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移动与可穿戴设备的解决方案

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安森美半导体移动与可穿戴设备的解决方案

简介:本文介绍了移动,可穿戴设备在综合成像,显示,射频,广播,电源管理,电池保护,接口和存储器方面的解决方案。

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Page 2 Vbat Smart Phone Battery Protection Battery Mini PMIC LDO Power Discretes DC-DC Load Converter Switch Subsystem Power Supplies Small Signal Discretes Switches & Op Amps Standard Logic Building Block Components ESD/EMI Protection Battery Charger Wireless Charging Fuel Gauge USB Protection USB Power Adapter Power Protection Memory SIM/Memory Card Interface USB/MHL Switches Temp Sensor Audio Protection Audio Speaker Amp Head Phone Amp CODEC Speech DSP Power Management Unit (PMU) Core DC-DC Applications Processor WLAN/BT/FM/GPS/NFC Module Vbat Clock Buffer PA DC-DC Cellular Modem SoC PA Front End Module Tunable RF Haptic Motor Image Sensor Processor Camera ESD + EMI Protection LED Backlight Display Protection Motor Driver MEMs Sensors Active EMI Suppression Flash Driver Camera PMIC Vbat Lens AF Driver OIS Camera EEPROM Hall Sensor Image Sensor Camera Lens Gyro Flash Display Driver Touch Controller ALS + Proximity Sensor AMOLED Power Touch Display & UI LCD Display Wearable Battery Charger Wireless Charging Battery Fuel Gauge Battery Protection Mini PMIC LDO Power Discretes DC-DC Load Converter Switch Subsystem Power Supplies Small Signal Discretes Switches & Op Amps Standard Logic ESD/EMI Protection Building Block Components USB Protection USB Power Adapter Power Protection Memory SIM/Memory Card Interface SIM/Memory Card Interface Microcontroller WLAN/BT/FM/GPS/NFC Module Image Sensor Processor MEMs Sensors Camera Protection Lens AF Driver Hall Sensor Image Sensor Camera EEPROM Camera Lens Audio Protection Audio Speaker Amp Head Phone Amp CODEC Speech DSP Haptic Motor LED Backlight Display Protection Motor Driver Display Driver Touch Controller ALS + Proximity Sensor AMOLED Power Touch Display & UI LCD Display Portable & Wearable Solutions CAMERA MODULES AF Voice Coil Motor Camera Module OIS VCM (3-Axis) Image Sensor AF, OIS Driver, Gyro Camera PMU Hall Element AF VCM OIS VCM Hall Element OIS Position Lens EEPROM AF Driver I2C Image Sensor OIS Driver SPI OIS Gyro Data Clock Reset MCLK I2C Power GND Connector Image Signal Processor Application Processor AF System OIS System ON Semiconductor Page 3 CAMERA MODULES Mobile CMOS Imaging Sensors The portable CMOS imaging sensor portfolio from ON Semiconductor provides options for all applications, whether a leading flagship model, a super sleek thin model, or a standard mainstream model that needs a great performing front and rear camera sensor. Key Features • Superior image quality with world-leading pixel technology • Fast frame rates for the best action shots • Low light sensitivity delivering low light image quality • High-Definition (HD) and 4K Video Device MT9V115 ASX370 MT9M114 AR0260 AR0261 AR0330 AR0543 AR0841 AR0842CP AR0833 AR0835 AR1335 AR1820HS Resolution (MP) VGA VGA 1.2 2.1 2.1 3.5 5.0 8.0 8.0 8.0 8.0 13 18 Optical Format 1/13” 1/7” 1/6” 1/6” 1/6” 1/3” 1/4” 1/4” 1/4” 1/3.2” 1/3.2” 1/3.2” 1/2.3” Pixel Size (mm) 1.75 3.0 1.9 1.4 1.4 1.75 1.4 1.4 1.1 1.4 1.4 1.1 1.25 Sensor Type SOC SOC SOC SOC Raw Raw Raw Raw Raw - Clarity+ Raw Raw Raw Raw Frame Rate VGA 30 fps VGA 30 fps 720P 30 fps 1080P 30 fps 1080P 60 fps 1080P 60 fps 5 MP 15 fps 8 MP 30 fps 8 MP 30 fps 8 MP 30 fps 8 MP 42 fps 13 MP 30 fps 18 MP 24 fps Page 4 Portable & Wearable Solutions Equalizer PWM Control Logic Driver CAMERA MODULES Optical Image Stabilization High Megapixels, Low Light Key Features • High PWM carrier frequency • Supports Hall and photo reflector position sensors • Internal circuit for position sensor CPU OIS Gyro Position Sensor I2C/SPI Digital Gyro IF DA AD LDO OSC OIS Driver Block Diagram OIS Actuator Device VDD VDD VM VM PWM Min Max Min Max Max (V) (V) (V) (V) (MHz) CPU IF Gyro IF D/A A/D Package(s) LC898111AXB 2.6 3.6 2.6 3.6 6 I2C; SPI I2C/SPI/Analog 8-bit 12-bit WLP-48 OIS Off OIS On Auto-Focus Drivers Key Features • Faster settling time • Low power consumption • Feedback variants have support for position sensor CPU I2C Equalizer PWM Control Logic Driver Position Sensor For Feedback AF DA AD LDO OSC Auto-Focus Driver Block Diagram AF Actuator Device LC898212XC LC898212AXB* LC898215XA LC898217XC LV8498CT * Pending 3Q15. Type Feedback Feedback Preload Feedback Preload VDD Min VDD Max (V) (V) 2.6 3.6 2.6 3.6 2.6 3.6 2.6 3.3 2.2 5.0 VM Min (V) 2.6 2.6 2.6 2.6 2.2 VM Max (V) 3.6 3.6 3.6 3.3 5.0 PWM Max 6 MHz 6 MHz 5 MHz - CPU IF I2C I2C I2C I2C I2C D/A 8-Bit 8-Bit 10-Bit 10-Bit A/D 10-Bit 10-Bit 11-Bit - Package(s) WLP-12 WLP-12 WLP-6 WLP-10 WLP-6K ON Semiconductor Page 5 CAMERA MODULES Optical Image Stabilization and Auto-Focus Driver Key Features • Integrated OIS & Closed/Open AF • Actuator Driver • OIS: PWM driver, constant voltage linear PWM driver • AF: PWM drive, constant current linear driver • Fast settling time in AF • Low power consumption of 15 mA • WLCSP-30, 1.99 mm x 2.59 mm CPU OIS Gyro Position Sensor I2C Digital Gyro IF DA AD LDO OSC Equalizer Driver Control Logic Driver OIS Actuator AF Actuator VDD Min VDD Max VM Min VM Max PWM Max Device (V) (V) (V) (V) (MHz) CPU IF Gyro IF D/A LC898122AXA 2.6 3.6 2.6 3.6 6 I2C SPI 8-bit A/D Package 12-bit WLCSP-30 Page 6 Portable & Wearable Solutions CAMERA MODULES Camera Module PMICs Key Features • Mid-size integration • Complements main PMU under minimum supervision • CSP package saves space on a flex or dedicated PCB • High performance • High efficiency and low quiescent current for battery life • Low noise (<50 µVRMS) for high resolution performance • Fully programmable through I2C to adapt default output voltages and power up and down sequencing • Modular approach • 5 or 6 regulators for 2D / 3D modules and back / front cameras VBG 100 nF AGND 1.0 uF System Supply System Supply or DCDC Out VIN1 VIN2 1 uF Enabling Processor I2C HWEN SDA SCL NCP6915 Core DCDC 1 600 mA Thermal Protection Power Up & Down Sequencer I2C LDO1 200 mA LDO2 200 mA LDO3 200 mA LDO4 200 mA LDO5 300 mA PVIN1 2.2 uF System Supply SW1 1 uH FB1 PGND1 DCDC1 Out 10 uF VOUT1 VOUT2 VOUT3 1.0 uF 1.0 uF 1.0 uF VOUT4 VOUT5 1.0 uF 1.0 uF ON Semiconductor Device NCP6925 NCP6924 NCP6922C* NCP6914 NCP6915 NCP6951* * Pending 3Q15. DC-DC (mA) 2 x 1000 2 x 1000 2 x 800 1 x 800 1 x 600 1 x 600 LDO (mA) 5 x 300 2 x 300, 2 x 150 2 x 150 4 x 300 1 x 300, 4 x 150 4 x 150, 1 x 300 Package(s) CSP-36 CSP-30 QFN-20 CSP-20 CSP-16 CSP-24 Page 7 Low-Voltage Portable LED Driver Topologies White LED and RGB tricolor LEDs are widely used for backlighting small color LCD panels and keyboards, as well as indicators. High brightness LEDs are used as flash light sources in smart phones and digital cameras. These applications require optimized solutions which can maximize battery lifetime, as well as minimize the PCB area and height. ON Semiconductor has a variety of solutions using linear, inductive, and charge pump topologies. The inductive solution offers the best overall efficiency, while the charge pump solution takes up a minimal amount of space and height due to the use of low profile ceramic capacitors as the energy transfer mechanism. Linear drivers are ideal for color indicator as well as simple backlighting applications. VBAT 22 μH 1 μF PWM/ 1-Wire VIN SWIRE SW LV52204 FB FCAP GND 220 nF 1 μF 10 Ω Inductive Boost Topology Vbat 4.7 F GND 1F PWM FSEL VSEL Vbat C2N C1P C2P NCP5603 C1N Vout EN/PWM Fsel Vsel GND GND 1F Charge Pump Topology 1F GNLDCD MODULES GND LCD MODULES Page 8 Portable & Wearable Solutions LCD MODULES Charge Pump Topology Charge Pump/White and RGB LED Drivers — for LCD Backlight, LED Flash/Torch and Indicator Input Total LED-LED Operating Voltage Number Output Charge Pump Current Number of Quiescent Shutdown Range of Current Regulation Operating Matching, Dimming Current Level/ Current, Typ Current Device (V) Outputs (mA) Mode Mode Typ Method Profile (mA) (mA) Package Notes •Indicator application •Individual PWM programma- NCP1840 3.0 - 5.5 8 240 Current 1x / 1.33x / 1.5x / 2x ±2% I2C 32/ log 2.3 bility per channel; 64 different 0.12 QFN-20 PWM duty cycle settings •Individual current level programmability (32 levels) per channel NCP5612 2.7 - 5.5 2 S-Wire Link 60 Current 1X, 1.5X ±0.2% (Single Wire 16/ linear 0.6 Serial Link) •Built-in “icon” dimming mode 1 LLGA-12 •OVP •Short circuit protection NCP5603 2.85 5.5 200 mA DC, 1 350 mA Voltage 1X, 1.5X, 2X — pulse PWM Depends on system 1 2.5 typ • Backlight DFN-10 •4.5 / 5 V output •Short circuit protection •RGB illumination S NCP5623B/C 2.7 - 5.5 3 (Independent) 90 Current 1X, 2X ±0.5% I2C 32/ quasi-log 0.35 0.8 typ • Backlight LLGA-12 •Built-in “gradual illumination” •B & C versions have different I2C addresses Inductive Boost and Buck Topology Inductive-Boost White-LED Drivers — for Backlighting and Torch/Flash Applications Device Input Voltage Range (V) Max Output Volt, Typ (V) Output Current (mA) Condition Number