PRODUCT SELECTOR GUIDE
F E B R UA RY 2 0 1 5
TM
FPGAs • CPLDs • REFERENCE DESIGNS • INTELLECTUAL PROPERTY • DEVELOPMENT KITS • DESIGN TOOLS
TM
CONTENTS
■
FPGA and CPLD Products ...................................................4-7
■
Power and Thermal Management Products ............................6
■
Lattice IP Cores and Reference Designs ...........................8-11
■
Development Kits .............................................................12-15
■
Programming Hardware ........................................................16
■
FPGA and CPLD Design Software........................................17
2
The Lattice Advantage
Customizable Solutions
Lattice Semiconductor leads the industry in ultra-low power, small form factor, customizable solutions for today’s quickly
changing connected world. From heterogeneous networks and micro servers, to smartphones, tablets and wearables,
Lattice FPGAs and CPLDs are at the heart of solutions that give designers the ability to quickly innovate, or build and add
features to their systems that uniquely differentiate their products.
iCE40 Portfolio: World’s Smallest FPGAs
Lattice’s iCE40 family offers the world’s smallest FPGAs at very low power enabling flexible and fast customization on
standard platforms - perfect for implementing killer features on smartphones, tablets, wearables and other mobile devices.
MachXO Portfolio: Bridging and I/O Expansion FPGAs
The award-winning MachXO2 FPGA family and new MachXO3 family - the world’s smallest, lowest-cost-per I/O,
instant-on programmable platform - can be used to quickly implement system control functions, I/O expansion and bridging
in applications such as routers, base stations, servers, storage, industrial, medical and consumer.
ECP Portfolio: Connectivity and Acceleration FPGAs
The LatticeECP3 and ECP5 families are optimized for data and control path bridge and interfacing, architected with
high-performance SERDES, full-featured DSP blocks, and for state-of-the-art memory interfaces for supporting a wide
range of applications including wireless and wireline communication, video processing, security and surveillance, and
industrial automation.
Power and Thermal Management Products
Lattice’s Platform Manager 2 devices implement Circuit board hardware management functions (Power Management,
Control Plane Functions and Thermal Management). The Platform Manager 2 device family comprises of a Platform
Manager 2 device (Programmable Analog + FPGA) and a Programmable Analog Sense and Control device (L-ASC10).
In simpler boards, the Power Management functions can be integrated into Lattice Power Manager II products.
Making Designs Easy and Agile
Lattice’s portfolio of FPGAs, CPLDs and Power and Thermal management devices are supported by complete software
tools, intellectual property (IP) cores, reference designs, and development kits for integrating a myriad of systems. From the
new MIPI DSI and CSI-2 standards for mobile, to PCIe, memory and more mature interfaces, Lattice simplifies your design
efforts by offering proven IP cores and the tools to implement them.
For more information go to
LATTICESEMI.COM
3
FPGA Products
ECP Series - Connectivity and Acceleration FPGAs
Features
LFE5UM-25
LFE5UM-45
ECP5
TM
LFE5UM-85
LFE3-17EA
LFE5U-25
LFE5U-45
LFE5U-85
LatticeECP3
TM
LFE2M20E/SE
LFE2M35E/SE
LFE2M50E/SE
LFE2M70E/SE
LFE3-150EA
LFE3-35EA
LFE3-70EA
LFE3-95EA
LatticeECP2/M
TM
LFE2M100E/SE
LFE2-20E/SE
TM
LFE2-35E/SE
LFE2-50E/SE
48 k
21
387
96
72
4+2
LFE2-12E/SE
LFE2-70E/SE
68 k
60
1,032
136
88
6+2
583/0
LFE2-6E/SE
6k
3
55
12
12
Device
LUTs
EBR SRAM
Distrib RAM
sysDSP™
Blocks
SERDES
# of Blocks
kbits
kbits
Multipliers
Max. Chan.
Max. Rate
24 k
56
194
28
1/2
2+2
44 k
108
351
72
84 k
208
669
156
24 k
56
194
28
44 k
108
351
72
0
84 k
208
669
156
17 k
38
700
36
24
4
33 k
72
68
64
67 k
240
145
128
92 k
240
188
128
149 k
372
303
320
16
19 k
66
41
24
4
34 k
114
71
32
48 k
225
101
88
67 k
246
145
96
95 k
288
202
168
12 k
12
221
24
24
21 k
15
276
42
28
32 k
18
332
64
32
1008 1944 3744 1008 1944 3744
1,327 4,420 4,420 6,850 1,217 2,101 4,147 4,534 5,308
2/4
3.2 Gbit/s
4+4
2+2
12
3.2 Gbit/s
4+2
10+2
8
3.2 Gbit/s
8+2
16
2+2
PLL + DLL
DDR Support
Boot Flash
Dual Boot
Bit-stream Encryption
Core Vcc
C
Temp.
