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德州仪器2.4GHz IEEE 802.15.4和ZigBee应用SoC:CC2530

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  • 日期: 2018-07-25
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标签: CC2530ZigBee德州仪器

  The CC2530 is a true system-on-chip (SoC) solution for IEEE 802.15.4, Zigbee and RF4CE applications. It enables robust network nodes to be built with very low total bill-of-material costs. The CC2530 combines the excellent performance of a leading RF transceiver with an industry-standard enhanced 8051 MCU, in-system programmable flash memory, 8-KB RAM, and many other powerful features. The CC2530 comes in four different flash versions: CC2530F32/64/128/256, with 32/64/128/256 KB of flash memory, respectively. The CC2530 has various operating modes, making it highly suited for systems where ultralow power consumption is required. Short transition times between operating modes further ensure low energy consumption. Combined with the industry-leading and golden-unit-status ZigBee protocol stack ( Z-Stack™) from Texas Instruments, the CC2530F256 provides a robust and complete ZigBee solution. Combined with the golden-unit-status RemoTI stack from Texas Instruments, the CC2530F64 and higher provide a robust and complete ZigBee RF4CE remote-control solution.

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wwwticom CC2530F32 CC2530F64 CC2530F128 CC2530F256 SWRS081B APRIL 2009REVISED FEBRUARY 2011 A True SystemonChip Solution for 24GHz IEEE 802154 and ZigBee Applications Check for Samples CC2530F32 CC2530F64 CC2530F128 CC2530F256 1FEATURES 2345 RFLayout 24GHz IEEE 802154 Compliant RF Transceiver Excellent Receiver Sensitivity and Robustness to Interference Programmable Output Power Up to 45 dBm Very Few External Components Only a Single Crystal Needed for Asynchronous Networks 6mm 6mm QFN40 ......

