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    MFRD52x Mifare® Contactless Smart Card Reader Reference Design Rev. 2.1 — 17. April 2007 Preliminary Data Sheet Document information Info Content Keywords MFRC522, MFRC523, MFRC52x, MFRD522, MFRD523, MFRD52x Mifare Contactless Smart Card Reader Reference Design, Mifare Reader IC Abstract NXP Semiconductors MFRD52x Mifare® Contactless Smart Card Reader Reference Design Revision history Rev Date 2.1 2007-04-17 2.0 2005-12-13 1.0 2005-11-09 Description modifications to PCB Add MFRD523 designs new NXP layout Changed Status to Preliminary Specification Initial Draft Contact information For additional information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com 119321 Preliminary Data Sheet Rev. 2.1 — 17. April 2007 © NXP B.V. 2007. All rights reserved. 2 of 34 NXP Semiconductors MFRD52x Mifare® Contactless Smart Card Reader Reference Design 1. Introduction 1.1 Scope This document describes the functionality of the reference reader PCB based on the MFRC52x. It includes the functional and electrical specifications and gives the needed details to use this reader as a reference design. This reference reader implementation is based on the HVQFN32 package of the MFRC52x device. The MFRC52x it self is described in the corresponding data sheet: • “Product Data Sheet - MFRC522 Contactless Reader IC”. • “Product Data Sheet - MFRC523 Contactless Reader IC”. Antenna design and tuning is described in following application notes: • “Application Note - Micore Reader IC family Directly Matched Antenna Design” • “Application Note - 13.56 MHz RFID Proximity Antennas” 1.2 Features • Single 5 V up to 12 V unregulated external power supply • RS232 DSUB9 connector for easy connection to a host PC • Regulated voltage supply for all supply voltages • Variable Supply Voltage − TVDD = AVDD = DVDD: adjustable, 3.3V or 2.8 V − PVDD: adjustable, 1.8V or equal to DVDD − SVDD: adjustable, 1.8V, 2.8V or 3.3V • NRESET, IRQ signals externally accessible • Support of S2C interface • Analog test signal pins AUX1 and AUX2 • Digital test signal pins D6, D5, D4, D3, D2 and D1 depending on the interface • Breakable line between serial RS232 and MFRC52x section • Breakable line between serial MFRC52x and antenna matching section • Breakable line between antenna matching and antenna section • MFRC52x reader section can be connected via: − Serial UART − I2C − SPI • Antenna size: 33.5 mm x 51.0 mm 119321 Preliminary Data Sheet Rev. 2.1 — 17. April 2007 © NXP B.V. 2007. All rights reserved. 3 of 34 NXP Semiconductors MFRD52x Mifare® Contactless Smart Card Reader Reference Design 2. Functional Description The MFRD52x reference reader PCB is a complete Mifare® reader reference design based on the MFRC52x. The reader PCB itself is divided in 4 parts: Table 1. PCB sections Measure Interface section Reader section Antenna matching section Antenna section Reason Enables the direct connection to an RS 232 interface via a DSUB9 socket connector. MFRD52x reader module. This module is the basic PCB including the MFRC52x Reader IC and all required components for a Mifare® reader plus the filter circuitry. Matching circuit for single ended or complementary driver operation Antenna coil PCB including the resistor RQ for quality factor adjustment. Three areas to break the PCB are foreseen for easy adaptation of the reference reader PCB: • Between the interface section and MFRC52x section • Between the MFRC52x section and the antenna matching section • Between the antenna matching section and the antenna section The default configuration uses pins and jumpers to connect the PCB sections. It is also possible to use 0 Ohm resistors instead of the pin and jumper connection. The MFRD52x reference reader PCB offers the possibility to be directly connected to microcontroller with serial UART, SPI or I2C interface. Note: In case of a direct connection to a microcontroller, the input and output voltage levels must be observed. For a detailed view of all different layers of the MFRD52x reference reader PCB, refer to Section “Schematic & Layout”. 3. PCB Marking Depending on the reader IC version and some external modifications, the PCB is labeled on the reader and antenna section 119321 Preliminary Data Sheet Rev. 2.1 — 17. April 2007 © NXP B.V. 2007. All rights reserved. 