of LEDs/ Switching Mode/ Dimming Efficiency Configuration Frequency Method (%) NCP1422 1.0 - 5.0 5 800 Vout 3.3 V, Vin 2.5 V 1 for flash PFM, up to 1.2 MHz PWM 94 NCP5005 2.7 - 5.5 24 LV52204 2.7 - 5.5 40 LV52205 2.7 - 5.5 40 LV52206 2.7 - 5.5 40 LV52207 2.7 - 5.5 40 40 Over 5 LED, Vin 3.6 V 2 to 5/ series PFM, up to 2.25 MHz PWM 90 30 Vout 30 V, Vin 3.7 V 2 to 10 / Series 600 kHz 1-wire & PWM 90 30 Vout 30 V, Vin 3.7 V 2 to 11 / Series 600 kHz PWM 90 30 Vout 30 V, Vin 3.7 V 2 to 10 / Series 600 kHz/1.2 MHz 1-wire & PWM 90 30 Vout 30 V, Vin 3.7 V 2 to 10 / Series 600 kHz/1.2 MHz 1-wire & PWM 90 Operating Quiescent Shutdown Current, Typ Current, Typ (mA) (mA) 1.3 µA 0.05 — 0.3 3 0.1 3 0.1 3 0.1 3 0.1 Package DFN-10 TSOP-5 UDFN-6 UDFN-6 WLP-9 WLP-9 Notes • Flash/Torch • Internal synchronous rectification • Backlight • Isw = 350 mA • Backlight • Isw = 750 mA • Backlight • Isw = 750 mA • Backlight • Different pin config • Backlight • Isw = 750 mA Inductive-Buck White-LED Drivers — for Torch/Flash Applications Device Input Voltage Range (V) Max Output Volt, Typ (V) Output Current (A) Condition Number of LEDs/ Switching Mode/ Dimming Configuration Frequency Method NCP1529 2.7 - 5.5 3.9 1 Vout 1.2 V, Vin 3.6 V 1 PWM/PFM 1.7 MHz PWM Efficiency (%) 96 Operating Quiescent Shutdown Current, Typ Current, Typ (mA) (mA) 28 0.3 Package TSOP-5, uDFN-6 Notes • Flash/Torch • Auto-switching between PWM and PFM mode at light load Device LV5207LP LV5216 Multifunction LED Drivers Input Voltage Range (V) 3.0 to 4.5 3.0 to 4.5 Main Backlight LED Driver 4-Ch (3-Ch Avail) 10-CH RGB LED Driver 1 R,G,B Independent ON/OFF R,G,B and 6 Main External Control 4 4 Topology Charge Pump Charge Pump Serial Control I2C Control Bus I2C Control Bus Package VCT-24 WLP-36 Notes • 7 LED channels total • LED current programmable in 32 steps • LED current programmable in 32 steps ON Semiconductor Page 9 LCD MODULES Ambient Light & Proximity Sensors Features • Design flexibility/customization (i.e., EEPROM if desired for trimming) • 0.0125 lux detection with customizable filtering (i.e., Photopic Light Response) • Dark current and temperature compensation • Lowest power consumption per resolution bit • I2C Interface (including High Speed Mode) and no effect on bus during power down Vin = 3.3 V hν 1k VDD SDA Ambient 1 μF Light Sensor VSS SCL 1k SDA MCU SCL LED Drivers LEDs Voltage Supply Approximates Human Eye Response 0.1 μF VCC 16-Bit I2C ADC Bus SCL SD CPU LV0104CS Control Logic GND Simple 2-Wire I2C Interface Voltage Supply 0.1 μF VCC Amp When the Sunlight is Strong, Extending the Dynamic Range by Lowering Gain LCD MODULES SW OUT Gain Cont. I/O CPU ADC LA0151CS GND Current-Voltage Conversion Device LA0151CS LA0152CS LV0104CS LV0111CF NOA1212 NOA1305 NOA3302 Special Features 2-Stage Gain Switching Standby Function Integrated Sleep Mode Standby Function Dark Current Compensation Dark Current Compensation Proximity Sensor IO Typ @ EV = 100 Lux (mA) 8 (high gain) 8 21 51 (high gain) - Output Interface Analog, linear current Analog, linear current I2C, 16-bit ADC Analog, logarithmic current Analog, linear current I2C, 16-bit ADC I2C, 16-bit ADC Vin Range (V) 2.2 - 5.5 2.2 - 5.5 2.3 - 3.6 2.3 - 5.5 2 - 5.5 2.4 - 3.6 2.3 - 3.6 TA Range (°C) -30 to +85 -30 to +85 -30 to +85 -30 to +85 -40 to +85 -40 to +85 -40 to +80 Package ODCSP-4 ODCSP-4 ODCSP-4 ODCSP-4J CUDFN-6 CUDFN-6 CWDFN-8 Page 10 Portable & Wearable Solutions LCD MODULES LC898300 Haptic Drivers LC898301 The LC898300 is a haptic driver dedicated to haptics feedback The LC898301 is an extended supply range version of the and vibrator in handheld devices. This driver adjusts automatically LC898300 LRA driver, compatible with cellular battery voltage. the driving frequency to the resonance frequency of the linear The architecture chosen allows to get a stronger vibration in a vibrator without external parts. minimal board space and cost effective solution. Moreover, the Unique Features LC898301 exhibits superior vibration performance. • Automatically adjust driving frequency (ON Semiconductor patent) • Minimized start-up and brake period (Quick stop) • Automatically stop braking to avert counter vibration Unique Features • Automatically adjust driving frequency (ON Semiconductor patent) • Minimized start-up and brake period (Quick stop) S Other Features • Supply voltage = +2.7 to +3.3 V • Iout max = 150 mA • Bridge RDS(on) = 2 x 2 W (4 x 2 W MOSFETs embedded) • No peripheral component required (only 0.1 µF cap) • Low power consumption • Automatically stop braking to avert counter vibration Other Features • Supply voltage = +3.0 to +5.5 V • Iout max = 200 mA • Bridge RDS(on) = 2 x 2 W (4 x 2 W MOSFETs embedded) • No peripheral component required (only 0.1 µF cap) Benefits • Low power consumption • High efficiency (50% less) • Easy handling (no adjustment for any LRA) • Strong vibration Device Description Package Benefits • High efficiency (50% less) • Easy handling (no adjustment for any LRA) • Strong vibration • Fault-detection • Battery direct supply • Fully configurable through I2C LC898300XA Haptic Driver for LRA WLCSP-9 VDD (3.0 V) EN Drive Signal Generator H-Bridge OUT1 Linear Vibrator OUT2 Device LC898301XA LC898301AXA Description Haptic Driver for LRA Haptic Driver for LRA with Immersion System Package WLCSP-8 WLCSP-8 VDD (3.0-5.5 V) SCL SDA Register Setting POR OSC VSS RSTB Block Diagram EN SCL SDA DVDD (1.8 V) LDO Drive Signal Generator H-Bridge with Power Control OUT1 Linear Vibrator OUT2 Register Setting OSC RSTB VSS Block Diagram ON Semiconductor Page 11 Tunable RF Components ON Semiconductor offers a family of tunable RF components designed to enhance antenna performance of smart phones. The devices optimally combine tuning range, RF quality factor (Q), and frequency operation, providing a superior solution to existing fixed-match approaches. The family of low insertion loss Passive Tunable Integrated Circuits (PTICs) and PTIC Controllers allow performance to be tuned and optimized to counter lower antenna volume and increased frequency coverage requirements. They also help overcome headand hand-effect problems that may arise from industrial antenna design. • Reduced power consumption • Enables thinner smartphone designs • Faster data rates • Greater coverage area of cell sites • Fewer dropped or missed calls • Faster time to market RF Passive Tunable Integrated Circuits can be used to replace traditional ‘fixed-match’ devices for multi-band GSM/WCDMA/LTE smart phones, tunable antenna matching networks, tunable RF filters, and active antennas. • High tuning range (4:1) and operation up to 24 V • Frequency range from 700 MHz to 2.7 GHz • High quality factor (Q) for low loss • High power handling capability Device Vbias = 2 V Capacitance Vbias = 24 V Capacitance 2 - 24 V Tuning Range (Typ) TCP-4012UB* 1.2 0.267 4.5 TCP-4018UB* 1.8 0.400 4.5 TCP-4027UB* 2.7 0.600 4.5 TCP-4033UB* 3.3 0.733 4.5 TCP-4039UB* 3.9 0.867 4.5 TCP-4047UB* 4.7 1.044 4.5 TCP-4056UB* 5.6 1.244 4.5 TCP-4068UB* 6.8 1.511 4.5 TCP-4082UB* 8.2 1.822 4.5 * Pending 3Q15. NOTE: Some devices available in high and low linearity variants. Quality Factor @ 700 MHz, 10 V (Q) 90 90 90 90 90 90 100 100 100 Quality Factor @ 2.4 GHz, 10 V (Q) 60 60 60 60 60 60 65 75 70 Operating Frequency (MHz) 700 - 2700 700 - 2700 700 - 2700 700 - 2700 700 - 2700 700 - 2700 700 - 2700 700 - 2700 700 - 2700 Package(s) WLCSP-8, QFN-6 WLCSP-8, QFN-6 WLCSP-8, QFN-6 WLCSP-8, QFN-6 WLCSP-12, QFN-6 WLCSP-12, QFN-6 WLCSP-12, QFN-6 WLCSP-12, QFN-6 WLCSP-12, QFN-6 The PTIC Controller is a high-voltage digital-to-analog device specifically designed to provide control and bias in a tunable solution. It is compatible with all ON Semiconductor PTICs. • Compliant with timing needs of cellular and other wireless system requirements • Integrated boost converter with three programmable outputs (up to 24 V) • Low power consumption • Auto-detection of SPI (30- or 32-bit) or MIPI RFFE interfaces (1.2 V or 1.8 V) Device TCC-103 TCC-106 TCC-202* TCC-206* * Pending 3Q15. Description PTIC Controller PTIC Controller PTIC Controller PTIC Controller Outputs 3 6 2 6 Voltage Range (V) 2 - 20 2 - 20 1 - 24 1 - 24 Turbo Mode Y Y Y Y Auto-Detected Interfaces MIPI RFFE; SPI MIPI RFFE; SPI RFFE RFFE; SPI ESD (V) 2000 2000 2000 2000 Package(s) RDL Ball Array WLCSP-20 WLCSP-12 WLCSP-20 Page 12 Portable & Wearable Solutions Integrated Passive Devices (IPD) • Combines multiple resistors, capacitors and inductors onto a film substrate; typical applications include RF baluns, filters, and matching networks • Reduces PCB footprint and component height versus discrete implementations, while also improving performance (reduced parasitics) • Simplifies logistics, inventory managememt and pick-and-place assembly by elimination of multiple discrete passive SKUs • Based on 110 nm silicon process with high performance and tight process control Available Components • Copper inductors, minimum spacing 3 µm, minimum line width 5 µm, current handling >50 mA/µm, achieves Q-factors up to 45 Integration of multiple R, L, and C into single IPD • MIM capacitors, 0.62 nF/mm2 , typical tolerance ±5% • TiN resistors, 9 Ω/sq • Wafers manufactured on high precision equipment, designed for 110 nm transistor fabrication • Very tight performance tolerances and low variation across wafers • Flip-chip or wirebond pad finish options • Additional back-end processing available Sub-Micron Tolerances — Trace Spacing/Width Down to 3/5 mm Inductor Within IPD (SEM Photo) RF ON Semiconductor Picked & Diced Wafer Edge Page 13 Single Ended Buffers Clock Buffer with Integrated LDO Key Features — NB3RL02 • Low additive noise: −149 dBc/Hz at 10 kHz offset phase noise • 0.37 ps (rms) output jitter • Limited output slew rate for EMI reduction (1 to 5 ns rise/fall time for 10−50 pF loads) • Regulated 1.8 V externally available I/O supply • ESD performance exceeds JESD 22 • 2000 V Human−Body Model (A114−A) • 200 V Machine Model (A115−A) • 1000 V Charged−Device Model (JESD22−C101−A Level III) • WLCSP-8 package NB3RL02 has two CMOS outputs with clock request lines. Systems in need of TCXO clock will request clock from NB3RL02, and NB3RL02 powers the TCXO and delivers the requested clock. 