current driver USB I/F x 2; USB Host; Audio I/F USB 2.0 full speed host/device controller x2; audio IF USB Host; Audio I/F USB Host; Audio I/F USB Host; Audio I/F USB Host; Audio I/F Package SQFP-48 SQFP-48 SQFP-48 SQFP-48 SQFP-48 SQFP-48 SQFP-48 SQFP-48 ON Semiconductor Page 33 PROCESSING Development Tools for Microcontrollers Software Development For 8-Bit Debugging/ Verification On-chip Debugger TCB87-TYPEC-MDT (On-chip debugger software included) Writing Flash Writing System • On Board Writer SKK-DBG-TYPECMDT C Compiler/Assembler Software Development Environment CD • Inst87 (Information on microcontroller models) • SU (Options setup program) For 16-Bit C Compiler/Assembler Software Development Environment CD • Inst87 (Information on microcontroller models) • SU (Options setup program) Display Panel Emulation Tool Panel Design Supports Both 8- and 16-Bits • Flash ROM Writer SKK-TYPEC-MDT On-chip Debugger EOCUIF2-MDT (On-chip debugger software included) • Flash ROM Writer from Support Group Single programmer AF9709C / AF9711 Gang programmer AF9723/23B (main body) AF9833 (unit) Onboard Programmer AF9101/03 (main body) SIB87-TYPEC-GMDT (ON Semiconductor) • On Board Writer FWSX16DITYPE2MDT Page 34 Internet of Things Solutions USB 2.0 for Consumer One High Speed Pair, VCC, Low Capacitance ESD Protection Key Requirement • Cap < 1.5 pF Features • 0.5 - 0.8 pF • 4 low speed + 1 VBUS integrated – can protect up to 2 USB ports • Industry leading low clamping voltage I/O 1 I/O 2 I/O 3 I/O 4 = Device NUP4114UPX NUP4114UCL NUP4114H ESD7L5.0 ESD9L5.0 Capacitance Lines (pF) Package 4 0.8 SOT-563 4 0.5 SC-88 4 0.8 TSOP-6 2 0.5 SOT-723 1 0.5 SOD-923 Size (mm) 1.6 x 1.6 2.0 x 2.1 3.0 x 2.75 1.2 x 1.2 1.0 x 0.6 NUP4114 GND D+ DVBUS dB PROTECTION One High Speed Pair, VCC, Common Mode Filter + ESD Protection Key Requirement • Cap < 1.5 pF • Common Mode Filtering Features • 0.5 - 0.8 pF • Integrated EMI suppression with ESD protection • Industry leading low clamping voltage EMI2121 Capacitance CM Attenuation DM Bandwidth Size Device Pairs @ 2.5 V (pF) @ 800 MHz (–dB) F3dB (GHz) Package (mm) EMI2121 1 0.9 –25 2.5 WQFN 2.2 x 2.0 x 0.75 Micro USB Connector GND ID D+ DVBUS Top layer Other layer ON Semiconductor USB 2.0 @ 480 Mb/s 0 -5 -10 -15 -20 Suppresses Common Mode Noise Deeper than Competing Passive Solution -25 -30 Common Mode -35 1.E+06 Differential Mode 1.E+07 1.E+08 Frequency 1.E+09 Page 35 Ethernet: 10/100BASE-T, 1000BASE-TX, and Gigabit Two & Four Pairs, Low Capacitance Surge and ESD Protection 8 1 PROTECTION The 10/100BASE-T, 1000BASE-TX, and Gigabit Ethernet (GigE) interfaces operating at higher rates are susceptible to ESD strikes, cable-discharge events and lightning-induced transients. Our products help meet IEC 61000-4-5, GR-1089-CORE and other Standards. RJ45 1000BASE-T ETHERNET TRANSCEIVER TRANSFORMER RJ45 Features • Wide range of voltages and capacitance values for tertiary protection • Vclamp (25 A surge) < 11 V • IEC 61000-4-2 rating > 30 kV • No latching danger • Surge rating maintained to 125°C Benefits • Compatible with Gigabit Ethernet and beyond • Enhanced protection for downstream electronics • Accommodates operating transients above 3.3 V • Small form-factor allows integration into connectors Typical Application SRDA3.3 VDD Typical Application 8 1 TPOPA TPONA TPOPB TPONB C1 ESD1014 C1 A+ C5 VDD A- LC03 8 1 B+ C5 VDD B- LC03 8 1 TPOPC TPONC TPOPD TPOND C1 ESD1014 C1 C+ C5 VDD C- LC03 8 1 D+ C5 VDD D- LC03 Line Side : LC03-6 (optional) Transformer Side: ESD1014 Protection against metallic (transverse) strikes TRANSFORMER