4 of 34 NXP Semiconductors Table 2. Laser Marking Label MFRD52x Mifare® Contactless Smart Card Reader Reference Design Description MFRC522 reference reader design MFRC523 reference reader design Assembly option for MFRC523 reference reader for Mifare® SAM add-on board usage 4. Schematic Description 4.1 Schematic Overview The following parts describe the MFRD52x reference reader PCB schematic, the part list and the layout of the PCB completely in order to give the user the possibility to take the evaluation reader as a reference design for an own Mifare® integration. 119321 Preliminary Data Sheet Rev. 2.1 — 17. April 2007 © NXP B.V. 2007. All rights reserved. 5 of 34 NXP Semiconductors Table 3. Schematic Overview MFRD52x Mifare® Contactless Smart Card Reader Reference Design 119321 Preliminary Data Sheet Rev. 2.1 — 17. April 2007 © NXP B.V. 2007. All rights reserved. 6 of 34 NXP Semiconductors MFRD52x Mifare® Contactless Smart Card Reader Reference Design Note: The Antenna part and the antenna matching section shows the basic schematics only. The actual values used circuit and the relevant parts are described in following chapters. 4.2 Interface Section 4.2.1 Power Supply Table 4. Power Supply The power supply can be connected with a 2.5 mm dc plug. According default configuration the resistors R04, R05 and R06 are not assembled. With these resistors the PCB can be adjusted to customer needs. The polarity of the plug is managed automatically on the PCB. The supplied voltage should be in a range of 5.0V up to 12.0V and can be unregulated. The power supply should be able to provide at least 200 mA. The main supply voltage on the interface section is 3.3 V regulated. After plugging in the voltage supply, the LED on the PCB should light up. In the special case of using Mifare® SAM add-on board and PC/SC smart card reader connection, the power is provided by this external supply. The supply from the PC/SC reader is only used to generate a cold reset. Please refer to Document “xxx” . 119321 Preliminary Data Sheet Rev. 2.1 — 17. April 2007 © NXP B.V. 2007. All rights reserved. 7 of 34 NXP Semiconductors 4.2.2 Host Interface Table 5. DSUB-9 Connector Pinning MFRD52x Mifare® Contactless Smart Card Reader Reference Design The DSUB-9 socket is used on one side for a standard RS232 connection to the PC or other host controller and on the other side for as a connection to a PC/SC smart card reader if Mifare® SAM add-on board is used. Therefore each pin has several use cases depending on the application. Table 6. DSUB-9 Pinning Assignment RS232 (DCE) Pin Signal D 1 DCD (Data Carrier Detect) O 2 RD (Receive Data) O 3 TD (Transmit Data) I 4 DTR (Data Terminal Ready) I 5 GND Pwr 6 DSR (Data Set Ready) O 7 RTS (Ready To Send) I 8 CTS (Clear To Send) O 9 RI (IRQ) O Voltage [V] ± 3 - 12 ± 3 - 12 ± 3 - 12 ± 3 - 12 ± 3 - 12 ± 3 - 12 ± 3 - 12 ± 3 - 12 PC/SC Smart Card Interface Signal D Voltage [V] IO3/DM (ISO IO3, USB D-) IO 0-5 - VCC (ISO VCC) Pwr 0 - 5 RST (ISO RST) I 0-5 GND Pwr IO1 (ISO IO1) IO 0-5 IO2/DP (ISO IO2, USB D+) IO 0-5 CLK (ISO CLK) I 0-5 - 4.2.3 Connection Schemes In RS232 configuration, the DSUB-9 socket is used to connect demo board to standard PC or other host controller. 119321 Preliminary Data Sheet Rev. 2.1 — 17. April 2007 © NXP B.V. 2007. All rights reserved. 8 of 34 NXP Semiconductors MFRD52x Mifare® Contactless Smart Card Reader Reference Design In PC/SC smart card interface configuration, the DSUB-9 socket is used to connect to PC/SC smart card reader. This configuration will only function if Mifare® SAM add-on board is used. Different usage will result in mal-function but will not harm the devices or reader PCB: PC connection in PC/SC Smart Card Interface configuration The PC expects voltage levels of ± 5 to 12 V, whereas the output voltage levels are 0 to 2.8V and the expected Input voltage levels are in a range of 0 to 5 V. The output voltage levels should not harm the PC interface. On the other side the higher PC voltage levels would influence the VCC pin. Since this voltage level is only used to switch the onboard voltage regulator - the influence is not critical. The other critical Pin RST is protected by a diode and will not damage the reader board. Signal RTS is not connected in this configuration and as therefore no influence. PC/SC Smart Card reader connection in RS232 Interface configuration The expected voltage levels on PC/SC smart card reader are 0 to 5 V. whereas the output voltage levels are ± 5 to 12 V. The input voltage levels will not harm the reader PCB. Output signals are only available on pin RD / RI, but in this case there is no signal connection to the PC/SC smart card reader device. There is no harm expected. 