www.ti.com CC2530F32, CC2530F64 CC2530F128, CC2530F256 SWRS081B –APRIL 2009–REVISED FEBRUARY 2011 A True System-on-Chip Solution for 2.4-GHz IEEE 802.15.4 and ZigBee Applications Check for Samples: CC2530F32, CC2530F64, CC2530F128, CC2530F256 1FEATURES 2345• RF/Layout – 2.4-GHz IEEE 802.15.4 Compliant RF Transceiver – Excellent Receiver Sensitivity and Robustness to Interference – Programmable Output Power Up to 4.5 dBm – Very Few External Components – Only a Single Crystal Needed for Asynchronous Networks – 6-mm × 6-mm QFN40 Package – Suitable for Systems Targeting Compliance With Worldwide Radio-Frequency Regulations: ETSI EN 300 328 and EN 300 440 (Europe), FCC CFR47 Part 15 (US) and ARIB STD-T-66 (Japan) • Low Power – Active-Mode RX (CPU Idle): 24 mA – Active Mode TX at 1 dBm (CPU Idle): 29 mA – Power Mode 1 (4 μs Wake-Up): 0.2 mA – Power Mode 2 (Sleep Timer Running): 1 μA – Power Mode 3 (External Interrupts): 0.4 μA – Wide Supply-Voltage Range (2 V–3.6 V) • Microcontroller – High-Performance and Low-Power 8051 Microcontroller Core With Code Prefetch – 32-, 64-, 128-, or 256-KB In-System-Programmable Flash – 8-KB RAM With Retention in All Power Modes – Hardware Debug Support • Peripherals – Powerful Five-Channel DMA – Integrated High-Performance Op-Amp and Ultralow-Power Comparator – IEEE 802.15.4 MAC Timer, General-Purpose Timers (One 16-Bit, Two 8-Bit) – IR Generation Circuitry – 32-kHz Sleep Timer With Capture – CSMA/CA Hardware Support – Accurate Digital RSSI/LQI Support – Battery Monitor and Temperature Sensor – 12-Bit ADC With Eight Channels and Configurable Resolution – AES Security Coprocessor – Two Powerful USARTs With Support for Several Serial Protocols – 21 General-Purpose I/O Pins (19 × 4 mA, 2 × 20 mA) – Watchdog Timer • Development Tools – CC2530 Development Kit – CC2530 ZigBee® Development Kit – CC2530 RemoTI™ Development Kit for RF4CE – SmartRF™ Software – Packet Sniffer – IAR Embedded Workbench™ Available APPLICATIONS • • RF4CE Remote Control Systems (64-KB Flash 2.4-GHz IEEE 802.15.4 Systems and Higher) • ZigBee Systems (256-KB Flash) • Home/Building Automation • Lighting Systems • • Low-Power Wireless Sensor Networks • Consumer Electronics • Health Care Industrial Control and Monitoring 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 2RemoTI, SmartRF, Z-Stack are trademarks of Texas Instruments. 3IAR Embedded Workbench is a trademark of IAR Systems AB. 4ZigBee is a registered trademark of the ZigBee Alliance. 5All other trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. © 2009–2011, Texas Instruments Incorporated CC2530F32, CC2530F64 CC2530F128, CC2530F256 SWRS081B –APRIL 2009–REVISED FEBRUARY 2011 www.ti.com DESCRIPTION The CC2530 is a true system-on-chip (SoC) solution for IEEE 802.15.4, Zigbee and RF4CE applications. It enables robust network nodes to be built with very low total bill-of-material costs. The CC2530 combines the excellent performance of a leading RF transceiver with an industry-standard enhanced 8051 MCU, in-system programmable flash memory, 8-KB RAM, and many other powerful features. The CC2530 comes in four different flash versions: CC2530F32/64/128/256, with 32/64/128/256 KB of flash memory, respectively. The CC2530 has various operating modes, making it highly suited for systems where ultralow power consumption is required. Short transition times between operating modes further ensure low energy consumption. Combined with the industry-leading and golden-unit-status ZigBee protocol stack ( Z-Stack™) from Texas Instruments, the CC2530F256 provides a robust and complete ZigBee solution. Combined with the golden-unit-status RemoTI stack from Texas Instruments, the CC2530F64 and higher provide a robust and complete ZigBee RF4CE remote-control solution. 2 Submit Documentation Feedback © 2009–2011, Texas Instruments Incorporated Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256 www.ti.com CC2530F32, CC2530F64 CC2530F128, CC2530F256 SWRS081B –APRIL 2009–REVISED FEBRUARY 2011 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. integrated circuits be handled with ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. © 2009–2011, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256 CC2530F32, CC2530F64 CC2530F128, CC2530F256 SWRS081B –APRIL 2009–REVISED FEBRUARY 2011 ABSOLUTE MAXIMUM RATINGS(1) Supply voltage All supply pins must have the same voltage Voltage on any digital pin Input RF level Storage temperature range ESD (2) All pads, according to human-body model, JEDEC STD 22, method A114 According to charged-device model, JEDEC STD 22, method C101 www.ti.com MIN –0.3 –0.3 –40 MAX 3.9 VDD + 0.3, ≤ 3.9 10 125 2 500 UNIT V V dBm °C kV V (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) CAUTION: ESD sensitive device. Precaution should be used when handling the device in order to prevent permanent damage. RECOMMENDED OPERATING CONDITIONS Operating ambient temperature range, TA Operating supply voltage MIN –40 2 MAX UNIT °C 125 V 3.6 ELECTRICAL CHARACTERISTICS Measured on Texas Instruments CC2530 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted. Boldface limits apply over the entire operating range, TA = –40°C to 125°C, VDD = 2 V to 3.6 V, and fc = 2394 MHz to 2507 MHz. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Digital regulator on. 16-MHz RCOSC running. No radio, crystals, or peripherals active. Medium CPU activity: normal flash access (1), no RAM access 32-MHz XOSC running. No radio or peripherals active. Medium CPU activity: normal flash access(1), no RAM access 32-MHz XOSC running, radio in RX mode, –50-dBm input power, no peripherals active, CPU idle 3.4 6.5 20.5 mA 8.9 mA mA mA mA mA Icore Core current consumption 32-MHz XOSC running, radio in RX mode at -100-dBm input power (waiting for signal), no peripherals active, CPU idle 24.3 29.6 32-MHz XOSC running, radio in TX mode, 1-dBm output power, no peripherals active, CPU idle 28.7 32-MHz XOSC running, radio in TX mode, 4.5-dBm output power, no peripherals active, CPU idle 33.5 39.6 Power mode 1. Digital regulator on; 16-MHz RCOSC and 32-MHz crystal oscillator off; 32.768-kHz XOSC, POR, BOD and sleep timer active; RAM and register retention Power mode 2. Digital regulator off; 16-MHz RCOSC and 32-MHz crystal oscillator off; 32.768-kHz XOSC, POR, and sleep timer active; RAM and register retention Power mode 3. Digital regulator off; no clocks; POR active; RAM and register retention Peripheral Current Consumption (Adds to core current Icore for each peripheral unit activated) Timer 1 Timer running, 32-MHz XOSC used Timer 2 Timer 3 Timer 4 Iperi Timer running, 32-MHz XOSC used Timer running, 32-MHz XOSC used Timer running, 32-MHz XOSC used Sleep timer Including 32.753-kHz RCOSC ADC Flash When converting Erase Burst write peak current 0.2 0.3 mA 1 0.4 90 90 60 70 0.6 1.2 1 6 2 1 μA μA μA μA μA μA μA mA mA mA (1) Normal flash access means that the code used exceeds the cache storage, so cache misses happen frequently. GENERAL CHARACTERISTICS Measured on Texas Instruments CC2530 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted. PARAMETER WAKE-UP AND TIMING TEST CONDITIONS MIN TYP MAX UNIT 4 Submit Documentation Feedback © 2009–2011, Texas Instruments Incorporated Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256 www.ti.com CC2530F32, CC2530F64 CC2530F128, CC2530F256 SWRS081B –APRIL 2009–REVISED FEBRUARY 2011 GENERAL CHARACTERISTICS (continued) Measured on Texas Instruments CC2530 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Power mode 1 → active Power mode 2 or 3 → active Active → TX or RX RX/TX and TX/RX turnaround RADIO PART RF frequency range Radio baud rate Radio chip rate Flash erase cycles Flash page size Digital regulator on, 16-MHz RCOSC and 32-MHz crystal oscillator off. Start-up of 16-MHz RCOSC Digital regulator off, 16-MHz RCOSC and 32-MHz crystal oscillator off. Start-up of regulator and 16-MHz RCOSC Initially running on 16-MHz RCOSC, with 32-MHz XOSC OFF With 32-MHz XOSC initially on Programmable in 1-MHz steps, 5 MHz between channels for compliance with [1] As defined by [1] As defined by [1] 4 0.1 0.5 μs ms ms μs μs 192 192 2394 2507 MHz 250 2 2 kbps MChip/s k cycles KB 20 © 2009–2011, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256
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