2.2 μF NB3RL02 VLDO LDO VBATT MCLK_IN TCXO CLK_REQ_1 CLK_OUT_1 CLK_REQ_2 CLK_OUT_2 GND 1 μF Li DTV TCXO REQ TCXO CLK TCXO REQ TCXO CLK WLAN NB3RL02 Reduces Cost by Eliminating Multiple TCXOs Clock Buffers for Wireless LAN and WiMax Key Features — NB3L02, NB3L03 • 800 mV single ended outputs • Low additive noise: -144 dBc/Hz at 10 kHz offset phase noise • ESD performance exceeds JESD 22: 2 kV Human Body Model • WLCSP-6 NB3L02 and NB3L03 are low-skew, low jitter, 1:2 and 1:3 clock buffers. The MCLK_IN pin has an AC coupling capacitor and will directly accept a square or sine wave clock input, such as a temperature compensated crystal oscillator (TCXO). The minimum acceptable input amplitude of the sine wave is 300 mV peak-to-peak. NB3L02 VBATT GND LDO CLK_OUT_1 MCLK_IN CLK_OUT_2 NB3L02 Simplified Block Diagram RF Page 14 Portable & Wearable Solutions Portable Sound Solution ASSP LC823450 series provides high resolution sound processing, with ultra-low power consumption Key Features • Ultra low power consumption • Integrated 1.5 MB SRAM • Computational Efficiency • ARM® Cortex®-M3 Dual Core • Proprietary 32-bit DSP Core (LPDSP32) • DSP audio code available for MP3 codec, FLAC codec, Noise Cancel, Zoom • High resolution 32-bit & 192 KHz audio processing capability • Integrated analog blocks for low-power Class D HP amplifier, system PLL, dedicated audio PLL • Hard wired audio functions for MP3 encoder and decoder, EQ (6-band equalizer), ASRC (Asynchronous Sample Rate Converter) • Integrated interfaces for USB2.0 HS device or host (not OTG), eMMC, SD card I/F • ASRC with jitter hiding function, DSP code for SBC/AAC, UART with DMA & FIFO support for low power Bluetooth audio 20 MHz (1-50 MHz) ADDA 2ch/2ch ADDA 2ch/2ch Battery Key Small LCD S-Flash (Quad) 32.768 kHz JTAG (LPDSP) Sys PLL OSC Aud PLL PCM 2ch I2C PCM 2ch D-AMP 2ch 10-bit ADC 6ch SPI SF(QSPI) w/ Cache RTC RC OSC ARM® ARM® Cortex®-M3 Cortex®-M3 ROM 258 KByte RAM 1.5 MByte Audio Engine H/W • MP3 Encoder • MP3 Decoder S/W (LPDSP32) • WMA Decoder • AAC Decoder • Noise Cancel, etc. SSRC, ASRC, EQ, etc. DMA 8ch Plain Timer (w/ WDT) 1ch * 3 Multiple Timer 2ch * 4 SWD or SWV (M3) USB2.0 Host or or Device XMC(2CS) and LCD SDRAMC (1CS) eMMC SD/MS SD UART UART 2ch I2C GPcIO 90ch 8/16bit 8bit NOR SRAM Color LCD SDRAM eMMC SD/MS w/ CTS, RTS WiFi Module, etc. Bluetooth HCI Module SW etc Device LC823450TA* Design Focus Voice Recorder LC823450XA* Wearable LC823450XB* * Pending 3Q15. High End ON Semiconductor Frequency (MHz) 160 @ 1.2 V Typ 100 @ 1.0 V Typ 160 @ 1.2 V Typ 100 @ 1.0 V Typ 160 @ 1.2 V Typ 100 @ 1.0 V Typ RAM ARM Cortex-M3 SD Card I/F (MB) Cores Channels 1.5 Single 3 Features Class D HP Amplifier Package TQFP-128L 1.5 Single 1.5 Dual 2 External Memory Controller WLP-154 3 Class D HP Amplifier; External Memory Controller WLP-154 Page 15 AUDIO BelaSigna® Audio Processors The BelaSigna line of open-programmable audio processors is optimized for portable applications, delivering superior audio clarity without compromising size or battery life. Real-time adaptive processing 010100001... 100111000... SELECTIVITY SPATIAL z y x TEMPORAL FREQUENCY Capture & Digitization Sounds are captured by one or two microphones and converted to digital signals Extraction Where is the sound coming from? When is speech occuring? What is the pitch of the sounds? Capable of simultaneously selecting multiple speech sources from any location Comparison Sounds that do not match voice properties are filtered Enhancement Clear voice with improved intelligibility and preserved naturalness BelaSigna offers ultra-low power consumption, design flexibility, and a miniature package by providing a highly integrated hardware solution with a dual-core architecture featuring an open-programmable DSP core with a highly configurable coprocessor. Features and Benefits • Ultra-low power consumption • Design flexibility • Miniature size • Computational Efficiency • Audio fidelity • Comprehensive development tools Device BelaSigna 300 BelaSigna 250 Description Dynamic MIPS Range RAM Max (dB) (kB) Interfaces Power Consumption Standby Current (mA) Analog Audio Package(s) 24-bit Audio Processor for Portable Communication Devices 240 110/88 110 I2C, SPI, I2S, PCM, GPIO, 1-5 mA typical 40 4/1 WLCSP-35, DFN-44 16-bit Audio Processor, Full Stereo 2-in, 2-out 60 88 42 I2C, SPI, I2S, PCM, GPIO, UART 5 mA at 20 MHz 50 2/2 LFBGA-64, LFBGA-57 AUDIO Page 16 Portable & Wearable Solutions Developing a portable audio device from initial concept and design through to production can be a complex and lengthy process. Success, however, often depends on shortening product development cycles, enabling faster time-to-market. ON Semiconductor addresses this need by providing designers with a complete solution, no matter which development path they chose. In addition to a variety of software algorithm bundles, BelaSigna audio processors are also complemented by an advanced suite of development tools. The fully integrated set of development tools enable manufacturers to quickly and easily develop, debug and test algorithm software for ON Semiconductor’s audio DSP systems. Evaluation and Development Kit Contents Software EDK Software and Documentation* Integrated Development Environment (IDE) Advanced Editor Debugger Project Manager Automated Build System Project Wizard EEPROM Manager Assembler Sample Applications System Libraries Documentation Set WOLA Toolbox SignaKlara™ Blockset CTK Developer Kit (CTK DK) CAA Drivers Hardware Evaluation and Development Board (EDB) Communication Accelerator Adaptor (CAA) RS-232 serial cable USB cable I2C cable Universal power supply (input 100-240 VAC, ~60/50Hz; output 9 VDC, 1.1A) * The EDK includes one year of software updates. Optional Hardware Rapid Prototyping Module (RPM) RPM Motherboard Available for Purchase Available for Purchase Supplementary hardware, such as the Communication Accelerator Adaptor and Evaluation and Development Board, are also available for purchase. Contact your local ON Semiconductor sales office at www.onsemi.com/salessupport for information on purchasing or renewing software subscriptions. AUDIO ON Semiconductor Page 17 + Solution Evaluation To evaluate audio processors and signal processing software, ON Semiconductor offers a solution that is easy to demonstrate, evaluate and design in. Developers can use software tools to develop their own signal processing algorithms to run on the BelaSigna hardware. RPM Algorithm Development To support the algorithm development process, ON Semiconductor offers an Evaluation and Development Kit (EDK) featuring an Integrated software Development Environment (IDE) for composing, compiling and debugging algorithm code. A Communication Accelerator Adaptor (CAA) connects the IDE running on a PC to a Rapid Prototyping Module (RPM) or Evaluation and Development Board (EDB)*. Using these components, developers can implement and immediately validate the performance of their proprietary algorithms, third-party algorithms, or other software integrated with BelaSigna bundles directly on BelaSigna hardware. PC IDE CAA RPM or EDB* Integrated Development Environment (IDE) ON Semiconductor’s Integrated Development Environment is a fully integrated software development environment that enables developers to code, compile, debug and validate algorithms. Features include: • Team based programming that greatly simplifies project management by allowing multiple developers to simultaneously work on the same design. • Project wizard with templates based on sample algorithms, automatic no-maintenance project builder and system libraries to reduce development time. • Integrated debugger providing full source code debugging and scriptable interface, customized expression watch, register, and memory views with changed value highlighting. • Sample application source code provides complete sample algorithms plus samples of most basic application components. • Advanced editor with content assist (command completion), syntax highlighting and integrated help enables context-sensitive, dynamic reference lookup. • Full user and reference documentation set integrated with the IDE; dynamically searchable while editing. • Interactive scripting console allowing developers to script activities within the IDE using a Python-like language, and to execute/test automated scripts that can interface with the chip and the development environment. Page 18 3 4 1 5 6 2 8 7 9 Debug perspective showing (1) source code, (2) disassembly, (3) debug, (4) breakpoint, (5) expression, (6) register, (7) command console, (8) content assist, and (9) memory views. 