4.2.4 RS232 Transceiver IC Table 7. RS232 Transceiver IC 119321 Preliminary Data Sheet Rev. 2.1 — 17. April 2007 © NXP B.V. 2007. All rights reserved. 9 of 34 NXP Semiconductors MFRD52x Mifare® Contactless Smart Card Reader Reference Design Capacitor C09 and C07 are assembled, dependent on the type of IC3. 4.2.5 Configuration Settings RS232 vs. PC/SC Smart Card Reader interface Table 8. Configuration Setting Device RS232 JP1 Solder bridge between 1 – 2 JP2 Solder bridge between 2 – 3 R02 Optional - Not assembled R03 Not assembled SJ1 Closed SJ2 Closed SJ3 Open SJ4 Closed SJ5 Closed SJ6 Closed SJ7 Closed SJ8 Closed SJ9 Closed SJ10 Closed PC/SC Open Open Not assembled 100R Open Open Open Open Open Open Open Open Open Open JP … Solder Jumper R … Resistor – value given SJ … Solder Jumper 119321 Preliminary Data Sheet Rev. 2.1 — 17. April 2007 © NXP B.V. 2007. All rights reserved. 10 of 34 NXP Semiconductors Table 9. Jumper Settings MFRD52x Mifare® Contactless Smart Card Reader Reference Design 4.2.6 Connector to reader section This connector can be assembled either with pin heads, sockets or simple solder bridges. The wire holes are on a 2.54 mm grid. Between these wire holes there is a milling line. If you remove the solder bridges, you can easily break the PCB along the milling line. In this case you can operate the reader section with a microcontroller with various interfaces. Table 10. Connector to Reader Section Table 11. Connector to reader section pin description Interface Section Description Pin UART HC00 1 IRQ Reader Section Description I2C SPI IRQ IRQ 119321 Preliminary Data Sheet Rev. 2.1 — 17. April 2007 PC/SC - © NXP B.V. 2007. All rights reserved. 11 of 34 NXP Semiconductors MFRD52x Mifare® Contactless Smart Card Reader Reference Design Interface Section Description Pin HC01 3 HC02 5 GND_IO 7 HC04 9 HC05 11 HC06 13 TD 15 VDD_IO 17 UART RXD TXD GND D6 D5 NReset VDD_PP VDD_J Reader Section Description I2C SPI SDA NSS SCL MISO GND GND D6 MOSI D5 SCK NReset NReset VDD_PP VDD_PP VDD_J VDD_J PC/SC IO1 CLK GND IO2 / DP IO3 / DM RST VCC VDD_J Please note to supply valid voltage range of VDD_J (main power supply for the reader section) and VDD_PP (pad power supply for the reader IC). The voltage levels for pins 2, 4, 6, 10, 12, and 14 are related to the selected VDD_P (Pad VDD). On pin 16 an additional pad VDD for the MFRC52x IC can be provided. An input voltage on this pin is not mandatory, if another pad voltage is selected. In this case the pin can be left open. 119321 Preliminary Data Sheet Rev. 2.1 — 17. April 2007 © NXP B.V. 2007. All rights reserved. 12 of 34 NXP Semiconductors MFRD52x Mifare® Contactless Smart Card Reader Reference Design 4.2.7 Parameter Selection on PCB Table 12. Parameter Selection Top Layer Table 13. Parameter Selection Placement Top Layer 119321 Preliminary Data Sheet Rev. 2.1 — 17. April 2007 © NXP B.V. 2007. All rights reserved. 13 of 34 NXP Semiconductors MFRD52x Mifare® Contactless Smart Card Reader Reference Design Table 14. Parameter Selection Bottom Layer Table 15. Parameter Selection Placement Bottom Layer 119321 Preliminary Data Sheet Rev. 2.1 — 17. April 2007 © NXP B.V. 2007. All rights reserved. 14 of 34 NXP Semiconductors MFRD52x Mifare® Contactless Smart Card Reader Reference Design 4.3 Reader Section 4.3.1 Interface Selection Table 16. Interface Selection The interface selection of the reader section is made by two solder jumpers. Low means GND potential at the input pin and HIGH means PVDD at the input pin. The factory default value is indicated by a “*”. Table 17. Interface Options Pin A0 A1 UART* (default) LOW LOW SPI HIGH LOW I2C LOW HIGH 4.3.2 I²C Slave Address Configuration Table 18. Slave Address Configuration 119321 Preliminary Data Sheet Rev. 2.1 — 17. April 2007 © NXP B.V. 2007. All rights reserved. 15 of 34 NXP Semiconductors MFRD52x Mifare® Contactless Smart Card Reader Reference Design In order to use the I²C bus, the bus slave address has to be selected. The slave address consists of 7 bits, where 4 bits (slave address bit 6, 5, 4, 3) are fixed to 0101. The remaining 3 bits (slave address bit 2, 1, 0) can be selected externally. Please pay attention, by default these jumpers are not configured at all. Table 19. I²C slave address selection Slave Address D4 (S2) 0101 XXX (default) NC 0101 000 LOW 0101 001 LOW 0101 010 LOW 0101 011 LOW 0101 100 HIGH 0101 101 HIGH 0101 110 HIGH 0101 111 HIGH D5 (S1) NC LOW LOW HIGH HIGH LOW LOW HIGH HIGH D6 (S0) NC LOW HIGH LOW HIGH LOW HIGH LOW HIGH 119321 Preliminary Data Sheet Rev. 2.1 — 17. April 2007 © NXP B.V. 2007. All rights reserved. 