TMS320F28335, TMS320F28334, TMS320F28332
TMS320F28235, TMS320F28234, TMS320F28232
数字信号控制器
(DSC)
Data Manual
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Literature Number: ZHCS889M
June 2007 – Revised August 2012
TMS320F28335, TMS320F28334, TMS320F28332
TMS320F28235, TMS320F28234, TMS320F28232
www.ti.com.cn
ZHCS889M – JUNE 2007 – REVISED AUGUST 2012
内容
1
TMS320F2833x，TMS320F2823x DSC
..................................................................................
10
，
1.1
1.2
特性
.........................................................................................................................
10
开始½用
....................................................................................................................
11
引脚分配
信号说明
2
简介
..................................................................................................................................
12
3
4
....................................................................................................................
14
....................................................................................................................
23
功½概述
............................................................................................................................
33
3.1
内存映射
....................................................................................................................
34
3.2
简要说明
....................................................................................................................
41
3.2.1
C28x CPU
.......................................................................................................
41
3.2.2
内存总线（哈弗总线架构）
....................................................................................
41
3.2.3
外设总线
.........................................................................................................
41
3.2.4
实时
JTAG
和分析
..............................................................................................
42
3.2.5
外部接口(XINTF)
................................................................................................
42
3.2.6
闪存
...............................................................................................................
42
3.2.7
M0，M1 SARAM
...............................................................................................
42
3.2.8
L0, L1, L2, L3, L4, L5, L6, L7SARAM
........................................................................
43
3.2.9
引导
ROM
........................................................................................................
43
3.2.9.1
引导加½½器½用的外设引脚
.......................................................................
44
3.2.10
安全性
............................................................................................................
44
3.2.11
外设中断扩展
(PIE)
块
.........................................................................................
46
3.2.12
外部中断
(XINT1-XINT7，XNMI)
.............................................................................
46
3.2.13
振荡器和锁相环
(PLL)
..........................................................................................
46
3.2.14
安全装½
.........................................................................................................
46
3.2.15
外设时钟
.........................................................................................................
46
3.2.16
½功率模式
.......................................................................................................
46
3.2.17
外设帧
0，1，2，3 (PFn)
......................................................................................
47
3.2.18
通用输入/输出
(GPIO)
复用器
.................................................................................
47
3.2.19 32
½
CPU
定时器
(0，1，2)
..................................................................................
47
3.2.20
控制外设
.........................................................................................................
48
3.2.21
串行端口外设
....................................................................................................
48
3.3
寄存器映射
.................................................................................................................
49
3.4
器件仿真寄存器
............................................................................................................
51
3.5
中断
..........................................................................................................................
52
3.5.1
外部中断
.........................................................................................................
56
3.6
系统控制
....................................................................................................................
57
3.6.1
OSC
和
PLL
块
..................................................................................................
58
3.6.1.1
外部基准振荡器时钟选项
..........................................................................
59
3.6.1.2
基于
PLL
的时钟模块
..............................................................................
60
3.6.1.3
输入时钟损失
.......................................................................................
61
3.6.2
安全装½块
.......................................................................................................
62
3.7
½功率模式块
...............................................................................................................
63
外设
..................................................................................................................................
64
4.1
DMA
概述
...................................................................................................................
64
4.2
32
½
CPU
定时器
0，CPU
定时器
1，CPU
定时器
2
...............................................................
66
4.3
增强型
PWM
模块
.........................................................................................................
68
4.4
高分辨率
PWM (HRPWM)
................................................................................................
72
4.5
增强型
CAP
模块
..........................................................................................................
73
4.6
增强型
QEP
模块
..........................................................................................................
75
4.7
模数½换器
(ADC)
模块
...................................................................................................
77
4.7.1
如果
ADC
未被½用，ADC 连接
..............................................................................
81
2.1
2.2
内容
版权
© 2007–2012, Texas Instruments Incorporated
2
TMS320F28335, TMS320F28334, TMS320F28332
TMS320F28235, TMS320F28234, TMS320F28232
www.ti.com.cn
ZHCS889M – JUNE 2007 – REVISED AUGUST 2012
4.8
4.9
4.10
4.11
4.12
4.13
4.14
4.7.2
ADC
寄存器
.....................................................................................................
82
4.7.3
ADC
校准
........................................................................................................
83
多通道缓冲串行端口
(McBSP)
模块
.....................................................................................
83
增强型控制器局域½
(eCAN)
模块（eCAN-A 和
eCAN-B）
.........................................................
