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IPC J-STD-004C EN 2022 Requirements for Soldering Fluxes

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IPC

J-STD

IPC

004

004

B

B

2022

2022

IPC  J-STD-004C  EN  2022  Requirements  for  Soldering  Fluxes

January 2022
Supersedes J-STD-004B
IPC J-STD-004C
November 2011
JOINT
INDUSTRY
STANDARD
Requirements for
Soldering Fluxes
®
The Principles of
Standardization
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Standardization as a guiding principle of IPC’s standardization efforts.
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• Show relationship to Design for Manufacturability
(DFM) and Design for the Environment (DFE)
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• Just include spec information
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problems for future improvement
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• Inhibit innovation
• Increase time-to-market
• Keep people out
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• Tell you how to make something
• Contain anything that cannot
be defended with data
Notice
IPC Standards and Publications are designed to serve the public interest through eliminating mis-
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©Copyright 2012. IPC, Bannockburn, Illinois, USA. All rights reserved under both international and Pan-American copyright conventions.
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No reproduction or networking permitted without license from IHS
Not for Resale
IPC-J-STD-004C
Requirements for
Soldering Fluxes
A standard developed by the Flux Specifications Task Group (5-24a)
of the Assembly and Joining Processes Committee (5-20) of IPC
Supersedes:
J-STD-004B - November 2011
J-STD-004A - January 2004
J-STD-004 - January 1995
Amendment 1 - April 1996
Users of this publication are encouraged to participate in the
development of future revisions.
Contact:
IPC
Tel 847 615.7100
Fax 847 615.7105
This Page Intentionally Left Blank
IPC J‐STD‐004C
 
January 2022 
Acknowledgment
Any document involving a complex technology draws material from a vast number of sources. While the principal members of the
Flux Specifications Task Group (5-24a) of the Assembly and Joining Processes Committee (5-20) are shown below, it is not possible
to include all of those who assisted in the evolution of this standard. To each of them, the members of the IPC extend their gratitude.
_______________________________________________________________________________________________________________________________________________
Assembly and Joining
Processes Committee
Flux Specifications
Task Group
Technical Liaisons of the
IPC Board of Directors
Bob Neves
Chair
Chair
Microtek (Changzhou) Laboratories
Anthony W. Lentz
Daniel L. Foster
FCT Assembly, Inc
Missile Defense Ageacy (MDA)
Vice Chair
Vice Chair
Keith Sellers
Udo Wetzel
NTS Baltimore
Robert Bosch GmbH
____________________________________________________________________________________________________________
Flux Specifications Task Group
Jasbir Bath
Koki Solder Amenica
Gerald Leslie Boggert
Bechtel Plant Machinery, Inc.
Lance Brack
Raytheon Missile Systems
Enic Camden
Foresite, Inc.
WiIliam P. Cardinal
Collins Aerospace
Zhiman Chen
Zouzhou CRRC Times
Electric Co., Ltd
Beverly Christian
HDPUser Group
Miguel Dominguez
Continental Temic SAde CV
Aurelie Ducoulombier
Inventec Perfomance Chemicals
Toay Feldmeier
Honeywell Aerospace Minneapolis
Daniel L. Foster
Missile Defense Agency QMDA)
Jason Fullerton
Cobham Defense Electronics
Systems
Mahendra S. Gandhi
Nortbrop Grumman Space
Systemselle
Emmannelle Guene
Ioveotec Performance Chemicals
Alafo Hewitt
Lockbeed Martine Missile &
Fire Control
Gaston Hldago
Toyota Motor North America
Emma Hudson
Emma Hudson Techmical
Consultancy
Christopber Hunt
Gen3 Systems Limited
Jennie S. Hwang
H-Tecbnologies Group
Russell Kido
Practical Compopents Inc.
Justin Kleingartoer
ACTnano Inc.
Vljay Kumar
Lockbeed Martin Missile &
Fire Control
Andy C. Mackie
Indium Corporation
Chris Mahanna
Robisan Laboratory Inc.
Yun Misumo
Koki Company Limited
Tery Munson
Foresite, Inc.
Graham Naisbitt
Gen3 Systems Limited
Timotby ONeil
ADM Solder
Douglas O. Pauls
Collins Aerospace
Jagadeesh Radbakrisbnan Intel
Corporation
Stanton Rak
Rak Conmpany
David W. Sbiroli
Indium Corporation
Jose Servin Olivares
Vitesco Technologies
Russell S. Shepberd
NTS Anabeim
Eric Straw
Collins Aerospace
Keith Wlliam Sweaman
Nibon Supenior Co, Ltd
Kirk Van Dreel
Plexus Corp.
Bill R Vuono
Qorvo US, Inc.
Debbie Wade
Advanced Rework Technology
Dan White
Collins Aerospace
Paul Zutter
Amy Aviation & Missile Comomand
http://www.stdpdf.com 
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文档解析

IPC J-STD-004C是一份由电子行业联盟制定的焊接助焊剂标准,该标准于2022年1月发布,取代了2011年11月的J-STD-004B版本。它由IPC的技术和活动执行委员会(TAEC)在1995年5月采纳,旨在指导IPC标准化工作的原则。标准应体现设计可制造性(DFM)和环境设计(DFE)的关系,最小化产品上市时间,使用简化语言,只包含规格信息,专注于最终产品性能,并包含反馈系统以供未来改进。标准不应抑制创新,增加上市时间,排除人员,增加周期时间,或包含无法用数据辩护的内容。

此标准详细规定了用于高质量焊接互连的助焊剂的分类和特性要求,适用于质量控制和采购目的。它涵盖了Sn-Pb和无铅焊接助焊材料,包括液体助焊剂、膏状助焊剂、焊膏、助焊剂涂层和助焊剂芯焊丝以及预制件。标准不仅定义了助焊剂的分类,还提供了测量单位、要求定义、过程控制要求等。它鼓励用户参与未来修订的制定,并提供了反馈和改进建议的途径。

IPC J-STD-004C标准还强调了过程控制的重要性,特别是对于高性能/恶劣环境电子产品的制造商,他们需要开发和实施一个记录的过程控制系统。此外,标准还包括了资格测试、质量一致性测试和性能测试的详细规定,以及相关的附录、图表和表格来辅助理解和实施。标准的制定和更新旨在促进制造商、客户和供应商之间的更好理解,提高生产效率,并降低成本。

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