16 of 34 NXP Semiconductors MFRD52x Mifare® Contactless Smart Card Reader Reference Design 4.3.3 Supply Voltage Generation Table 20. Generation of 2.8V and 1.8V supply voltages The main section supply (VDD_J) is used to generate two additional supply voltages, which can be selected for various purposes. If you are using these voltage regulators, the supply range of VDD_J should be between 3.0 V and 6.0 V. If the voltage on VDD_J is directly used to supply the reader IC, the supplied voltage on the VDD_J interface pin should be in a range of 2.5 V to 3.6 V. As default option VEN should be connected directly to VDD_J by means of solder jumper SJ10. VEN is controlled differently in combination with Mifare® SAM add-on board. 119321 Preliminary Data Sheet Rev. 2.1 — 17. April 2007 © NXP B.V. 2007. All rights reserved. 17 of 34 NXP Semiconductors MFRD52x Mifare® Contactless Smart Card Reader Reference Design 4.3.4 Voltage selection Table 21. Voltage selection JP7 The supply VDD for driver, analog and digital part can be selected between the direct pin voltage VDD_J and the output of the onboard voltage regulator of 2.8 V. The serial resistors in power supply line can be used for current measurement. By default zero ohm resistors are used. Table 22. Reader IC supply voltages TVDD, AVDD, DVDD XVDD On board voltage (default) 2V8 External voltage VDD_J 4.3.5 Pad Supply Voltage selection Table 23. Voltage selection The pad supply voltage has to be selected according the interface voltage of the external microcontroller or level shifters. 119321 Preliminary Data Sheet Rev. 2.1 — 17. April 2007 © NXP B.V. 2007. All rights reserved. 18 of 34 NXP Semiconductors MFRD52x Mifare® Contactless Smart Card Reader Reference Design Table 24. Pad supply voltage selection JP13 Pad VDD Reader supply voltage XVDD (default) PVDD XVDD External voltage VDD_PP On board voltage 1V8 4.3.6 SVDD voltage selection Table 25. SVDD voltage selection The SVDD supply voltage depends on the selected supply voltage for the external controller. Even if no external MFIN/MFOUT (SIGIN/SIGOUT) is used, this voltage should be selected. Table 26. SVDD supply voltage selection JP15 MFIN/MFOUT VDD External voltage On board voltage (default) On board voltage SVDD VDD_J 2V8 1V8 switched pin voltage VDD_P 4.3.7 Switched Supply Voltage Table 27. Switched supply voltage JP14 For low power applications the output ports of the reader IC can be used as supply pins. Each pin is able to provide up to 4 mA. Please encounter the resulting voltage drop at the pins. For applications, where only a small voltage drop compared to PVDD is acceptable, 119321 Preliminary Data Sheet Rev. 2.1 — 17. April 2007 © NXP B.V. 2007. All rights reserved. 19 of 34 NXP Semiconductors MFRD52x Mifare® Contactless Smart Card Reader Reference Design more than one pin can be used in parallel. As a consequence these pins are no longer available as debug pins. The selection can be made by means of jumper JP14. According to the default configuration, this jumper is not assembled, that means, this option is also not valid during SVDD selection. 4.3.8 Test Signal Output Table 28. Test Signal Output JP16, JP6 In order to qualify the performance of the reader and detect a potential weakness, several test signals are available. For digital test signals the digital test bus is available on the separate debug connector. Two analog test signals are available on solder pads at the bottom side of the PCB. For measurements directly on the RX pin a separate solder pad is available. Please pay attention that measurements at the RX pad should be preferred done with a differential probe. 119321 Preliminary Data Sheet Rev. 2.1 — 17. April 2007 © NXP B.V. 2007. All rights reserved. 20 of 34 NXP Semiconductors MFRD52x Mifare® Contactless Smart Card Reader Reference Design 4.3.9 Extension Board Connector Table 29. Extension Connector X2D Depending on the application, a more powerful extension connector is necessary. 119321 Preliminary Data Sheet Rev. 2.1 — 17. April 2007 © NXP B.V. 2007. All rights reserved. 