手机摄像头模组结构详细解说文档Camera Module Lens : Barrel Lens .Housing : Lens Focusing IR Cut Filter : GlassImage Sensor : CMOS Image Sensor Image Sensor+ISP, Image Sensor only . Substrate() : HPCB, Rigid Flex PCB, Flex PCB, Ceramic, Glass .COB vs COFCamera Module -COB (Chip on Board) : Bare Chip PCB Flexible Board , Wire Bonding Housing Ass’y - COF (Chip on FPCB) : Bare Chip FPCB Flip-chip Bonding Housing Ass’y Structure of AF Module Sensor AF Control chip Micro step Motor , Motor Driver IC Motor Focusing . Edge Detection Motor Motor , Focusing . Phone Baseband chip Software , Baseband . , Module Chip Phone Focusing .Fixed Focus Lens-. Focus Range : 20cm ~ Infinite -. Camera Phone Ratio of Mobile Phone : 2……
猜您喜欢
推荐内容
开源项目推荐 更多
热门活动
热门器件
用户搜过
随便看看
热门下载
热门文章
热门标签
评论