CADENCE SIP RF LAYOUTWhile system-in-package (SiP) design makes it possible to combine RF and analogcontent on the same substrate, it presents a number of challenges. These includedesigning and integrating RF/analog chips with substrate-level buried RF passivedevices as well as enabling top-level pre- and post-layout circuit simulation of the entire SiP design. CadenceSiP RF Layout provides the proven path betweenVirtuosoanalog design/simulation and substrate layout. It enables layoutdesigners to implement a SiP RF design that includes RF/analog die, embedded RF discretes, constraint-driven interconnect routing, and full SiP tapeoutmanufacturing preparation.
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