21 of 34 NXP Semiconductors MFRD52x Mifare® Contactless Smart Card Reader Reference Design 4.3.10 Parameter Selection on PCB Table 30. Parameter Selection Top Layer 119321 Preliminary Data Sheet Rev. 2.1 — 17. April 2007 © NXP B.V. 2007. All rights reserved. 22 of 34 NXP Semiconductors MFRD52x Mifare® Contactless Smart Card Reader Reference Design Table 31. Parameter Selection Placement Top Layer 119321 Preliminary Data Sheet Rev. 2.1 — 17. April 2007 © NXP B.V. 2007. All rights reserved. 23 of 34 NXP Semiconductors MFRD52x Mifare® Contactless Smart Card Reader Reference Design Table 32. Parameter Selection Bottom Layer 119321 Preliminary Data Sheet Rev. 2.1 — 17. April 2007 © NXP B.V. 2007. All rights reserved. 24 of 34 NXP Semiconductors MFRD52x Mifare® Contactless Smart Card Reader Reference Design Table 33. Parameter Selection Placement Bottom Layer 119321 Preliminary Data Sheet Rev. 2.1 — 17. April 2007 © NXP B.V. 2007. All rights reserved. 25 of 34 NXP Semiconductors MFRD52x Mifare® Contactless Smart Card Reader Reference Design 4.4 Antenna Matching Section Table 34. Antenna matching and antenna section The connector between the reader section and the antenna matching section as well as the connector between the antenna matching section and the antenna itself can be assembled either with pin heads, sockets or simple solder bridges. The wire holes are on a 2.54 mm grid. Between these wire holes there is a milling line. If you remove the solder bridges, you can easily break the PCB along the milling line. The driver stage of the reader IC is connected to the signals TX1 and TX2. The receiver input is connected to the signal RX. All the necessary external circuitry is located at the reader section. The filter is dimensioned for a resonance frequency of about 14.3 MHz and also located on the reader section. 4.4.1 Complementary Output Stage MFRD52x reference reader design uses a complementary antenna. The following schematic drawing shows all the necessary devices and their values. 119321 Preliminary Data Sheet Rev. 2.1 — 17. April 2007 © NXP B.V. 2007. All rights reserved. 26 of 34 NXP Semiconductors MFRD52x Mifare® Contactless Smart Card Reader Reference Design Table 35. Complementary antenna circuit CRX R2 RX VMID R1 Cvmid L0 MFRC52x TX2 TVSS TX1 L0 C1 C0 C0 C1 RQ C2a C2b C2a C2b RQ Table 36. Assembly list for complementary antenna circuit Part Part No. in Value schematics L0 L1, L2 560 nH C0 C50/C51, C54/C55 220 pF C1 C60, C61 18 pF C2a C58, C59 47 pF C2b C56, C57 6p8 CRx C53 1 nF Cvmid R1 C52 100 nF R30 1 kOhm R2 R31 + R32 2.7 kOhm RQ R35, R36 3.3 Ohm Package 0603 0603 0603 0603 0603 0603 0603 0603 0603 0805 Type TDK MLF1608J COG, 1%, 25V COG, 1%, 25V COG, 1%, 25V COG, 1%, 25V X7R, 5%, 25V X7R, 5%, 6V 5% 5% 5%, 100mW 119321 Preliminary Data Sheet Rev. 2.1 — 17. April 2007 © NXP B.V. 2007. All rights reserved. 27 of 34 NXP Semiconductors MFRD52x Mifare® Contactless Smart Card Reader Reference Design 4.4.2 Parameter Selection on PCB Table 37. Parameter Selection Placement Top Layer 119321 Preliminary Data Sheet Rev. 2.1 — 17. April 2007 © NXP B.V. 2007. All rights reserved. 28 of 34 NXP Semiconductors 5. Schematic & Layout Table 38. Schematic MFRD52x Mifare® Contactless Smart Card Reader Reference Design 119321 Preliminary Data Sheet Rev. 2.1 — 17. April 2007 © NXP B.V. 2007. All rights reserved. 29 of 34 NXP Semiconductors Table 39. Layout Top Signal MFRD52x Mifare® Contactless Smart Card Reader Reference Design Layer 2 GND Layer 3 Supply Bottom Signal 119321 Preliminary Data Sheet Rev. 2.1 — 17. April 2007 © NXP B.V. 2007. All rights reserved. 30 of 34 NXP Semiconductors Table 40. Component Top MFRD52x Mifare® Contactless Smart Card Reader Reference Design Bottom 119321 Preliminary Data Sheet Rev. 2.1 — 17. April 2007 © NXP B.V. 2007. All rights reserved. 31 of 34 NXP Semiconductors MFRD52x Mifare® Contactless Smart Card Reader Reference Design 6. Legal information 6.1 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. 6.2 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is for the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 6.3 Trademarks Notice: All referenced brands, product names, service names and trademarks are property of their respective owners. Mifare® — is a trademark of NXP B.V. 119321 Preliminary Data Sheet Rev. 2.1 — 17. April 2007 © NXP B.V. 2007. All rights reserved. 32 of 34 NXP Semiconductors MFRD52x Mifare® Contactless Smart Card Reader Reference Design 7. Contents 1. 1.1 1.2 2. 