A+ MX4+ TR4+ A– MX4– TR4– B+ VDD B– MCT4 TCT4 C+ C– D+ CHASSIS D– GND MDI_A+ MDI_A– 10/100BASE-T LINE DRIVER Through Board Transformer Side – SRDA3.3 Line-to-Line protection against metallic strikes Transient Voltage Suppressors Device Data Lines Typical ESD Surge IPP Line-Line Contact VDC Max 8/20 ms Capacitance Rating (V) (A) (pF) (±kV) Package NUP4114H 2 pair ESD Only 10/100/1000BASE-TX, GigE 5.0 12* 0.4 13 TSOP-6 SRDA3.3 1 pair 10/100BASE-T 3.3 25 4 8 SOIC-8 ESD1014 2 pair 1000BASE-TX, GigE 3.3 25 1.5 30 UDFN-10 LC03-6 1 pair Line Side 10/100/BASE-T, GigE 5.0 100 8 30 SOIC-8 With ESD1014 Signal Integrity for Gigabit Ehternet Page 36 Internet of Things Solutions Serial EEPROMs Features • Broad density range: 1 kb to 2 Mb • Wide operating Vcc range: 1.8/1.7 V to 5.5 V • High endurance: 1 million program/erase cycles • Wide temperature range: industrial and extended EasyPRO™ is a user-friendly, portable programming tool for ON Semiconductor serial EEPROMs (I2C, SPI, Microwire) EEPROMs Data Transmission Standard Device Density CAT24M01 1 Mb CAT24C512 512 kb CAT24C256 256 kb CAT24C128 128 kb I2C CAT24C64 64 kb CAT24C32 32 kb CAT24C16 16 kb CAT24C08 8 kb CAT24C04 4 kb CAT24C02 2 kb CAT25M02 2 Mb CAT25M01 1 Mb CAT25512 512 kb CAT25256 256 kb CAT25128 128 kb CAT25640 64 kb SPI CAT25320 32 kb CAT25160 16 kb CAT25080 8 kb CAT25040 4 kb CAT25020 2 kb CAT25010 1 kb CAT93C86 16 kb CAT93C86B 16 kb CAT93C76 8 kb CAT93C76B 8 kb Microwire CAT93C66 4 kb CAT93C56 2 kb CAT93C46 1 kb CAT93C46B 1 kb * Organization for Microwire devices is selectable. Organization* 128k x 8 64k x 8 32k x 8 16k x 8 8k x 8 4k x 8 2k x 8 1k x 8 512 x 8 256 x 8 256k x 8 128k x 8 64k x 8 32k x 8 16k x 8 8k x 8 4k x 8 2k x 8 1k x 8 512 x 8 256 x 8 128 x 8 2k x 8 / 1k x 16 2k x 8 / 1k x 16 1k x 8 / 512 x 16 1k x 8 / 512 x 16 512 x 8 / 256 x 16 256 x 8 / 128 x 16 128 x 8 / 64 x 16 128 x 8 / 64 x 16 VCC Min (V) 1.8 1.8 1.8 1.8 1.7 1.7 1.7 1.7 1.7 1.7 1.7 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 / 1.65 1.8 1.8 / 1.65 1.8 1.8 1.8 1.8 / 1.65 VCC Max (V) 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 fCLK Max (MHz) 1 1 1 1 1 1 0.4 0.4 0.4 0.4 10 10 20 20 20 20 20 20 20 20 20 20 3 4 3 4 2 2 2 4 Package(s) SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8, UDFN-8, WLCSP-4 SOIC-8, TSSOP-8, UDFN-8, WLCSP-5 SOIC-8, TSSOP-8, UDFN-8, TSOT23-5, WLCSP-4, WLCSP-5 SOIC-8, TSSOP-8, UDFN-8, TSOT23-5, WLCSP-4, WLCSP-5 SOIC-8, TSSOP-8, UDFN-8, TSOT23-5, WLCSP-4, WLCSP-5 SOIC-8, TSSOP-8, UDFN-8, TSOT23-5, WLCSP-4, WLCSP-5 SOIC-8 SOIC-8, TSSOP-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8 SOIC-8, TSSOP-8 SOIC-8, TSSOP-8 SOIC-8, TSSOP-8, UDFN-8 COMPONENTS ON Semiconductor Page 37 Integrated Passive Devices (IPD) • Combines multiple resistors, capacitors and inductors onto a film substrate; typical applications include RF baluns, filters, and matching networks • Reduces PCB footprint and component height versus discrete implementations, while also improving performance (reduced parasitics) • Simplifies logistics, inventory managememt and pick-and-place assembly by elimination of multiple discrete passive SKUs • Based on 110 nm silicon process with high performance and tight process control Available Components • Copper inductors, minimum spacing 3 µm, minimum line width 5 µm, current handling >50 mA/µm, achieves Q-factors up to 45 Integration of multiple R, L, and C into single IPD • MIM capacitors, 0.62 nF/mm2 , typical tolerance ±5% • TiN resistors, 9 Ω/sq • Wafers manufactured on high precision equipment, designed for 110 nm transistor fabrication • Very