86
串行通信接口
(SCI)
模块
(SCI-A，SCI-B，SCI-C)
....................................................................
91
串行外设接口
(SPI)
模块
(SPI-A)
........................................................................................
95
内部集成电路
(I2C)
........................................................................................................
98
GPIO MUX
.................................................................................................................
99
外部接口
(XINTF)
........................................................................................................
106
器件和开发支持工具½名规则
..........................................................................................
108
文档支持
...................................................................................................................
110
社区资源
...................................................................................................................
115
最大绝对额定值
..........................................................................................................
建议的运行条件
..........................................................................................................
电气特性
...................................................................................................................
流耗
........................................................................................................................
6.4.1
减少流耗
........................................................................................................
6.4.2
流耗图
..........................................................................................................
6.4.3
散热设计考虑
..................................................................................................
在没有针对DSP的信号缓冲的情况下，仿真器连接
..................................................................
时序参数符号安排
........................................................................................................
6.6.1
定时参数的通用注释
..........................................................................................
6.6.2
测试负½½电路
..................................................................................................
6.6.3
器件时钟表
.....................................................................................................
时钟要求和特性
..........................................................................................................
电源排序
...................................................................................................................
6.8.1
电源管理和监控电路解决方案
................................................................................
通用输入/输出
(GPIO)
...................................................................................................
6.9.1
GPIO -
输出时序
...............................................................................................
6.9.2
GPIO -
输入时序
...............................................................................................
6.9.3
针对输入信号的采样窗口½度
................................................................................
6.9.4
½功耗模式唤醒时序
..........................................................................................
增强型控制外设
...........................................................................................................
6.10.1
增强型脉½调制器
(ePWM)
时序
............................................................................
6.10.2
触发区输入时序
................................................................................................
6.10.3
高分辨率
PWM
时序
..........................................................................................
6.10.4
增强型捕捉
(eCAP)
时序
.....................................................................................
6.10.5
增强型正交编码器脉冲
(eQEP)
时序
........................................................................
6.10.6 ADC
½换开始时序
............................................................................................
外部中断时序
.............................................................................................................
I2C
电气特性和时序
.....................................................................................................
串行外设接口
(SPI)
模块
................................................................................................
6.13.1
主模式时序
.....................................................................................................
6.13.2 SPI
受控模式时序
.............................................................................................
外部接口
(XINTF)
时序
..................................................................................................
6.14.1 USEREADY = 0
...............................................................................................
6.14.2
同步模式
(USEREADY=1，READYMODE=0)
............................................................
6.14.3
异步模式
(USEREADY=1，READYMODE=1)
............................................................
6.14.4 XINTF
信号与
XCLKOUT
一致
..............................................................................
6.14.5
外部接口读取时序
.............................................................................................
6.14.6
外部接口写入时序
.............................................................................................
内容
5
器件支持
..........................................................................................................................
108
5.1
5.2
5.3
6
电气规范
..........................................................................................................................
116
6.1
6.2
6.3
6.4
116
117
117
118
120
121
122
123
124
124
124
125
126
127
128
131
131
132
133
134
138
138
138
139
139
140
141
141
142
142
142
147
151
151
152
153
155
156
158
3
6.5
6.6
6.7
6.8
6.9
6.10
6.11
6.12
6.13
6.14
版权
© 2007–2012, Texas Instruments Incorporated
TMS320F28335, TMS320F28334, TMS320F28332
TMS320F28235, TMS320F28234, TMS320F28232
ZHCS889M – JUNE 2007 – REVISED AUGUST 2012
www.ti.com.cn
6.15
6.16
6.17
6.18
6.14.7
带有一个外部等待状态的外部接口读取准备就绪时序
.....................................................
6.14.8
带有一个外部等待状态的外部接口写入准备就绪时序
.....................................................
6.14.9 XHOLD和XHOLDA定时
......................................................................................
片½½模数½换器
...........................................................................................................
6.15.1 ADC
加电控制½时序
.........................................................................................
6.15.2
定义
.............................................................................................................
6.15.3
顺序采样模式（单通道）
(SMODE = 0)
....................................................................
6.15.4
同步采样模式（双通道）(SMODE=1)
......................................................................
6.15.5
详细说明
........................................................................................................
多通道缓冲串行端口
(McBSP)
模块
...................................................................................
6.16.1 McBSP
发送和接收时序
......................................................................................
6.16.2 McBSP
½为
SPI
主控或者受控时序
........................................................................
闪存定时
...................................................................................................................
F2833x
器件和
F2823x
器件之间的迁移
..............................................................................