6 1 2 4 3 7 5 8 Development perspective showing (1) advanced editor with (2) content assist, (3) dynamic help, (4) workspace navigator, (5) cheat sheets for common tasks, (6) outline view, (7) tasks, and (8) console views. Console shows build output and is a tabbed overlay with search, bookmark and error views. Portable & Wearable Solutions AUDIO Hardware Testing & Prototyping ON Semiconductor enables form-factor hardware testing and prototyping with an RPM, optionally attached to a motherboard, that connects directly to a CAA. The RPM’s plug-in design enables developers to quickly transition from development in a simulation environment to testing a complete portable audio system. To facilitate development and testing even further, the RPM can be moved directly from the motherboard to a prototype for final hardware assessment. PC CTK DK CAA RPM or Proto PASSED Production & Final Testing To prepare portable audio products for the market, the CTK Run-time and CAA enable manufacturers to store firmware and data on an attached EEPROM, tune parameters on a unit-by-unit basis, configure the chip, and run final tests. By attaching a CAA directly to a Printed Circuit Board Assembly (PCBA), the CTK DK can be used to develop a customized software-controlled production flow to meet the specific needs of your production environment. PCBA Communication Accelerator Adapter (CAA) The Communication Accelerator Adaptor is a universal hardware adaptor that facilitates high-speed communication between host PCs (using USB 1.1 or 2.0) and ON Semiconductor development boards (EDB, RPM Motherboard). The CAA is reprogrammable and can also be used to transfer final software to products in a production or final test environment. Rapid Prototyping Module (RPM) The Rapid Prototyping Module enables manufacturers to easily demonstrate and evaluate the audio performance and power consumption of ON Semiconductor audio processors in a real world environment. The small-footprint RPM is designed for easy attachment to existing portable audio devices while maintaining full portability. The RPM also facilitates fast and easy prototyping, and once concepts and possible configurations are tested and evaluated, the resulting integrated design will reduce risk and enable a faster time-to-market. For added flexibility, a companion motherboard is also available that makes it easy to demonstrate and evaluate BelaSigna audio DSPs on their own, without the need for a product prototype. The motherboard also enables programming of the RPM. Full layout and schematic information for the RPM is provided with the board. Evaluation and Development Board (EDB) The Evaluation and Development Board enables the development, demonstration, testing and debugging of signal processing software. The EDB provides all peripherals needed for measurement and validation, including additional inputs and outputs for extra testing. By facilitating early validation of developed sound processing algorithm performance, the EDB helps to reduce overall development time. * EDB for BelaSigna 200 and 250 only. ON Semiconductor Page 19 AUDIO Audio Amplifiers Device Category Description VIN Class (V) Pout IQ THD+N PSRR (W) (mA) (%) (dB) Package(s) NCP2820 Speaker Amplifier 2.65 W Class D Amplifier, fast start up D 2.5 to 5.5 2.65 W, 4 W, 5 V, 1% THD 2.15 0.05 65 CSP-9 NCP2823 Speaker Amplifier 3 W Class D Amplifier D 2.5 to 5.5 2.65 W, 4 W, 5 V, 1% THD 1.8 0.08 77 CSP-9 NCP2890 Speaker Amplifier 1.0 W Audio Power Amplifier AB 2.2 to 5.5 1.0 W, 8 W, 5 V, 0.1% THD 1.5 0.02 72 CSP-9, Micro8 NCP2993 Speaker Amplifier 1.3 W Class AB Amplifier, fast start up, zero pop AB 2.5 to 5.5 1.25 W, 8 W, 5 V, 1% THD 1.5 0.02 80 CSP-9 NCP4894 Speaker Amplifier 1.8 W Differential Class AB Amplifier AB 2.5 to 5.5 1.8 W, 8 Ω, 5 V, 1% THD 1.9 0.006 85 CSP-9, Micro-10, DFN-10 NCP2811 Headphone Amplifier 63 mW Stereo Headphone Amplifier, true ground reference AB 2.9 to 5 63 mW, 16 Ω, 1% THD 6.5 0.01 100 CSP-12, UQFN-12, TSSOP-14 NCP2817 Headphone Amplifier 31 mW Long Play Stereo Headphone Amplifier, true ground reference AB 1.6 to 5.5 31 mW, 16 Ω, 1% THD 2.3 0.019 100 CSP-12 AUDIO Page 20 Portable & Wearable Solutions Low Power Comparators Headphones + Mic > 1 kΩ LR Mic Hook Switch Handsfree Head Set VCC Hook Switch Detection L R Vref ON/OFF VCC NCS2220A Vref Detect Mirophone and Headphone Detection Hook Switch CELL PHONE Typical Detection Circuit Device NCS3402 NCS2220 NCS2200A NCS2202A NCV2393 NCS2200 NCS2202 LMV339 LMV393 LMV331 Configuration 2 2 1 1 2 1 1 4 2 1 VS Min (V) 2.5 0.85 0.85 0.85 2.7 0.85 0.85 2.7 2.7 2.7 VS Max IQ/Channel tRESP(H-L) IOUT (V) (mA) (ms) (mA) 16 0.47 18 10 6 7.5 0.5 60 6 9 0.46 70 6 9 0.46 70 16 9 0.8 20 6 10 0.7 70 6 10 0.7 70 5 35 0.5 84 5 35 0.5 84 5 40 0.5 84 Output Type Open Drain Complementary Complementary Open Drain Open Drain Complementary Open Drain Open Drain Open Drain Open Drain Package(s) SOIC-8 UDFN-8, UQFN-8 UDFN-6 UDFN-6 SOIC-8 SOT-23-5, SC-70-5, DFN-6 SOT-23-5, SC-70-5 SOIC-14, TSSOP-14 Micro8, SOIC-8, UDFN-8 SOT-23-5, SC-70-5 AUDIO Ear Jack Detection Interface NCS2300 integrates a comparator, OR gate, and N-channel MOSFET to S/E_REF S/E_DET VDD2 S/E detect the presence of a stereo headset with a microphone. A built in NCS2302 resistor-divider provides an internal reference voltage for detecting the left audio channel. The logic output indicating headset presence can VDD VDD VDD MIC then be connected to the baseband GPIO. NCS2302 includes the send/ 270 k end button detection functionality. Key Features • Supply voltage: 1.6 - 2.5V • Low quiescent supply current: 7 µA typical • UDFN-6 for NCS2300 UQFN-10 for NCS2302 1M VDD 1M VDD 1M VDD L_DET GND_DET VDD NCS2302 Block Diagram DET GND ON Semiconductor Page 21 POWER MANAGEMENT ARM® Core DC-DC Converters Key Features • High regulating performance from 0.6 V to 1.4 V • Modular efficiency with fragmented power stage • Dynamic voltage scaling per output steps of 6.25 mV by I2C • Tight accuracy of ±1%, due to differential sensing • Fast transient response • Proprietary PFM to PWM transition with equivalent performance to PWM only • Thermally handle high peak current demands up to 10 ms • Flexible design to transient handling output capacitor from 22 µF to 100 µF Efficiency (%) PWM Efficiency DCDC Converter Modular Output Vin = 3.6 V, Vout = 1.20 V, Fsw = 3.0 MHz, Lossless Inductor(s) 0.95 0.9 0.85 1 2 3 5 10 0.8 Number of Modules 0.75 0.7 0.10 1.00 Load Current (A) VIN Device (V) VOUT IOUT (V) (A) NCP6338 2.3 – 5.5 0.6 – 1.4 6.0 NCP6336* 2.3 – 5.5 0.6 – 1.4 5.0 NCP6335 2.3 – 5.5 0.6 – 1.4 4.0 NCP6343 2.3 – 5.5 0.6 – 1.4 3.5 * Pending 3Q15. fSW (MHz) 3.0 2.74 3.0 3.0 Control I²C; VSEL I²C; VSEL I²C; VSEL I²C Features Modular power stage; Differential sensing Dynamic voltage scaling Transient load helper Dynamic voltage scaling Package WLCSP-30 WLCSP-20 WLCSP-20 WLCSP-15 Page 22 Portable & Wearable Solutions Efficiency (%) POWER MANAGEMENT Peripheral DC-DC Converters 100 95 Key Features 90 • High efficiency conversion - up to 94% - over large input & 85 output voltage range 80 • High switching frequency - up to 6.0 MHz - reduces external 75 component size (inductor down to 220 nH) 70 • Design flexibility with adjustable resistor bridge, independent enable control, power good or mode selection pin 65 60 55 50 1 NCP6314C auto mode, Vout = 1.8 V 10 100 1000 Output Current (mA) 2.7 V 3.6 V 5.5 V 10000 Small inductor down to 220 nH Small capacitor: 10 μF  Cost and space savings Battery or AVIN System Supply AGND Processor or EN System Supply Power State PG Indicator Core Thermal Protection Enabling DCDC 2A 1.5-6 MHz Control PVIN 1 μH 10 μF SW FB PGND Battery or System Supply DCDC Out 22 μF Power Good (B version)  Limit external component count Mode Selection (C version)  Design flexibility VIN Device (V) VOUT IOUT (V) (A) NCP1521B 2.7 – 5.5 0.9 – 3.3 0.6 NCP1522B 2.7 – 5.5 0.9 – 3.3 0.6 NCP1529 2.7 – 5.5 0.9 – 3.3 1.0 NCP6324 2.5 – 5.5 0.6 – 5.0 2.0 NCP6332B 2.3 – 5.5 0.6 – 5.0 1.2 NCP6332C 2.3 – 5.5 0.6 – 5.0 1.2 NCP6334B 2.3 – 5.5 0.6 – 5.0 2.0 NCP6334C 2.3 – 5.5 0.6 – 5.0 2.0 NCP6354 2.3 – 5.5 0.6 – 5.0 2.0 fSW (MHz) 1.5 3 1.7 3 3 3 3 3 3 Operating Mode PFM/PWM PFM/PWM PFM/PWM