3. 4. 4.1 4.2 4.2.1 4.2.2 4.2.3 4.2.4 4.2.5 4.2.6 4.2.7 4.3 4.3.1 4.3.2 4.3.3 4.3.4 4.3.5 4.3.6 4.3.7 4.3.8 4.3.9 4.3.10 4.4 4.4.1 4.4.2 5. 6. 6.1 6.2 6.3 7. 8. Introduction .........................................................3 Scope .................................................................3 Features .............................................................3 Functional Description .......................................4 PCB Marking ........................................................4 Schematic Description........................................5 Schematic Overview ..........................................5 Interface Section ................................................7 Power Supply .....................................................7 Host Interface.....................................................8 Connection Schemes .........................................8 RS232 Transceiver IC ........................................9 Configuration Settings RS232 vs. PC/SC Smart Card Reader interface ......................................10 Connector to reader section .............................11 Parameter Selection on PCB ...........................13 Reader Section ................................................15 Interface Selection ...........................................15 I²C Slave Address Configuration ......................15 Supply Voltage Generation ..............................17 Voltage selection..............................................18 Pad Supply Voltage selection...........................18 SVDD voltage selection ...................................19 Switched Supply Voltage .................................19 Test Signal Output ...........................................20 Extension Board Connector .............................21 Parameter Selection on PCB ...........................22 Antenna Matching Section ...............................26 Complementary Output Stage..........................26 Parameter Selection on PCB ...........................28 Schematic & Layout ..........................................29 Legal information ..............................................32 Definitions ........................................................32 Disclaimers....................................................... 32 Trademarks ......................................................32 Contents ............................................................. 33 Table Index.........................................................34 119321 Preliminary Data Sheet Rev. 2.1 — 17. April 2007 continued >> © NXP B.V. 2007. All rights reserved. 33 of 34 NXP Semiconductors MFRD52x Mifare® Contactless Smart Card Reader Reference Design 8. Table Index Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Table 17. Table 18. Table 19. Table 20. Table 21. Table 22. Table 23. Table 24. Table 25. Table 26. Table 27. Table 28. Table 29. Table 30. Table 31. Table 32. Table 33. Table 34. Table 35. Table 36. Table 37. Table 38. Table 39. Table 40. PCB sections .....................................................................................................................................4 Laser Marking....................................................................................................................................5 Schematic Overview..........................................................................................................................6 Power Supply ....................................................................................................................................7 DSUB-9 Connector Pinning...............................................................................................................8 DSUB-9 Pinning Assignment ............................................................................................................8 RS232 Transceiver IC .......................................................................................................................9 Configuration Setting.......................................................................................................................10 Jumper Settings ..............................................................................................................................11 Connector to Reader Section ..........................................................................................................11 