160
163
166
169
170
171
172
173
174
175
175
178
182
184
7
8
9
L-到-M
的修订历史记½
.......................................................................................................
185
到
K-到-L
修订历史记½
..........................................................................................................
186
到
散热和机械数据
.................................................................................................................
187
4
内容
版权
© 2007–2012, Texas Instruments Incorporated
TMS320F28335, TMS320F28334, TMS320F28332
TMS320F28235, TMS320F28234, TMS320F28232
www.ti.com.cn
ZHCS889M – JUNE 2007 – REVISED AUGUST 2012
图片列表
2-1
2-2
2-3
2-4
2-5
2-6
2-7
2-8
2-9
3-1
3-2
3-3
3-4
3-5
3-6
3-7
3-8
3-9
3-10
3-11
3-12
3-13
4-1
4-2
4-3
4-4
4-5
4-6
4-7
4-8
4-9
4-10
4-11
4-12
4-13
4-14
4-15
4-16
4-17
4-18
4-19
4-20
4-21
4-22
5-1
6-1
6-2
F2833x，F2823x 176
引脚
PGF/PTP
薄型四方扁平封装
(LQFP)（顶视图）
............................................
14
F2833x，F2823x 179
焊球
ZHH MicroStar BGA™
（左上象限）（底视图）
...........................................
16
F2833x，F2823x 179
焊球
ZHH MicroStar BGA™
（右上象限）（底视图）
...........................................
17
F2833x, F2823x 179
焊球
ZHH MicroStar BGA™
（左下象限）（底视图）
............................................
18
F2833x，F2823x 179
焊球
ZHH MicroStar BGA ™（右下象限）（底视图）
...........................................
19
F2833x，F2823x 176
焊球
ZJZ
塑料
BGA
（左上象限）（底视图）
.....................................................
20
F2833x，F2823x 176
焊球
ZJZ
塑料
BGA
（右上象限）（底视图）
.....................................................
21
F2833x，F2823x 176
焊球
ZJZ
塑料
BGA
（左下象限）（底视图）
.....................................................
22
F2833x，F2823x 176
焊球
ZJZ
塑料
BGA
（右上象限）（底视图）
.....................................................
22
.......................................................................................................................
F28335，F28235
内存映射
....................................................................................................
F28334，F28234
内存映射
....................................................................................................
F28332，F28232
内存映射
....................................................................................................
外部和
PIE
中断源
................................................................................................................
外部中断
...........................................................................................................................
½用
PIE
块的中断复用
..........................................................................................................
时钟和复½域
......................................................................................................................
OSC
和
PLL
块方框图
...........................................................................................................
½用一个
3.3V
外部振荡器
......................................................................................................
½用一个1.9V外部振荡器
.......................................................................................................
½用内部振荡器
...................................................................................................................
安全装½模块
......................................................................................................................
DMA
功½方框图
.................................................................................................................
CPU
定时器
.......................................................................................................................
CPU
定时器中断信号和输出信号
...............................................................................................
时基计数器同步方案
3
..........................................................................................................
ePWM
子模块显示关键内部信号互连
..........................................................................................
eCAP
功½方框图
................................................................................................................
eQEP
功½方框图
................................................................................................................
ADC
模块的方框图
...............................................................................................................
带有内部基准的
ADC
引脚连接
.................................................................................................
带有外部基准的
ADC
引脚连接
.................................................................................................
McBSP
模块
......................................................................................................................
eCAN
方框图和接口电路图
......................................................................................................
eCAN-A
内存映射
................................................................................................................
eCAN-B
内存映射
................................................................................................................
串行通信接口
(SCI)
模块方框图
................................................................................................
SPI
模块方框图（受控模式）
...................................................................................................
I2C
外设模块接口
.................................................................................................................
GPIO MUX
方框图
..............................................................................................................
½用采样窗口的限定：
.........................................................................................................
外部接口方框图
.................................................................................................................
典型的
16
½数据总线
XINTF
连接
...........................................................................................
典型的
32
½数据总线
XINTF
连接
...........................................................................................
F2833x, F2823x的器件½名法示例
...........................................................................................
典型运行电流与频率间的关系（F28335，F28235，F28334，F28234）
...............................................
典型运行功率与频率间的关系（F28335，F28235，F28334，F28234）
...............................................
功½方框图
图片列表
34
36
37
37
53
53
54
57
58
59
59
59
62
65
66
66
68
71
73
75
78
79
80
84
87
88
89
94
97
98
100
105
106
107
107
109
122
122
5
版权
© 2007–2012, Texas Instruments Incorporated
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