PFM/PWM PFM/PWM PFM/PWM PFM/PWM PFM/PWM PWM Features — — — Mode Selection Power Good Mode Selection Power Good Mode Selection Power Good Package(s) TSOP-5, UDFN-6 TSOP-5, UDFN-6 TSOP-5, UDFN-6 WDFN-8 UDFN-8 UDFN-8 UDFN-8 UDFN-8 UDFN-8 ON Semiconductor Page 23 POWER MANAGEMENT LDO Regulators Device NCP161 NCP4589 NCP4683 NCP114 NCP703 NCP160 NCP700B NCP702 NCP4680 NCP103 NCP170 NCP716 NCP715 IO Typ (mA) 450 300 300 300 300 250 200 200 150 150 150 80 50 Iq Typ (mA) 20 55 50 50 12 20 70 10 50 50 0.5 4.7 4.7 Vin Max VO (V) (V) 6 1.8, 2.5, 2.8, 2.85, 3.0, 3.3, 3.5, 4.5, 5.0, 5.14 5.3 1.2, 1.8, 2.5, 2.8, 3.0, 3.3 6 1.2, 1.8, 1.85, 2.8, 2.85, 3.1, 3.3 6 1.0, 1.05, 1.1, 1.2, 1.25, 1.3, 1.5, 1.8, 2.1, 2.6, 2.8, 2.85, 3.0, 3.1, 3.3, 3.45, 3.5 5.5 1.8, 1.9, 2.8, 3.0, 3.3, 3.5 6 1.8, 2.5, 2.8, 2.85, 3.0, 3.3, 3.5, 4.5, 5.0, 5.14 6 1.8, 2.5, 2.8, 3.0, 3.3 5.5 1.8, 2.8, 3.0, 3.3 6 0.8, 0.9, 1.0, 1.2, 1.5, 1.8, 2.3, 2.5, 2.8, 3.0, 3.3 6 1.0, 1.05, 1.1, 1.2, 1.25, 1.3, 1.5, 1.8, 2.1, 2.6, 2.8, 2.85, 3.0, 3.1, 3.3, 3.45, 3.5 5.5 1.2, 1.5, 1.8, 2.5, 2.8, 3.0, 3.3 24 1.2, 1.5, 1.8, 2.5, 2.8, 3.0, 3.3, 5.0 24 1.2, 1.5, 1.8, 2.5, 2.8, 3.0, 3.3, 5.0 PSRR (dB) 90 70 65 75 68 90 82 70 75 75 40 52 52 Noise (mVrms) 10 90 65 Package(s) CSP-4, XDFN-4 SC-88A-5/SC-70-5/SOT-323-5; SOT-23-5; XDFN-6 SC-88A-5/SC-70-5/SOT-323-5; UDFN-4 60 uDFN-4 13 TSOP-5/SOT-23-5; XDFN-6 10 CSP-4, XDFN-4 10 TSOP-5/SOT-23-5; WDFN-6 11 TSOP-5/SOT-23-5; XDFN-6 60 SC-88A-5/SC-70-5/SOT-323-5; XDFN-4 60 uDFN-4 85 SOT-563, XDFN-4 65 SC-70-5, xDFN6 65 xDFN-6 Page 24 Portable & Wearable Solutions POWER MANAGEMENT Voltage and Current Protection USB Host Over Current Protection protects USB Host from short circuit, over load or hot plugs faults on USB device. USB Device Over Voltage Protection protects USB Device from overshoot, host dc-dc feedback failure, or any over voltage faults on USB host. Device NCP347 NCP348 NCP349 NCP360 NCP361 NCP367 NCP370 NCP372 NCP373 NCP374 NCP380 NCP382 NCP383 NCP391 NCP392 Type Over Voltage Over Voltage Over Voltage Over Voltage Over Voltage and Over Current Over Voltage and Over Current, with battery over charged detection Over Voltage and Over Current VIN Min VIN Max OVP (V) (V) (V) 1.2 28 5.63; 5.85; 5.9; 7.2 1.2 28 6.02; 6.4 1.2 28 5.68; 6.02; 6.4; 6.85 1.2 20 5.675; 6.25; 7.07; 7.2 1.2 20 5.675 1.2 28 5.85; 6.07; 6.84; 7.2 -28 28 6.6 UVLO (V) 2.95 3.25 2.95; 3.25 3 3 1.85 2.7 Over Voltage -30 30 6.3 2.7 Over Voltage, with reverse Over Current Limit 1.2 30 5.77 2.7 Over Voltage, with reverse Over Current Limit 1.2 30 5.77 2.7 Over Current, Single Channel USB 2.5 5.5 — 2.3 Over Current, Dual Channel USB 2.5 5.5 — 2.35 Over Current, Dual Channel USB 2.7 5.5 — 2.45 Over Voltage 1.2 28 7.4 2.95 Adjustable Front End Over Voltage 2.8 28 5.95; 6.8; 13.8; 15.5 2.8 Current Limit (mA) — — — — 750 Adjustable up to 2800 1750 — 400; 1300 750 Fixed or Adjustable up to 2100 Fixed or Adjustable up to 2000 Adjustable up to 2800 — — RDS(ON) (mW) 65 65 65 210 300 50 130 130 130 80 55 80 45 120 34 Features Status FLAG Status FLAG Status FLAG Status FLAG; Thermal SD Status FLAG; Thermal SD VBAT Detect; Thermal SD Status FLAG; Thermal SD Status FLAG; Thermal SD Status FLAG; Thermal SD Status FLAG; Thermal SD Thermal SD; UL Listed Package(s) WDFN-10 WDFN-10 DFN-6 TSOP-5; SOT-23-5; UDFN-6 TSOP-5; SOT-23-5; UDFN-6 DFN-8 LLGA-12 LLGA-12 LLGA-12 TLLGA-12 TSOP-5; TSOP-6; SOT-23-5; UDFN-6 Thermal SD; UL Listed Thermal SD; UL Listed Status FLAG; Thermal SD 100 V Surge Capability DFN-8; SOIC-8 UDFN-10 WLCSP-6 WLCSP-12 ON Semiconductor Page 25 POWER MANAGEMENT Advanced Load Switches ON Semiconductor provides a comprehensive range of load switches, suitable for a variety of different power trees. • Copackaged MOSFET plus CMOS controllers – value-added features plus high performance • Monolithic CMOS smart load switches – value added features, low cost • Discrete MOSFETs – simple, high performance VCC EN PG VIN Bandgap & Biases Control Logic Charge Pump Delay and Slew Rate Control Thermal, Undervoltage & Short-Circuit Protection NCP45xxx Integrated Load Switch Feature • Simple/clean design • No current consumption in standby power mode • Small PCB footprint • Low RDS(ON) due to charge pump driving NMOS • Adjustable soft-start time (SR) • Adjustable integrated discharge • Fault protection • Power rail monitoring & sequencing SR GND BLEED VOUT ron I Max Type Device (mW) (A) NCP330 26 at 3.3 V 3 NCP333 55 at 3.3 V 1.5 NCP334 47 at 3.3 V 2 NCP335 47 at 3.3 V 2 NCP336 23 at 3.3 V 3 Smart Load Switch NCP337 23 at 3.3 V 3 NCP338 27 at 1.8 V 2 NCP339 26 at 3.3 V 3 NCP432 50 at 1.8 V 1.5 NCP433 50 at 1.8 V 1.5 NCP434 43 at 1.8 V 2 NCP435 43 at 1.8 V 2 NCP436 23 at 1.8 V 3 NCP437 23 at 1.8 V 3 NCP45524 18.0 6 ecoSWITCH™ Integrated Load Switch NCP45525 18.0 6 NCP45560 2.4 24 NCP45540 3.3 20 NCP45541 3.3 20 NCP45520 9.5 10.5 NCP45521 9.5 10.5 VI Min (V) 1.8 1.2 1.2 1.2 1.2 1.2 1 1.2 1 1 1 1 1 1 0.5 0.5 0.5 0.5 0.5 0.5 0.5 VI Max (V) 5.5 5.5 5.5 5.5 5.5 5.5 3.6 5.5 3.6 3.6 3.6 3.6 3.6 3.6 13.5 13.5 13.5 13.5 13.5 13.5 13.5 IQ Slew Rate (mA) Discharge (ms) Features 100 - 2000 Reverse blocking 1 Auto 95 - 1 - 71 - 1 Auto 71 - 1 - 810 - 1 Auto 810 - 0.6 Auto 20 - 2 - 2700 Reverse blocking 0.6 - 20 - 0.6 Auto 20 - 0.6 - 61 - 0.6 Auto 61 - 1 - 27 - 1 Auto 27 - - Adj - Power good - Adj Adj - - Adj Adj Power good; Fault - Adj Adj Power good; Fault - Adj Adj Power good - Adj - Power good; Fault - Adj Adj Fault Package(s) TDFN-4 WLCSP-4 WLCSP-4 WLCSP-4 WLCSP-6 WLCSP-6 WLCSP-6 WLCSP-6 WLCSP-4 WLCSP-4 WLCSP-4 WLCSP-4 WLCSP-6 WLCSP-6 DFN-8 DFN-8 DFN-12 DFN-12 DFN-12 DFN-8 DFN-8 Page 26 Portable & Wearable Solutions POWER MANAGEMENT Simple Load Switches Vin USB Secondary Charging Pass (Wireless) MOSFET PMU/Charging IC System Device MCH3333A SCH1345 NTLUS3A39PZ NTLUD3A260PZ NTLUS3A18PZ NTLUD3A50PZ N TL JS3A18PZ NT TFS3A08PZ SCH1331 NTLUS3C18PZ MCH6351 MCH6353 EMH2314 ECH8308 SCH1430 SCH1433 MCH6448 EMH2407 EMH2408 ECH8420 NTLUS4930N NTLUS4C12N N TL JS4114N N TL JD4116N MCH6431 ECH8662 MCH3486 Switching Charger – Step Down Polarity P-Channel P-Channel P-Channel P-Channel P-Channel P-Channel P-Channel P-Channel P-Channel P-Channel P-Channel P-Channel P-Channel P-Channel N-Channel N-Channel N-Channel N-Channel N-Channel N-Channel N-Channel N-Channel N-Channel N-Channel N-Channel N-Channel N-Channel Configuration Single Single Single Dual Single Dual Single Single Single Single Single Single Dual Single Single Single Single Dual - Common Drain Dual Single Single Single Single Dual Single Dual Single V(BR)DSS Min (V) -30 -20 -20 -20 -20 -20 -20 -20 -12 -12 -12 -12 -12 -12 20 20 20 20 20 20 30 30 30 30 30 40 60 VGS Max (V) ±10 ±10 ±8 ±8 ±8 ±8 ±8 ±8 ±10 ±8 ±10 ±10 ±10 ±10 ±12 ±10 ±9 ±12 ±12 ±12 ±20 ±20 ±12 ±12 ±20 ±10 ±20 ID Max (A) 2 4.5 5.2 1.7 8.2 4.5 8.2 15 3 7 9 5.5 6 10 2 3.5 8 6 4 14 6.3 9.1 6 3.7 5 6.5 2 RDS(ON) Max @ VGS = 4.5 V (W) 0.215 0.049 0.039 0.2 0.018 0.048 0.018 0.067 0.084 0.024 0.016 0.035 0.037 0.013 0.125 0.064 0.022 0.025 0.045 0.0068 0.033 0.015 0.035 0.07 0.091 0.03 0.192 Package(s) MCPH-3 SOT-563 UDFN-6 UDFN-6 UDFN-6 UDFN-6 WDFN-6 µ8FL SOT-563 UDFN-6 MCPH-6 MCPH-6 EMH-8 ECH-8 SOT-563 SOT-563 MCPH-6 EMH-8 EMH-8 ECH-8 UDFN-6 UDFN-6 WDFN-6 WDFN-6 MCPH-6 ECH-8 MCPH-3 ON Semiconductor Page 27 POWER MANAGEMENT Switching Battery Chargers Key Features • Sized for micro USB connector (USB BC1.2) with 1.5 A, 1.6 A, 1.8 A, 2.5 A charging current • Automatic input current limit adapts charging current to the maximum capability of the power source; proven charging time decrease by 10 minutes • Integrated 28 V over voltage protection with unique negative voltage support • Up to 1 A embedded boost USB OTG saves BOM cost • Automatically disconnects battery at end of charge, with reconnect in few seconds in case of peak current activity (GSM for instance) • Instant turn-on at cable insertion when battery is weak • Enable smart fast charging ports with input voltage capability up to 16 V (NCP1855) NCP1855 Charging Profile for 4.2 V, 2500 mAh Battery Pack, Input Source Limited to 1 A Device NCP1850 NCP1851 NCP1852 NCP1854 NCP1855 Charging Pre-Charge OTG Boost VCC Current Max Current Max Current Max Max (A) (mA) (mA) (V) 1.5 450 250 7 1.6 300 500 7 1.8 300 500 7 2.5 300 500 7 2.5 300 500 16 OVP (V) +28 +28 +28/–20 +28 +28 I2C 400 kHz 400 kHz / 3.4 MHz 400 kHz / 3.4 MHz 400 kHz / 3.4 MHz 400 kHz / 3.4 MHz Automatic Protected Battery Input Current Dual Path USB PHY Temperature Limiting Management Supply (mA) Sensing Package Yes Yes (external) 30 Threshold WLCSP-25 Yes Yes (external) 50 JEITA Flip-Chip-25 Yes Yes (external) 50 JEITA Flip-Chip-25 Yes Yes (external) 50 JEITA Flip-Chip-25 Yes Yes (external) 50 JEITA Flip-Chip-25 +28 V Overvoltage Protection Automatic Input Current Limiter 15.5 V Operating Switching Battery Charger 1000 mA 5 V Boost USB Transceiver Supply I2C 400 kHz 3.4 MHz NCP1855 Battery Charging State Machine Current & Voltage Monitoring Dynamic Power Path Management 300 mA Precharge Battery NTC Page 28 Portable & Wearable Solutions