tight performance tolerances and low variation across wafers • ±4.3% tolerance 1K MIM caps • ±3.9% tolerance 2K MIM caps • < 1% variance between caps on common IPD Sub-Micron Tolerances — Trace Spacing/Width Down to 3/5 mm Inductor Within IPD (SEM Photo) COMPONENTS Page 38 Picked & Diced Wafer Edge Internet of Things Solutions Logic Translators Dual supply voltage logic translators connect ICs and PCBs together that operate at different supply voltages. Features • Industry’s first devices with independent power supplies (VL < VCC, VL = VCC, or VL > VCC) • High 100 pF capacitive drive capability • Overvoltage tolerant enable and I/O pins • Non-preferential power-up sequencing • Power-off protection PCB #1 Translator PCB #2 Translator μC #1 On-board translations • SPI • I2C • SMBus Translator PCB-to-PCB Translation μC #2 EEPROM Unidirectional Translator Autosense Bidirectional Translator (Push-Pull Output) Autosense Bidirectional Translator (Open-Drain Output) Bidirectional Translator (with Direction Pin) VCCA Block Diagram A OE VL VCCB B I/O VL P One−Shot R1 1k N One−Shot P One−Shot R2 1k N One−Shot VCC VL VCC I/O VCC PU1 RPullup 10 k EN I/O VL One−Shot Block Gate Bias One−Shot Block N PU2 RPullup 10 k EN I/O VCC VCCA DIR A VCCB B Attributes • High Data Rate • Low Power Consumption Trade-Offs Applications • Fixed Input & Output Pins • SPI • GPIO Sample Device (I/O Channels, Package) • NLSV1T34 (1-Bit, ULLGA-6) • NLSV1T240/244 (1-Bit, UDFN-6) • NLSV2T240/244 (2-Bit, UDFN-8) • NLSV4T240/244 (4-Bit, UDFN-12) • NLSV4T3234 (4-Bit, CSP-11) • NLSV8T240/244 (8-Bit, UDFN-20) • High Data Rate • Low Power Consumption • Modest Output Current • SPI • GPIO • NLSX3012 (2-Bit, UDFN-8) • NLSX3014 (4-Bit, UQFN-12) • NLSX3013 (8-Bit, CSP-20) • NLSX3018 (8-Bit, UDFN-20) • NLSX4014 (4-Bit, UQFN-12) • NLSX5011 (1-Bit, UULGA-6, UDFN-6) • NLSX5012 (2-Bit, UDFN-8) • NLSX5014 (4-Bit, UDFN-12) • High Data Rate • Low Power Consumption • Flexible PCB Design • Modest Bandwidth • I2C, SMBus, PMBus • GPIO • SDIO Cards • 1-Wire Bus • NLSX3373 (2-Bit, UDFN-8) • NLSX3378 (4-Bit, CSP-12) • NLSX4373 (2-Bit, UDFN-8) • NLSX4378 (4-Bit, CSP-12) • High Data Rate • Low Power Consumption • Flexible PCB Design • Directional Control Pin Required • GPIO • NLSV1T45 (1-Bit, ULLGA-6) • NLSV2T245 (2-Bit, UQFN-10) • NLSV2T3236 (2-Bit, UQFN-10) • NLA16T245 (16-Bit, TSSOP-48) COMPONENTS ON Semiconductor Page 39 Sales and Design Assistance from ON Semiconductor ON Semiconductor Technical Support www.onsemi.com/support ON SEMICONDUCTOR INTERNATIONAL SALES OFFICES GREATER CHINA Beijing 86-10-8577-8200 Hong Kong 852-2689-0088 Shenzhen 86-755-8209-1128 Shanghai 86-21-5131-7168 Taipei, Taiwan 886-2-2377-9911 FRANCE Paris 33 (0)1 39-26-41-00 GERMANY Munich 49 (0) 89-93-0808-0 INDIA Bangalore 91-98-808-86706 ISRAEL Raanana 972 (0) 9-9609-111 ITALY Milan 39 02 9239311 JAPAN Tokyo 81-3-5817-1050 KOREA Seoul 82-31-786-3700 MALAYSIA Penang 60-4-6463877 SINGAPORE Singapore 65-6484-8603 SLOVAKIA Piestany 421 33 790 2450 UNITED KINGDOM Windsor 44 1753 62 6718 ON Semiconductor Distribution Partners Allied Electronics www.alliedelec.com Altima Corp. www.altima.co.jp Arrow Electronics www.arrow.com Avnet www.em.avnet.com Chip One Stop, Inc. www.chip1stop.com/maker/on Daiwa Distribution Ltd. www.daiwahk.com Digi-Key www.digikey.com EBV Elektronik www.ebv.com/en/locations.html Future & FAI Electronics www.futureelectronics.com/contact Mouser Electronics www.mouser.com Newark/Farnell www.farnell.com/onsemi OS Electronics Co., Ltd. www.oselec.jp Promate Electronic Co. RinnoVent Co., Ltd. (Ryosan