热搜关键词: 电路基础ADC数字信号处理封装库PLC

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LatticeXP2™ Family Data Sheet
DS1009 Version 01.9, June 2013
LatticeXP2 Family Data Sheet
Introduction
February 2012
Data Sheet DS1009
Features
flexiFLASH™ Architecture
Instant-on
Infinitely reconfigurable
Single chip
FlashBAK™ technology
Serial TAG memory
Design security
Flexible I/O Buffer
• sysIO™ buffer supports:
– LVCMOS 33/25/18/15/12; LVTTL
– SSTL 33/25/18 class I, II
– HSTL15 class I; HSTL18 class I, II
– PCI
– LVDS, Bus-LVDS, MLVDS, LVPECL, RSDS
Live Update Technology
• TransFR™ technology
• Secure updates with 128 bit AES encryption
• Dual-boot with external SPI
Pre-engineered Source Synchronous
Interfaces
• DDR / DDR2 interfaces up to 200 MHz
• 7:1 LVDS interfaces support display applications
• XGMII
sysDSP™ Block
Density And Package Options
• 5k to 40k LUT4s, 86 to 540 I/Os
• csBGA, TQFP PQFP ftBGA and fpBGA packages
,
,
• Density migration supported
• Three to eight blocks for high performance
Multiply and Accumulate
• 12 to 32 18x18 multipliers
• Each block supports one 36x36 multiplier or four
18x18 or eight 9x9 multipliers
• Up to 885 Kbits sysMEM™ EBR
• Up to 83 Kbits Distributed RAM
Flexible Device Configuration
• SPI (master and slave) Boot Flash Interface
• Dual Boot Image supported
• Soft Error Detect (SED) macro embedded
Embedded and Distributed Memory
sysCLOCK™ PLLs
• Up to four analog PLLs per device
• Clock multiply, divide and phase shifting
Table 1-1. LatticeXP2 Family Selection Guide
Device
LUTs (K)
Distributed RAM (KBits)
EBR SRAM (KBits)
EBR SRAM Blocks
sysDSP Blocks
18 x 18 Multipliers
V
CC
Voltage
GPLL
Max Available I/O
Packages and I/O Combinations
132-Ball csBGA (8 x 8 mm)
144-Pin TQFP (20 x 20 mm)
208-Pin PQFP (28 x 28 mm)
256-Ball ftBGA (17 x17 mm)
484-Ball fpBGA (23 x 23 mm)
672-Ball fpBGA (27 x 27 mm)
86
100
146
172
86
100
146
201
XP2-5
5
10
166
9
3
12
1.2
2
172
XP2-8
8
18
221
12
4
16
1.2
2
201
System Level Support
• IEEE 1149.1 and IEEE 1532 Compliant
• On-chip oscillator for initialization & general use
• Devices operate with 1.2V power supply
XP2-17
17
35
276
15
5
20
1.2
4
358
XP2-30
29
56
387
21
7
28
1.2
4
472
XP2-40
40
83
885
48
8
32
1.2
4
540
146
201
358
201
363
472
363
540
© 2012 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand
or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
www.latticesemi.com
1-1
DS1009
Introduction_01.4
Introduction
LatticeXP2 Family Data Sheet
Introduction
LatticeXP2 devices combine a Look-up Table (LUT) based FPGA fabric with non-volatile Flash cells in an architec-
ture referred to as flexiFLASH.
The flexiFLASH approach provides benefits including instant-on, infinite reconfigurability, on chip storage with
FlashBAK embedded block memory and Serial TAG memory and design security. The parts also support Live
Update technology with TransFR, 128-bit AES Encryption and Dual-boot technologies.
The LatticeXP2 FPGA fabric was optimized for the new technology from the outset with high performance and low
cost in mind. LatticeXP2 devices include LUT-based logic, distributed and embedded memory, Phase Locked
Loops (PLLs), pre-engineered source synchronous I/O support and enhanced sysDSP blocks.
Lattice Diamond
®
design software allows large and complex designs to be efficiently implemented using the
LatticeXP2 family of FPGA devices. Synthesis library support for LatticeXP2 is available for popular logic synthesis
tools. The Diamond software uses the synthesis tool output along with the constraints from its floor planning tools
to place and route the design in the LatticeXP2 device. The Diamond tool extracts the timing from the routing and
back-annotates it into the design for timing verification.
Lattice provides many pre-designed Intellectual Property (IP) LatticeCORE™ modules for the LatticeXP2 family. By
using these IPs as standardized blocks, designers are free to concentrate on the unique aspects of their design,
increasing their productivity.