Power Switch POWER MANAGEMENT Full Bridge Rectifier for Wireless Charging Loosely Coupled Wireless Charging Features • Spatial Freedom; no alignment or direct contact to transmitter is required • Charge multiple devices at once through surfaces • Can charge in the presence of metal objects such as coins or keys Auto/Consumer Interfaces uC/AP Power Management ASIC PA RF Tuning 6.78 MHz 4 - 20 V Bridge uC/AP Front-End Power Conversion 4 - 12 V and Monitor 4 - 28 V 100 V Surge OVP 4 - 12 V A4WP Receiver for Smartphone Battery Charger A4WP Transmitter Auto/Consumer Power ON Semiconductor Other Blocks 6.78 MHz 1 - 20 V Bridge uC/AP Front-End 4 - 12 V Power Conversion and Monitor Battery Charger A4WP Receiver for Accessory Alliance for Wireless Power (A4WP) – Rezence – System Blocks Device VCC Max PD Max Type (V) (W) NSR1030QMU* Full Bridge 30 30 NSR2030QMU* Full Bridge 30 60 * Pending 3Q15. Contact your local representative for information on other components. Peak Current Typ (A) Package(s) 1 UDFN-4 2 UDFN-4 ON Semiconductor Page 29 POWER MANAGEMENT Full Bridge Rectifier for Inductive Wireless Charging Key Features – NMLU1210 • Full Bridge Rectification block - up of 3.2 A of operation • Low RDS(ON) minimizes conduction losses • Low profile UDFN-8 package (4 x 4 x 0.55 mm) VLL Device (V) NMLU1210 20 MOSFET SCHOTTKY ID RDS(ON) Max @ VGS = 10 V VR VF IF (A) (W) (V) (A) (A) 3.2 0.017 20 0.45 3.2 Package(s) UDFN-8 Vout C1 Vout C2 L1_1 AC Input GND1 A1 A2 D1 D2 S1 G1 G2 S2 GND1 GND2 L1_2 GND2 DC Output AC-DC Drivers + Controller + V/I Sensing Transmitter NMLU1210 AC-DC DC-DC Step Down and Control Receiver Page 30 Portable & Wearable Solutions POWER MANAGEMENT Li-ion Battery Protection BATT VDD VSS DO CO VM 2-in-1 Controller and Dual MOSFET Discharge MOSFET Charge MOSFET Device Configuration Polarity VSSS Max VGSS Max (V) (V) EFC4626R Dual N-Channel 24 ±12 EFC4619R Dual N-Channel 24 ±12 EFC4621R Dual N-Channel 24 ±12 EFC4627R Dual N-Channel 12 ±10 EFC6601R Dual N-Channel 24 ±12 EFC6602R Dual N-Channel 12 ±12 EFC6604R Dual N-Channel 12 ±12 EFC6611R Dual N-Channel 12 ±8 EMH2418R Dual N-Channel 24 ±12 EMH2407 Dual N-Channel 20 ±12 EMH2417R Dual N-Channel 12 ±12 ECH8693R Dual N-Channel 24 ±12 ECH8695R Dual N-Channel 24 ±12.5 ECH8697R Dual N-Channel 24 ±12 CPH6636R Dual N-Channel 24 ±12 LC05111CMT 2 in 1** N-Channel 24 ±12 LC05112CMT 2 in 1 N-Channel 24 ±12 LC05132C01MT 2 in 1*** N-Channel 24 ±12 * @ VGS = 3.1 V. ** Auto wakeup, 0 V charge. *** Reset function. NOTE: RSS(ON) = RDS(ON) x 2. IS (DC) (A) 5 6 9 6 13 18 13 27 8.5 6 8 11 11 10 6 8 8 8 RSS(ON) @ VGS = 4.5 V Min/Typ/Max (mW) 29.2/37.5/46.2 13.5/19.8/23.0 10.8/15.5/18.0 18.5 / 23.9/29.5 6.6 / 9.5/11.5 3.1 / 4.5/ 5.9 6.0 / 7.5/ 9.0 1.8 / 2.3/ 3.2 9.1/13.0/16.9 13.0/19.0/25.0 8.7/12.4/16.1 5.6/8.5/10.4 5.6/7.0/9.1 7.7/11.0/14.3 15.0/17.5/20.0 8.8/11.2/14.0 8.8/11.2/14.0 8.8/11.2/14.0 RSS(ON) @ VGS = 2.5 V Min/Typ/Max (mW) 42.6/54.0/72.4 18.5/27.0/35.0 14.9/23.0/30.0 29.3 / 37.7/50.5 9.0/13.0/17.0 5.2/7.5/11.0 10.0/12.6/17.7 2.7/4.0/6.3 13.8/23.0/32.2 16.0/28.0/39.0 10.8/15.4/20.0 7.8/13.0/18.2 7.5/9.5/13.3 11.4/19.0/26.6 19.5/24.5/29.5 10.4/13.0/18.2* 10.4/13.0/18.2* 10.4/13.0/18.2* QG Typ (V) 7.5 21.7 29 13.4 48 55 29 100 6.3 13 10 3 - Package(s) EFCP EFCP EFCP EFCP EFCP EFCP EFCP EFCP EMH EMH EMH ECH-8 ECH-8 ECH-8 CPH-6 WDFN-6 WDFN-6 WDFN-6 ON Semiconductor Page 31 POWER MANAGEMENT LC709203F High Accuracy Fuel Gauge LSI Fuel Gauge for 1 Cell Li+ with Low Power and with No Sense Register Conventional Display With LC709203F Key Features • Accuracy of remaining capacity ±2.8% (0 ~ +50°C) • Active mode current of 15 μA • Hibernate mode current of 2 μA • Standby mode current (RAM retention) of 0.1 µA • No need for sense register for current detection Standby Time 120 h Call Time 75 min 77% Detailed Display of Remaining Capacity Correct Operating Time 100 100 0°C 90 Room Temp 50°C 90 Ideal 80 80 70 70 60 60 50 50 40 40 30 Load: 50 mA 20 Battery: DB-L50 Typ 1900 mAh 10 30 Room Temp 20 Battery: DB-L50 Typ 1900 mAh 10 0 100 90 80 70 60 50 40 30 20 10 0 Real (%) Ideal vs. Display (by Temperature) 0 100 90 80 70 60 50 40 30 Real (%) Ideal vs. Display (by Load) Discharge Characteristics 500 mA 750 mA 1000 mA 1250 mA 1500 mA Ideal 20 10 0 Disp (%) Disp (%) Page 32 Portable & Wearable Solutions POWER MANAGEMENT Mid Scale Power Management Integration Key Features • Extensive IP library • Flexibility for platforms derivatives with full programmability by I2C • Offers real time load management with Dynamic Voltage Scaling • High performance •High efficiency (up to 96%) and low quiescent current (<100 µA) to improve battery life •Low noise LDO (30 µVrms @ 100 Hz-100 kHz ) meets the latest sensors requirements • Quick turn around and time to market solutions • WLCSP, QFN packages Core • Vin 2.3 - 5.5 V • Bandgap • Oscillator • Biasing BUCKs • Vin 2.3 - 5.5 V • Vout 0.6 - 5.5 V • Up to 6.0 A/ channel • Dynamic voltage scaling LDOs • Low noise, low Iq • High PSRR • Vin 1.7 - 5.5 V • Vout from 1.0 - 3.3 V • Up to 300 mA/ channel Features & Monitors • 10 bit ADC • I2C / OTP • Sequencer • External sync • Individual enable • Power Good Customization • Flash LED • Load switch • Boost/bypass • Buck/boost • Battery charger • Clock Generator • Memory • Wireless Power Device NCP6925 NCP6924 NCP6922C* NCP6914 NCP6915 NCP6951* * Pending 3Q15. DC-DC (mA) 2 x 1000 2 x 1000 2 x 800 1 x 800 1 x 600 1 x 600 LDO (mA) 5 x 300 2 x 300, 2 x 150 2 x 150 4 x 300 1 x 300, 4 x 150 4 x 150, 1 x 300 Package(s) CSP-36 CSP-30 QFN-20 CSP-20 CSP-16 CSP-24 ON Semiconductor Page 33 POWER MANAGEMENT Optimized Schottky Diodes As wireless devices become smaller and thinner, more compact, energy efficient components are necessary. Optimized DSN2 Schottky diodes offer best in class thermal efficiency, and are considerably smaller than equivalent current handling devices. A lower forward voltage - compared to similar devices – also improves energy efficiency. Lower Efficiency Gull Wing Flat Lead QFN/DFN Higher Efficiency DSN Thermal Efficiency SOD-323 EP 2.5 DSN2 0502 1.4 1.3 TOP VIEW 73% Smaller 0.6 TOP VIEW 0.65 SIDE VIEW 57% Thinner 0.28 SIDE VIEW Dimensions in mm. Not to scale. Package Size IF, Forward Current (A) 10 DSN2 1 0.1 SOD-323 EP 0.01 0.001 0.1 0.2 0.3 0.4 0.5 0.6 VF, Forward Voltage (V) Energy Efficiency VBAT Cin PWM Vin SW LED FB Rs Cout VBAT Cin PWM Vin SW AGnd FB Cout Vout DC-DC Boost Converter for LED Backlighting Schottky Diodes in DSN2 Package Device VF @ IF VR Rated IF (A) (V) (mV) NSR01F30NX 0.1 30 500 NSR01L30NX 0.1 30 530 NSR02F30NX 0.2 30 550 NSR02L30NX 0.2 30 580 NSR05F20NX 0.5 20 390 NSR05F30NX 0.5 30 400 NSR05F40NX 0.5 40 420 NSR10F20NX 1.0 20 430 NSR10F30NX 1.0 30 450 NSR10F40NX 1.0 40 490 NSR20F20NX 2.0 20 450 NSR20F30NX 2.0 30 480 NSR20F40NX 2.0 40 520 IR @ Rated VR (mA) 50 3 50 3 75 75 75 100 100 100 150 150 150 DSN2 Package 0201 0201 0201 0201 0402 0402 0402 0502 0502 0502 0603 0603 0603 Schottky Diodes in X3DFN-2 Package IF Device (A) NSR01L30MX 100 NSR01F30MX 100 NSR02F30MX 200 Max VF Max IR VR @ 10 mA @ 10 V (V) (mV) (mA) 30 460 0.2 30 350 5 30 290 15 Features Low Leakage Low VF Low VF DC-DC Buck Converter Schottky Diodes in SOD-923 Package Part Number VR (V) IF (mA) NSR0620P2 20 500 NSR0140P2 30 70 NSR0130P2 30 100 NSR0230P2 30 200 NSR0530P2 30 500 NSR0240P2 40 200 NSR0340P2 40 200 NSR0170P2 70 70 Features Low Leakage Low Leakage Low Leakage Low VF Low VF Low Leakage Low VF Low Leakage Schottky Diodes in SOD-523 Package VR IF Device (V) (mA) NSR0520V2 20 500 RB520S30 30 200 RB521S30 30 200 NSR0240V2 40 250 NSR0340V2 40 250 Features Low VF Low Leakage Low VF Low Leakage Low VF Schottky Diodes in Other Packages VR IF Device (V) (A) SS2003M 30 2 SS3003CH 30 3 Features Low VF Low VF Package SOT-363 SOT-457 Page 34 Portable & Wearable Solutions POWER MANAGEMENT Bipolar Transistors and Digital Transistors Bipolar Transistors ON Semiconductor offers a wide portfolio of general purpose Bipolar Transistors. Below are the most common micro-packaged BJTs. General Purpose Transistors Device 2SC5658M3 BC846BM3 2SA2029M3 BC856BM3 NST3904DP6 NST3906DP6 NST3946DP6 NST847BDP6 NST857BDP6 NST847BPDP6 NST3904F3 NST3906F3 NST847BF3 NST857BF3 Technology NPN NPN PNP PNP Dual NPN Dual PNP Comp NPN/PNP Dual NPN Dual PNP Comp NPN/PNP NPN PNP NPN PNP VCE(max) (V) 50 65 50 65 40 40 40 45 45 45 40 40 45 45 IC(max) (mA) 100 100 100 100 200 200 200 100 100 100 200 200 100 100 Package SOT-723 SOT-723 SOT-723 SOT-723 SOT-963 SOT-963 SOT-963 SOT-963 SOT-963 SOT-963 SOT-1123 SOT-1123 SOT-1123 SOT-1123 Low VCE(sat) BJTs ON semiconductor is the leader in Low VCE(sat) BJTs with a portfolio that includes devices up to 6 A. Low VCE(sat) BJTs Device VCE(sat) Hfa @ VCE IC DC 1 A, Beta 10, 5 V, 100 mA, Polarity (V) (A) Typ (mV) Typ Package NSS12100M3 PNP 12 1 280 250 SOT-723 NSS12100XV6 PNP 12 1 280 250 SOT-563 NSS12500UW3 PNP 12 5 55 250 WDFN-3 NSS12501UW3 NPN 12 5 31 300 WDFN-3 NSS12601CF8 NPN 12 6 30 300 ChipFET NSS20101J NPN 20 1 220 500 SC-89 NSS20500UW3 PNP 20 5 60 250 WDFN-3 NSS20501UW3 