Group) RS Components KK Segyung Britestone Co. Serial AMSC Serial Microelectronics, HK World Peace Industries Co. WT Microelectronics Co. Yosun Electronics www.promate.com.tw www.ryosan.co.jp jp.rs-online.com www.britestone.com www.serialsystem.jp www.serialsys.com.hk www.wpi-group.com www.wtmec.com www.yosun.com.tw (800) 433-5700 (81) 45 476 2155 (800) 777-2776 (800) 332-8638 (81) 45 470 8771 (852) 2341 3351 (800) 344-4539 (49) 8121 774-0 1-800-FUTURE1 (388-8731) (800) 346-6873 (800) 4-NEWARK Japanese: (81) 3 3255 5985 Other Languages: (81) 3 3255 6066 (886) 2 2659 0303 (81) 3 3862 2440 (81) 45 335 8550 (82) 2 3218 1511 (81) 3 5795 1635 (852) 2790 8220 (852) 2365 4860 (852) 2950 0820 (886) 2 2659 8168 For a comprehensive listing of ON Semiconductor Sales Offices, Distributors, and Rep Firms, please visit: Americas & EMEA: www.onsemi.com/sales China: www.onsemi.cn/sales Japan: www.onsemi.jp/sales Feb-15 AMERICAS REP FIRMS Alabama Huntsville e-Components Brazil Countrywide Ammon & Rizos California Bay Area Electec Southern California Tech Coast Sales Canada Eastern Canada Astec Connecticut Statewide Paragon Electronic Systems Florida Statewide e-Components Georgia Atlanta e-Components Illinois Statewide Matrix – Design Technology Indiana Fishers Bear VAI Iowa Statewide Matrix – Design Technology Maine Statewide Paragon Electronic Systems Maryland Columbia Third Wave Solutions Massachusetts Statewide Paragon Electronic Systems Mexico Countrywide Ammon & Rizos Michigan St. Joseph Bear VAI Minnesota Eden Prairie Matrix – Design Technology Missouri Belton Matrix – Design Technology Nebraska Statewide Matrix – Design Technology New Hampshire Statewide Paragon Electronic Systems New Jersey Statewide S.J. Metro New York Binghamton TriTech - Full Line Rep Jericho S.J. Metro Rochester TriTech - Full Line Rep North Carolina Raleigh e-Components North Dakota Statewide Matrix – Design Technology Ohio Brecksville Bear VAI Technology Puerto Rico Countrywide e-Components Rhode Island Statewide Paragon Electronic Systems South Dakota Statewide Matrix – Design Technology Vermont Statewide Paragon Electronic Systems Wisconsin Statewide Matrix – Design Technology (256) 533-2444 (+55) 11-4688-1960 (408) 496-0706 (949) 305-6869 (905) 607-1444 (603) 645-7630 (888) 468-2444 (888) 468-2444 (952) 400-1070 (317) 570-0707 (319) 362-6824 (603) 645-7630 (410) 290-5990 (603) 645-7630 (+55) 11-4688-1960 (440) 526-1991 (952) 400-1070 (816) 589-2308 (816) 589-2308 (603) 645-7630 (516) 942-3232 (607) 722-3580 (516) 942-3232 (585) 385-6500 (888) 468-2444 (952) 400-1070 (440) 526-1991 (888) 468-2444 (603) 645-7630 (952) 400-1070 (603) 645-7630 (952) 400-1070 ARM and Cortex are registered trademarks of ARM Limited (or its subsidiaries) in the EU and/or elsewhere. HART is a registered trademark of the HART Communication Foundation. KNX and the KNX logos are registered trademarks of KNX and its suppliers or licensors. Micro8 is a trademark of International Rectifier. OMS is a registered trademark of OMS Group, Germany. ZigBee is a registered trademark of ZigBee Alliance. All other brand names and product names appearing in this document are trademarks of their respective holders. ON Semiconductor and the ON logo are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com BRD8075-6 PRINTED IN USA 2/15 IRONWOOD XXXX 2K N. American Technical Support: 800-282-9855 Toll Free USA/Canada. Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5817-1050 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative BRD8075/D

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