Connector to reader section pin description....................................................................................11 Parameter Selection Top Layer.......................................................................................................13 Parameter Selection Placement Top Layer ....................................................................................13 Parameter Selection Bottom Layer .................................................................................................14 Parameter Selection Placement Bottom Layer ...............................................................................14 Interface Selection...........................................................................................................................15 Interface Options .............................................................................................................................15 Slave Address Configuration...........................................................................................................15 I²C slave address selection .............................................................................................................16 Generation of 2.8V and 1.8V supply voltages.................................................................................17 Voltage selection JP7......................................................................................................................18 Reader IC supply voltages ..............................................................................................................18 Voltage selection .............................................................................................................................18 Pad supply voltage selection JP13 .................................................................................................19 SVDD voltage selection...................................................................................................................19 SVDD supply voltage selection JP15..............................................................................................19 Switched supply voltage JP14.........................................................................................................19 Test Signal Output JP16, JP6 .........................................................................................................20 Extension Connector X2D ...............................................................................................................21 Parameter Selection Top Layer.......................................................................................................22 Parameter Selection Placement Top Layer ....................................................................................23 Parameter Selection Bottom Layer .................................................................................................24 Parameter Selection Placement Bottom Layer ...............................................................................25 Antenna matching and antenna section..........................................................................................26 Complementary antenna circuit.......................................................................................................27 Assembly list for complementary antenna circuit ............................................................................27 Parameter Selection Placement Top Layer ....................................................................................28 Schematic........................................................................................................................................29 Layout..............................................................................................................................................30 Component ......................................................................................................................................31 Please be aware that important notices concerning this document and the product(s) described herein, have been included in the section 'Legal information'. © NXP B.V. 2007. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, email to: salesaddresses@nxp.com Date of release: 17. April 2007 Document identifier: 119321

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