LED芯片的制造工艺简介 LED 芯片的制造过程可概分为晶圆处理工序(Wafer Fabrication)、晶圆针测工序(Wafer Probe)、构装工序(Packaging)、测试工序(Initial Test andFinal Test)等几个步骤。其中晶圆处理工序和晶圆针测工序为前段(Front End)工序,而构装工序、测试工序为后段(Back End)工序。
描述:DC/DC Converter; Product Weight (grams): 2.7; Input voltage min (V): 21.6; Input voltage max (V): 26.4; Output voltage min: 15; Output voltage max: 15; Output voltage dual assymetric (y/n): Asymmetric Dual; Output Power (W): 2; Max Output current (A): +0.067/-0.111; Efficiency (%): 80; Max Capacitive load (µF): 100/-220; Package type: SIP7; Mounting: PCB; W (in): 0.28; L (in): 0.76; H (in): 0.39; W (mm): 7.2; L (mm): 19.5; H (mm): 10; Min Operating temperature: -40; Max operating temperature (°C): 95; Isolation (VDC): 5200; EMC compliance 2: EN 55032 class B; Case material: Plastic (flammability to UL 94V-0) ; Application 4 (building automation/IoT): 1; MTBF (h): 3300000; Derating : 65; Voltage Accuracy (%): ±5; Line Regulation (% of Vin): ±1.2; Load Regulation %: ±10; Ripple & Noise (mV p-p): 150; Switching Frequency typ (KHz): 50~100; Short circuit protection: Continuous 是否无铅:不含铅 是否Rohs认证:符合 厂商名称:Aimtec
评论