NPN 20 5 31 300 WDFN-3 NSS20601CF8 NPN 20 6 31 300 ChipFET NSS35200CF8 PNP 35 2 79 253 ChipFET NSS40200UW6 PNP 40 2 100 250 WDFN-6 NSS40500UW3 PNP 40 5 65 250 WDFN-3 NSS40501UW3 NPN 40 5 38 300 WDFN-3 NSS40600CF8 PNP 40 6 50 250 ChipFET NSS40601CF8 NPN 40 6 31 300 ChipFET Digital Transistors As space becomes more constrained in wireless devices, integration becomes more desirable. Incorporating bias resistors into bipolar transistors performs this integration without degrading the performance of the transistor. PIN 1 R1 BASE (INPUT) R2 PIN 3 COLLECTOR (OUTPUT) PIN 2 EMITTER (GROUND) Digital Transistors Part Body Number 113E 114E 114T 114Y 115E 115T 123E 123J 123T 124E 124X 143E 143T 143Z 144E 144T 144W R1 (W) 1K 10K 10K 10K 100K 100K 2.2K 2.2K 2.2K 22K 22K 4.7K 4.7K 4.7K 47K 47K 47K R2 (W) 1K 10K None 47K 100K None 2.2K 47K None 22K 47K 4.7K None 47K 47K None 22K Package(s) SOT-723, SOT-1123 SOT-723, SOT-963, SOT-1123 SOT-723, SOT-963, SOT-1123 SOT-723, SOT-963, SOT-1123 SOT-723 SOT-723, SOT-963, SOT-1123 SOT-723, SOT-1123 SOT-723, SOT-963, SOT-1123 SOT-723, SOT-963, SOT-1123 SOT-723, SOT-963, SOT-1123 SOT-723, SOT-1123 SOT-723, SOT-963, SOT-1123 SOT-723, SOT-1123 SOT-723, SOT-963, SOT-1123 SOT-723, SOT-963, SOT-1123 SOT-723, SOT-1123 SOT-723, SOT-963, SOT-1123 ON Semiconductor Page 35 PROTECTION External Interface USB3.1 USB3.0 USB2.0 Camera/Display Lines #Pairs ? Data Rate? Single Ended Data SDR50 SDR104 SIM Audio Speaker Headphone Microphone Other Lines General Purpose ESD Protection Charging USB Vbus Battery Contacts Low Speed Single Ended Data/Audio High Speed Differential Data Protection Solutions ESD Protection EMI Filter ESD8xxx • <0.3 pF, Lowest VC in Industry • Unidirectional and Bidirectional • Singles and Arrays EMI8xxx • >30 dB CM Attenuation • Low & High Freq Performance Class • 1, 2, 3 Pair ESD Protection EMI Filter ESD5xxx • 5 - 15 pF, Lowest VC in Industry • Unidirectional and Bidirectional • Singles and Arrays EMI71xx • >40 dB Attenuation @ Antenna Freq • <1.5 dB Attenuation @ Data Freq • Up to 6 Lines High Surge TVS Protection TVS8xxx • Ipp Up to 70 A, Lowest VC in Industry • 5 to 24 V Options • Single Line Page 36 Portable & Wearable Solutions PROTECTION USB3.1 Type-C Protection Features • Unidirectional • <8 V clamping voltage @ 16 A TLP (±8 kV SED) • ±15 kV IEC61000-4-2 Level 4 rated, contact and air discharge Device ESD8018 ESD8106 Type 8 Line Flow-Through Array 6 Line Flow-Through Array C Max @ 1 MHz (pF) 0.32 0.32 C Max @ 5 MHz (pF) 0.25 0.25 Package ESD9X ESD8018 GND TX1+ TX1– Vbus CC1 D+ D– SBU1 Vbus RX2– RX2+ GND (Config Detect: Vconn or PD comm) (Sideband Use: AUX Signal) Type-C Hybrid Top Mount Connector (Top Layer) ESD8018 SBU2 D– D+ CC2 ESD9X Top layer Bottom layer Type-C Hybrid Top Mount Connector (Bottom Layer) GND RX1+ RX2+ Vbus Vbus TX2– TX2+ GND USB3.1 Type-C Port Control Features • Current optimized for USB control Device VGDS (V) VGS(off) (V) IGSS (nA) IDSS |ysf| (mA) (mS) • Low capacitance enables high speed operation TF412S -30 -0.18 to -1.5 1 1.2 to 3.0 5.0 CISS (pF) Package 4 SOT-883 VCONN1 VCONN2 Impedance Control RA RA Control IC ON Semiconductor Page 37 PROTECTION ESD Device ESD8011 ESD5481 ESD9L ESD8451 ESD9B ESD8351 ESD8111 ESD8101 ESD5111 ESD5101 Type Bidirectional Bidirectional Unidirectional Bidirectional Bidirectional Unidirectional Bidirectional Bidirectional Bidirectional Bidirectional Single Line Protection C Vr Vc (pF) (V) (V) 0.2 5 19 15 5 19 0.9 5 17 0.3 3.3 16 15 5 15 0.55 3.3 11 0.3 3.3 10 0.3 3.3 10 5 3.3 6.5 5 3.3 6.5 Package X3DFN-2 X3DFN-2 SOD-923-2 X3DFN-2 SOD-923-2 X3DFN-2, SOD-923-2 X3DFN-2 DSN-2 X3DFN-2 DSN-2 High Surge TVS Vrwm Ipp Device (V) (A) Package TVS8501 5 70 UDFN-2 TVS8501 10 - 12 60 UDFN-2 TVS5501* 10 - 12 60 UDFN-2 * Pending 3Q15. Current (A) 18 16 8kV 14 ON Semiconductor Competitors 12 6kV 10 8 4kV 6 4 2kV 2 0 0 2 4 6 8 10 12 14 16 Voltage (V) Low Cap ESD Protection Vc Benchmarking TLP testing – P2P equivalent parts (same package, Vz, <0.6 pF) Page 38 Portable & Wearable Solutions -80 -85 -90 -95 -100 -105 -110 -115 20 -65 -75 -85 -95 -105 -115 -125 -135 20 ON Semiconductor Crosstalk, B THD+N, dB Audio Filtering for HiFi EMI7112 Features • >40 dB @ 750 MHz to 2.4 GHz • Cross-talk < –65 dB, THD+N < 0.006% • HiFi quality capable EMI7112 Ch1 1 Vrms EMI7112 Ch2 1 Vrms 200 Frequency, Hz 2000 EMI7112 THD + N 20000 SMA #7 B/A 1 Vpp SMA #8 B/A 1 Vpp SMA #9 B/A 1 Vpp SMA #10 B/A 1 Vpp SMA #11 B/A 1 Vpp SMA #12 B/A 1 Vpp 200 Frequency, Hz 2000 EMI7112 Crosstalk with 1 Vpp Input Voltage 20000 Page 39 PROTECTION PROTECTION Common Mode Filters for High Speed Interfaces Function Device Series EMI813x EMI814x Filter CM Noise Attenuation > 25 dB range RF Receivers 700 MHz – 1.1 GHz LTE, GSM, 1.3 GHz – 3 .0 GHz LTE, WCDMA, WiFi, GPS Maximum Data Rate 4 Gb/s 8 Gb/s Signal Integrity Interfaces Supported USB2.0; MHL1-2; HDMI1.3/4; MIPI CSI-2 USB3.0; MIPI CSI-3; MHL3.0; HDMI2.0 Protect Chipset Vc @ 8 kV Minimum Chipset (TLP) Geometry 11.6 V 14 nm 11.6 V 14 nm SCC21, dB Key Antenna Frequency Windows 0 -5 -10 -15 -20 -25 -30 ImproDveeedpAenstteAntnteanRueactieopnti=on -35 -40 -45 ON Semiconductor Competitors -50 100.00 Frequency, MHz EMI813x 1000.00 EMI814x Page 40 Portable & Wearable Solutions INTERFACE & MEMORY Serial EEPROMs Features • Broad density range: 1 kb to 2 Mb • Wide operating Vcc range: 1.8/1.7 V to 5.5 V • High endurance: 1 million program/erase cycles • Wide temperature range: industrial and extended EasyPRO™ is a user-friendly, portable programming tool for ON Semiconductor serial EEPROMs (I2C, SPI, Microwire) EEPROMs Data Transmission Standard Device I2C SPI Microwire CAT24M01 CAT24C512 CAT24C256 CAT24C128 CAT24C64 LE2464CXA CAT24C32 CAT24C16 LE24162LBXA LE24163LBXA LE2416RLBXA CAT24C08 CAT24C04 LE24L042CS-B CAT24C02 CAT25M02 CAT25M01 CAT25512 CAT25256 CAT25128 CAT25640 CAT25320 CAT25160 CAT25080 CAT25040 CAT25020 CAT25010 CAT93C86 CAT93C86B CAT93C76 CAT93C76B CAT93C66 CAT93C56 CAT93C46 CAT93C46B CAT93C46B * Organization for Microwire devices is selectable. Density 1 Mb 512 kb 256 kb 128 kb 64 kb 64 kb 32 kb 16 kb 16 kb 16 kb 16 kb 8 kb 4 kb 4 kb 2 kb 2 Mb 1 Mb 512 kb 256 kb 128 kb 64 kb 32 kb 16 kb 8 kb 4 kb 2 kb 1 kb 16 kb 16 kb 8 kb 8 kb 4 kb 2 kb 1 kb 1 kb 1 kb Organization* 128k x 8 64k x 8 32k x 8 16k x 8 8k x 8 8k x 8 4k x 8 2k x 8 2k x 8 2k x 8 2k x 8 1k x 8 512 x 8 512 x 8 256 x 8 256k x 8 128k x 8 64k x 8 32k x 8 16k x 8 8k x 8 4k x 8 2k x 8 1k x 8 512 x 8 256 x 8 128 x 8 2k x 8 & 1k x 16 2k x 8 & 1k x 16 1k x 8 & 512 x 16 1k x 8 & 512 x 16 512 x 8 & 256 x 16 256 x 8 & 128 x 16 128 x 8 & 64 x 16 128 x 8 & 64 x 16 128 x 8 / 64 x 16 VCC Min (V) 1.8 1.8 1.8 1.8 1.7 1.7 1.7 1.7 1.7 1.7 1.7 1.7 1.7 1.7 1.7 1.7 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 / 1.65 1.8 1.8 / 1.65 1.8 1.8 1.8 1.8 / 1.65 1.8 / 1.65 VCC Max (V) 5.5 5.5 5.5 5.5 5.5 3.6 5.5 5.5 3.6 3.6 3.6 5.5 5.5 3.6 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 fCLK Max (MHz) 1 1 1 1 1 0.4 1 0.4 0.4 0.4 0.4 0.4 0.4 0.4 0.4 10 10 20 20 20 20 20 20 20 20 20 20 3 4 3 4 2 2 2 4 4 Package(s) SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8, UDFN-8, WLCSP-4 WLCSP-6 SOIC-8, TSSOP-8, UDFN-8, WLCSP-4, WLCSP-5 SOIC-8, TSSOP-8, UDFN-8, TSOT23-5, WLCSP-4, WLCSP-5 WLCSP-6 WLCSP-5 WLCSP-6 SOIC-8, TSSOP-8, UDFN-8, TSOT23-5, WLCSP-4, WLCSP-5 SOIC-8, TSSOP-8, UDFN-8, TSOT23-5, WLCSP-4, WLCSP-5 WLCSP-4 SOIC-8, TSSOP-8, UDFN-8, TSOT23-5, WLCSP-4, WLCSP-5 SOIC-8 SOIC-8, TSSOP-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8 SOIC-8, TSSOP-8 SOIC-8, TSSOP-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8, UDFN-8 ON Semiconductor Page 41 EMI Reduction with Spread Spectrum Clocks Spread spectrum frequency modulator clock generators reduce electromagnetic interference (EMI) at the clock source, allowing system wide EMI reduction on all clock dependent signals. Fundamental 3rd Harmonic 5th Harmonic 7th Harmonic 9th Harmonic 11th Harmonic Frequency (MHz) 46.9 143.9 238.5 333.1 434.9 524.7 Without Spread Spectrum (dB) -28 -31.1 40 -50.7 -43.7 -41.8 With Spread Spectrum (dB) -28.4 -36.9 -47.1 -57.6 -50.9 -49 Reduction (dB) 0.4 5.8 7.1 6.9 7.2 7.2 Device P3MS650100H P3MS650103H P3PS550AH P3PSL450AH PCS3PS550A VDD Typ (V) 1.8; 2.5; 3.3 1.8; 2.5; 3.3 2.3-3.6 1.8 2.3-3.6 fin Typ (MHz) 15-30; 15-60 15-30; 15-60 18-36 15-60 18-36 fout Typ (MHz) 15-30; 15-60 15-30; 15-60 18-36 15-60 18-36 Deviation Type ±1.4% @ 24 MHz ±0.45% @ 24 MHz ±0.4 to ±2.5 Analog ±0.4 to ±2.5 Features Power Down Power Down High Drive, PDB PDB PDB Package(s) WDFN-4 WDFN-4 WDFN-8 WDFN-8 WDFN-8 INTERFACE & MEMORY 4-PLL Audio/Video Clock Generator with Spread Spectrum Clock Key Features – P1P40167 • Eliminates multiple crystals by using one device to generate multiple clocks • Integrated loop filter 27 MHz Clock • Input: 27 MHz crystal or external input or Crystal Input • Outputs: Optional Tuning Capacitors • 27 MHz reference output SCLK • Fixed output frequency of 48 MHz and 22.5792 MHz • Configurable spread spectrum 37 MHz output • Selectable audio clock