antennas, packaging and circuits-John Wiley

Advanced Millimeter-wave Technologies Advanced Millimeter-Wave Technologies: Antennas, Packaging and Circuits Duixian Liu, Brian Gaucher, Ulrich Pfeiffer and Janusz Grzyb © 2009 John Wiley & Sons, Ltd. ISBN: 978-0-470-99617-1 Advanced Millimeter-wave Technologies Antennas, Packaging and Circuits Dr Duixian Liu IBM, USA Mr Brian Gaucher IBM, USA Dr Ulrich Pfeiffer University of Wuppertal, Germany Dr Janusz Grzyb Huber & Suhner AG, Switzerland A John Wiley and Sons, Ltd, Publication This edition first published 2009 © 2009 John Wiley & Sons Ltd. Registered office John Wiley & Sons Ltd, The Atrium, Southern Gate, Chichester, West Sussex, PO19 8SQ, United Kingdom For details of our global editorial offices, for customer services and for information about how to apply for permission to reuse the copyright material in this book please see our website at www.wiley.com. The right of the author to be identified as the author of this work has been asserted in accordance with the Copyright, Designs and Patents Act 1988. All rights reserved. No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording or otherwise, except as permitted by the UK Copyright, Designs and Patents Act 1988, without the prior permission of the publisher. Wiley also publishes its books in a variety of electronic formats. Some content that appears in print may not be available in electronic books. Designations used by companies to distinguish their products are often claimed as trademarks. All brand names and product names used in this book are trade names, service marks, trademarks or registered trademarks of their respective owners. The publisher is not associated with any product or vendor mentioned in this book. This publication is designed to provide accurate and authoritative information in regard to the subject matter covered. It is sold on the understanding that the publisher is not engaged in rendering professional services. If professional advice or other expert assistance is required, the services of a competent professional should be sought. Library of Congress Cataloging-in-Publication Data Liu, Duixian. Advanced millimeter-wave technologies : antennas, packaging and circuits / Duixian Liu . . . [et al.]. p. cm. Includes bibliographical reference and index. ISBN 978-0-470-99617-1 (cloth) 1. Millimeter wave devices. 2. Millimeter waves. I. Liu, Duixian. TK7876.5.A38 2009 621.381–dc22 A catalogue record for this book is available from the British Library. ISBN 9780470996171 (H/B) Set in 10/12pt Times by Sunrise Setting Ltd, Torquay, UK. Printed in Great Britain by CPI Antony Rowe, Chippenham. 2008041821 Contents List of Contributors Preface Acknowledgements References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 . . . . Introduction Brian Gaucher 1.1 Challenges . . . . . 1.2 Discussion Framework . . 1.3 Circuits . . . . . . . . . 1.4 Antenna . . . . . . 1.5 RF Electronics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.6 Packaging . . . . . . 1.7 Organization and Flow of this Book . . . References . . . . . . . . . . . . . . . . 1.5.1 Receiver . . 1.5.2 Transmitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 . . . . 4 . . . . 4 . . . . 5 . . . . 6 . . . . 6 . . . . 6 . . . . 7 . . . . . . . . 9 . . . . 13 2 Millimeter-wave Packaging 15 xv xix xxi . . . . xxi 1 Ullrich Pfeiffer 2.1 . . . . Introduction . . . . . 2.1.1 Definition of Packaging . 2.1.2 . . . Packaging Challenges and Future Directions . . . . . . . . . . . . . . . . . . . . . . . 2.2 Review of Microwave Packaging Technologies 2.2.1 MMICs . . . . . . . 2.2.2 CNC Milled Metal Housings . . . . . . . 2.2.3 Multi-chip Packages . . . 2.3 Low-cost mmWave Packaging . . . . . . . . . . . . . . . . . . . . . . . 2.3.1 Low-cost Plastic Molding at mmWaves . 2.3.2 Chip-on-board at mmWaves . . . . . . . . . . . 2.4 Emerging Packaging Technologies . . . . 2.4.1 Microcoaxial Wirebonds – Bridgewave . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 . . . . 21 . . . . 23 . . . . 27 . . . . 27 . . . . 29 . . . . 30 . . . . 31 . . . . 32 . . . . 33 . . . . 34 . . . . 34