1-2
LatticeXP2 Family Data Sheet
Architecture
June 2013
Data Sheet DS1009
Architecture Overview
Each LatticeXP2 device contains an array of logic blocks surrounded by Programmable I/O Cells (PIC). Inter-
spersed between the rows of logic blocks are rows of sysMEM™ Embedded Block RAM (EBR) and a row of sys-
DSP™ Digital Signal Processing blocks as shown in Figure 2-1.
On the left and right sides of the Programmable Functional Unit (PFU) array, there are Non-volatile Memory Blocks.
In configuration mode the nonvolatile memory is programmed via the IEEE 1149.1 TAP port or the sysCONFIG™
peripheral port. On power up, the configuration data is transferred from the Non-volatile Memory Blocks to the con-
figuration SRAM. With this technology, expensive external configuration memory is not required, and designs are
secured from unauthorized read-back. This transfer of data from non-volatile memory to configuration SRAM via
wide busses happens in microseconds, providing an “instant-on” capability that allows easy interfacing in many
applications. LatticeXP2 devices can also transfer data from the sysMEM EBR blocks to the Non-volatile Memory
Blocks at user request.
There are two kinds of logic blocks, the PFU and the PFU without RAM (PFF). The PFU contains the building
blocks for logic, arithmetic, RAM and ROM functions. The PFF block contains building blocks for logic, arithmetic
and ROM functions. Both PFU and PFF blocks are optimized for flexibility allowing complex designs to be imple-
mented quickly and efficiently. Logic Blocks are arranged in a two-dimensional array. Only one type of block is used
per row.
LatticeXP2 devices contain one or more rows of sysMEM EBR blocks. sysMEM EBRs are large dedicated 18Kbit
memory blocks. Each sysMEM block can be configured in a variety of depths and widths of RAM or ROM. In addi-
tion, LatticeXP2 devices contain up to two rows of DSP Blocks. Each DSP block has multipliers and adder/accumu-
lators, which are the building blocks for complex signal processing capabilities.
Each PIC block encompasses two PIOs (PIO pairs) with their respective sysIO buffers. The sysIO buffers of the
LatticeXP2 devices are arranged into eight banks, allowing the implementation of a wide variety of I/O standards.
PIO pairs on the left and right edges of the device can be configured as LVDS transmit/receive pairs. The PIC logic
also includes pre-engineered support to aid in the implementation of high speed source synchronous standards
such as 7:1 LVDS interfaces, found in many display applications, and memory interfaces including DDR and DDR2.
The LatticeXP2 registers in PFU and sysI/O can be configured to be SET or RESET. After power up and device is
configured, the device enters into user mode with these registers SET/RESET according to the configuration set-
ting, allowing device entering to a known state for predictable system function.
Other blocks provided include PLLs and configuration functions. The LatticeXP2 architecture provides up to four
General Purpose PLLs (GPLL) per device. The GPLL blocks are located in the corners of the device.
The configuration block that supports features such as configuration bit-stream de-encryption, transparent updates
and dual boot support is located between banks two and three. Every device in the LatticeXP2 family supports a
sysCONFIG port, muxed with bank seven I/Os, which supports serial device configuration. A JTAG port is provided
between banks two and three.
This family also provides an on-chip oscillator. LatticeXP2 devices use 1.2V as their core voltage.
© 2013 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand
or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
www.latticesemi.com
2-1
DS1009
Architecture_01.6
Architecture
LatticeXP2 Family Data Sheet
Figure 2-1. Simplified Block Diagram, LatticeXP2-17 Device (Top Level)
sysIO Buffers,
Pre-Engineered Source
Synchronous Support
On-chip
Oscillator
Programmable
Function Units
(PFUs)
SPI Port
sysMEM Block
RAM
JTAG Port
DSP Blocks
Flash
sysCLOCK PLLs
Flexible Routing
PFU Blocks
The core of the LatticeXP2 device is made up of logic blocks in two forms, PFUs and PFFs. PFUs can be pro-
grammed to perform logic, arithmetic, distributed RAM and distributed ROM functions. PFF blocks can be pro-
grammed to perform logic, arithmetic and ROM functions. Except where necessary, the remainder of this data
sheet will use the term PFU to refer to both PFU and PFF blocks.
Each PFU block consists of four interconnected slices, numbered Slice 0 through Slice 3, as shown in Figure 2-2.
All the interconnections to and from PFU blocks are from routing. There are 50 inputs and 23 outputs associated
with each PFU block.
2-2
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