frequency of 22.5792 MHz or 24.576 MHz SDATA • LVCMOS input and outputs • Serial interface to control output enable/disable, SS selection and PLL frequency selection • 1.8 V supply voltage VDO VDDO 3 2 Crystal Oscillator I2C Control Logic PLL1 (Spread) PLL2 PLL3 PLL4 2 VSS P1P40167 Block Diagram 27M 37M 48M 22/24M 22M Page 42 Portable & Wearable Solutions LVDS Differential Buffer Q1 Key Features – NB3L14S VCC Q1 • 1:4 LVDS clock buffer Q2 • 2.5 V operating voltage • Integrated input termination resistors IN VT IN 50− 50− Q2 • Maximum input clock frequency > 300 MHz Q3 • Low output-to-skew < 20 ps VCC Q3 • 450 ps typical propagation delay • 250 ps typical rise/fall times Q4 • QFN-16 package Q4 NB3L14S Functional Diagram 2:2 Buffer/Voltage Translator for Universal Flash Storage (UFS) Key Features – NB3U23C • Translates 1.8 V CMOS input to 1.2 V CMOS output • Frequency >52 MHz maximum • Propagation delay <5 ns maximum • Output rise/fall times <2 ns • ESD Specifications exceed JESD22 • 2000 V Human-Body Model (A114-A) Operation • 200 V Machine Model (A115-A) • 1000 V Charged-Device Model (C101) • Noise floor density -145 dBc/Hz maximum • Phase noise -66 dBc(Hz) maximum, integrated from 50 kHz – 10 MHz • Supply voltage 1.2 V ±5% • Standby current <15 µA • SC-70-6, UDFN-6 UFS Host Application Driver UFS Host Controller UFS Host Reg 1.2 V RESET_n 0 - 1.8 V REF CLK 0 - 1.8 V UIC NB3U23C DOUT_t DOUT_c UFS Device 0 - 1.2 V 0 - 1.2 V MIPI M-PHYSM MIPI UniProSM DIN_t DIN_c INTERFACE & MEMORY ON Semiconductor Page 43 Logic and Digital Interfaces • MiniGates™ and Standard Logic - condition logic signals • Bus Switches and Analog Switches - low-cost signal routing and multiplexing • Voltage Translators - interface sub-systems with different operating voltages • I2C Interface – increase # of I/O ports, level shifting, repeaters • Custom Logic Solutions - create “valued-added interface” Peripheral 1 Peripheral 2 Translation Translator Peripheral 3 Module #1 I/O I2C Expander μC #1 On-board translations • SPI • I2C Translator • SMBus I/O Expanders • Increase No of I/O Ports MiniGates • Buffering • Control Logic Memory Control Analog/Bus Switches • Signal Routing • Audio Routing Mem# 2 Mem# 1 MiniGate™ Family HC (High Speed CMOS) VHC (Very High Speed CMOS) LCX (Low-Voltage CMOS, Xtra Drive) VCX (Very High Speed CMOS, Xtra Drive) SG (Super Low Voltage Gate) Operating Voltage (V) 2.0 – 6.0 2.0 – 5.5 1.65 – 5.5 0.9 – 3.6 0.9 – 3.6 Drive Current (mA) 5.2 @ 5 V 8@5V Propagation Delay (ns) 7 4.5 SC-88 MC74HC1GxxDF MC74VHC1GxxDF TSOP-5 MC74HC1GxxDT MC74VHC1GxxDT SOT-553 UDFN SOT-9 NLU1GxxCMU NL17SHxxP5 24 @ 5 V 2.9 NL17SZxxDF NL17SZxxXV5 NLX1GxxCMU NL17SZxxP5 24 @ 3.6 V 1.5 NL17SVxxX5 8 @ 3.3 V 2.5 NL17SGxxDF NL17SGxxMU NL17SGxxP5 INTERFACE & MEMORY Page 44 Portable & Wearable Solutions Logic Translators Dual supply voltage logic translators connect ICs and PCBs together that operate at different supply voltages. Key Features • Industry’s first devices with independent power supplies (VL < VCC, VL = VCC, or VL > VCC) • High 100 pF capacitive drive capability • Overvoltage tolerant enable and I/O pins • Non-preferential power-up sequencing • Power-off protection PCB #1 Translator PCB #2 Translator μC #1 On-board translations • SPI • I2C • SMBus Translator PCB-to-PCB Translation μC #2 EEPROM Unidirectional Translator Autosense Bidirectional Translator (Push-Pull Output) Autosense Bidirectional Translator (Open-Drain Output) Bidirectional Translator (with Direction Pin) VCCA Block Diagram A OE VL VCCB B I/O VL P One−Shot R1 1k N One−Shot P One−Shot R2 1k N One−Shot VCC VL VCC I/O VCC PU1 RPullup 10 k EN I/O VL One−Shot Block Gate Bias One−Shot Block N PU2 RPullup 10 k EN I/O VCC V??? DIR V??? A ? Product Preview Attributes • High Data Rate • Low Power Consumption Trade-Offs Applications • Fixed Input & Output Pins • SPI • GPIO Sample Device (I/O Channels, Package) • NLSV1T34 (1-Bit, ULLGA-6) • NLSV1T240/244 (1-Bit, UDFN-6) • NLSV2T240/244 (2-Bit, UDFN-8) • NLSV4T240/244 (4-Bit, UDFN-12) • NLSV4T3234 (4-Bit, CSP-11) • NLSV8T240/244 (8-Bit, UDFN-20) • High Data Rate • Low Power Consumption • Modest Output Current • SPI • GPIO • NLSX3012 (2-Bit, UDFN-8) • NLSX3014 (4-Bit, UQFN-12) • NLSX3013 (8-Bit, CSP-20) • NLSX3018 (8-Bit, UDFN-20) • NLSX4014 (4-Bit, UQFN-12) • NLSX5011 (1-Bit, UULGA-6, UDFN-6) • NLSX5012 (2-Bit, UDFN-8) • NLSX5014 (4-Bit, UDFN-12) • High Data Rate • Low Power Consumption • Flexible PCB Design • Modest Bandwidth • I2C, SMBus, PMBus • GPIO • SDIO Cards • 1-Wire Bus • NLSX3373 (2-Bit, UDFN-8) • NLSX3378 (4-Bit, CSP-12) • NLSX4373 (2-Bit, UDFN-8) • NLSX4378 (4-Bit, CSP-12) • High Data Rate • Low Power Consumption • Flexible PCB Design • Directional Control Pin Required • GPIO • NLSV1T45 (1-Bit, ULLGA-6) • NLSV2T245 (2-Bit, UQFN-10) • NLSV2T3236 (2-Bit, UQFN-10) • NLA16T245 (16-Bit, TSSOP-48) INTERFACE & MEMORY ON Semiconductor Page 45 Features • I2C and SMBus interfaces • 1 MHz SCL clock frequency • 30 mA SDA sink capability Cascadable I/O Expanders SCL SDA μC GPIO Vext LEDs Keypad Control Button LED Backplane 3.3 V Systems 12 V Slot 2 Slot 3 SCL I/O 3.3 V SDA I/O I/O AUXEN Hot-Plug Controller 12 V INT I/O PWRFLT MOSFETs PCA96xxE 3.3 V PCA95xxE I/O Expander I/O AUXEN Hot-Plug Controller 12 V I/O I/O PWRFLT I/O I/O I/O I/O PRSNT2 PRSNT2 I/O I/O I/O I/O ADM1033 Thermal Sensor and Fan Controller Temperature Control Device PCA9535E PCA9655E PCA9654E I/O Cascadable VCC Min (V) 16 64 Programmable Slave Addresses 1.65 16 64 Programmable Slave Addresses 1.65 8 8 Slave ID Addresses 1.65 VCC Max (V) 5.5 5.5 5.5 Interrupt Output 4 4 4 I/O LED Blink/ Pullups PWM 4 Package QFN-24, SOIC-24, TSSOP-24 QFN-24, SOIC-24, TSSOP-24 SOIC-16, WQFN-16, TSSOP-16 INTERFACE & MEMORY Page 46 Portable & Wearable Solutions Analog Switches Device Data Type VCC Min VCC Max RON Max IIkg Max C Configuration (V) (V) (W) (mA) (pF) NLAS7213 USB 2.0/UART DPST 1.65 4.5 10 1 5 NLAS4717 USB 1.1/UART Dual SPDT 1.8 5.5 4.5 1 110 NLAS4717EP USB 1.1/UART Dual SPDT 1.8 5.5 4.5 1 38 NLAS7222A USB 2.0/UART DPDT 3 3.6 9 1 7 NLAS7222B USB 2.0/UART DPDT 1.65 4.5 8 1 8 NLAS7222C USB 2.0/UART DPDT 1.65 4.5 8 1 10 NLAS7242 USB 2.0/UART DPDT 1.65 4.5 7.5 1 7.5 NCN9252 USB 2.0/UART DP3T 1.65 4.5 6 1 16 NLAS3899B SIM card Dual DPDT 1.65 4.3 4 1 20 NS5S1153 USB 2.0/UART/Negative Audio DPDT -0.5 5 4.6 35 7 NCN1154 USB 2.0/UART/Negative Audio DP3T -0.5 6 3 50 9 NCN1188 USB 2.0/MHL 1.1/Negative Audio DP3T -0.5 6 - - - BW (MHz) 1100 40 90 500 500 500 900 525 280 900 850 - Package(s) UQFN-8 Flip-Chip-10, Micro-10 WQFN-10, Flip-Chip-10 WQFN-10 UQFN-10 UQFN-10 UQFN-10 UQFN-12 WQFN-16, QFN-16 UQFN-10 UQFN-12 UQFN-12 INTERFACE & MEMORY Small Signal MOSFETs Device NTNS3193NZ NTNS3A91PZ NTNS3164NZ NTNS3A65PZ NTNUS3171PZ NTK3139P NTK3134N NTK3043N NTZS3151P NTUD3170NZ NTZD3152P NTZD3154N NTZD5110N NTUD3169CZ NTZD3155C Polarity Single Single Single Single Single Single Single Single Single Dual Dual Dual Dual Complementary Complementary Configuration N-Channel P-Channel N-Channel P-Channel P-Channel P-Channel N-Channel N-Channel P-Channel N-Channel P-Channel N-Channel N-Channel N-Channel P-Channel N-Channel P-Channel V(BR)DSS Min (V) 20 -20 20 -20 -20 -20 20 20 -20 20 -20 20 60 -20 20 20 -20 VGS Max (V) ±8 ±8 ±8 ±8 ±8 ±6 ±6 ±10 ±8 ±8 ±6 ±6 ±20 ±8 ±8 ±6 ±6 ID Max (A) 0.23 0.21 0.22 0.23 0.15 0.78 0.89 0.26 0.9 0.22 0.4 0.5 0.3 0.22 0.25 0.54 0.43 RDS(ON) Max @ VGS = 4.5 V (W) 1.4 1.6 0.7 1.3 3.5 0.48 0.35 3.4 0.142 1.5 0.9 0.55 2.5 1.5 5 0.55 0.9 RDS(ON) Max @ VGS = 2.5 V (W) 1.9 2.4 1 2 4 0.67 0.45 4.5 0.2 2 1.2 0.7 2 6 0.7 1.2 RDS(ON) Max @ VGS = 1.8 V (W) 2.2 3.3 2 3.4 5.5 0.95 0.65 10 0.24 3 2 0.9 3 7 0.9 2 Package(s) XLLGA-3 XLLGA-3 SOT-883 SOT-883 SOT-1123 SOT-723 SOT-723 SOT-723 SOT-563 SOT-963 SOT-563 SOT-563 SOT-563 SOT-963 SOT-563 ON Semiconductor Page 47 Sales and Design Assistance from ON Semiconductor ON Semiconductor Technical Support www.onsemi.com/support ON SEMICONDUCTOR INTERNATIONAL SALES OFFICES GREATER CHINA Beijing 86-10-8577-8200 Hong Kong 852-2689-0088 Shenzhen 86-755-8209-1128 Shanghai 86-21-5131-7168 Taipei, Taiwan 886-2-2377-9911 FRANCE Paris 33 (0)1 39-26-41-00 GERMANY Munich 49 (0) 89-93-0808-0 INDIA Bangalore 91-98-808-86706 ISRAEL Raanana 972 (0) 9-9609-111 ITALY Milan 39 02 9239311 JAPAN Tokyo 81-3-5817-1050 KOREA Seoul 82-31-786-3700 MALAYSIA Penang 60-4-6463877 SINGAPORE Singapore 65-6484-8603 SLOVAKIA Piestany 421 33 790 2450 UNITED KINGDOM Windsor 44 1753 62 6718 ON Semiconductor Distribution Partners Allied Electronics www.alliedelec.com Altima Corp. www.altima.co.jp Arrow Electronics www.arrow.com Avnet www.em.avnet.com Chip One Stop, Inc. www.chip1stop.com/maker/on Daiwa Distribution Ltd. www.daiwahk.com Digi-Key www.digikey.com EBV Elektronik www.ebv.com/en/locations.html Future & FAI Electronics www.futureelectronics.com/contact Mouser Electronics www.mouser.com Newark/Farnell www.farnell.com/onsemi OS Electronics Co., Ltd. www.oselec.jp Promate Electronic Co. 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