I
AEC-Q100
0.5 mm Spacing
csfBGA
csBGA
TQFP
PQFP
285
328
144
208
381
caBGA
554
756
ftBGA
256
256
484
fpBGA
672
900
1152
1156
1) No PLL Available
4+4
2+2
DDR2 800, DDR3 800, LPDDR2 800,
LPDDR3 800
External
P
P
1.1 V
P
P
P
DDR3 800, DDR2 533, DDR
400
External
P
P
1.2 V
P
P
P
DDR2 533, DDR 400
External
P
SE only
1.2 V
P
P
DDR2 533, DDR 400
External
P
SE only
1.2 V
P
P
I/O Count / SERDES
118/2 118/2 118/2 118/0 118/0 118/0
116/2
90/0
93/0
131/0 131/0
I/O Count / SERDES
10 x 10 mm
10 x 10 mm
20 x 20 mm
28 x 28 mm
0.8 mm Spacing
17 x 17 mm
197/2 203/4 205/4 197/0 203/0 205/0
23 x 23 mm
27 x 27 mm
17 x 17 mm
17 x 17 mm
23 x 23 mm
27 x 27 mm
31 x 31 mm
35 x 35 mm
35 x 35 mm
245/4 259/4
365/4
245/0 259/0
365/0
1.0 mm Spacing
133/4 133/4
I/O Count / SERDES
140/4
222/4 295/4 295/4 295/4
310/4 380/8 380/8 380/8
304/4 303/4 270/4
410/4 372/8
410/8
416/16 416/16
436/16 520/16
490/12 490/12 586/16
190/0 193/0 193/0
297/0 331/0 331/0 339/0
402/0 450/0 500/0 500/0
4
MachXO & LatticeXP series - Bridging and I/O Expansion FPGAs
Features
LCMXO3L-640
MachXO3
TM
LCMXO3L-1300
LCMXO3L-2100
LCMXO3L-4300
LCMXO3L-6900
MachXO2™
LCMXO2-1200U
LCMXO2-2000U
MachXO™
LCMXO2-4000
LCMXO2-7000
LCMXO1200C
LCMXO2280C
LCMXO1200E
LCMXO2280E
LCMXO256C
LCMXO640C
LCMXO256E
LCMXO640E
LFXP2-5E
LatticeXP2™
LFXP2-17E
LFXP2-30E
7
LFXP2-40E
8
32
LFXP2-8E
4
P
LCMXO2-640U
LCMXO2-1200
Device
LUTs
EBR SRAM
# of Blocks
kbits
Distrib. RAM
kbits
UFM
kbits
18x18
sysDSP™
Blocks
Blocks
Multipliers
PLL + DLL
DDR Support
Configuration Memory
Dual Boot
4
Bit-stream Encryption
Embedded Function Blocks
640
1300 2100 4300 6900
256 640 640
1280 1280 2112 2112 4320 6864
64
10
64
10
74
16
92
34
240
54
0
0
2
0
2
18
5
24
7
64
5
64
7
64
10
64
8
74
10
80
8
74
16
80
10
92
16
96
10
92
34
96
26
240
54
256
LCMXO2-2000
LCMXO2-256
LCMXO2-640
256
640
1200
1
9.2
6.4
2280
3
27.6
7.7
5k
8 k
17 k 29 k 40 k
2
6.1
9
12 15 21 48
166 221 276 387 885
10 18 35 56 83
3
5
2+1
Internal NVM
P
2+2
1+2
2+2
DDR 266, DDR2 266, LPDDR266
Internal Flash
P
I
2
C (2), SPI (1), Timer (1)
ZE & HE
HC
P
P
P
I/O Count
18
1+0
Internal Flash
P
2+0
12 16 20 28
2+0
4+0
DDR/2 400
Internal Flash
P
P
P
P
HC
P
P
Core Vcc
1.2 V
1.8 - 3.3 V
2.5 - 3.3 V
C
Temp.
I
AEC-Q100
0.4 mm Spacing
25
2.5 x 2.5 mm
2.5 x 2.5 mm
3.2 x 3.2 mm
3.8 x 3.8 mm
E
C
P
P
P
P
P
P
HC
P
P
P
P
P
P
WLCSP
36
2
49
2
81
2
64
32
100
132
184
1
121
2
132
256
2
100
144
256
28
38
63
44
I/O Count
21
78
55
79
104
104
104
150
1
ucBGA
QFN
csBGA
4 x 4 mm
5 x 5 mm
8 x 8 mm
8 x 8 mm
8 x 8 mm
6 x 6 mm
8 x 8 mm
9 x 9 mm
206
281
100
0.5 mm Spacing
74
101
csfBGA
86
324
2
10 x 10 mm
TQFP
14 x 14 mm
20 x 20 mm
14 x 14 mm
15 x 15 mm
17 x 17 mm
17 x 17 mm
17 x 17 mm
19 x 19 mm
23 x 23 mm
27 x 27 mm
55
78
79
107 107
79
111
206
114 114
I/O Count
206 206
78
74
113
159
73
100
211
0.8 mm Spacing
206
3
279
3
324
332
400
256
324
484
672
caBGA
274 278
335
3
I/O Count
206 206
206 206
159
211
271
278 278 334
358
363
472 540
172
201
1.0 mm Spacing
ftBGA
fpBGA
1) Contact your Lattice sales representative for the support of the 184-ball csBGA package, available with the HE option only.
2) Package is only available for E=1.2 V devices.
3) Package is only available for C=2.5 V/3.3 V devices.
4) Dual Boot supported with external boot Flash.
5
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