Smart Partitioning in WiMAX Radios By Noman Rangwala Marketing Manager nomanrangwalaanalogcom and Tom Gratzek Product Line Director tomgratzekanalogcom The digital revolution has changed the way we communicate work and travel by reshaping our relationship with the world around us The digitization of electronics has transformed our world by enabling a vast network of portable accessible interconnected com munications media However the promised advantages of digital technology are only as goo......
Smart Partitioning in WiMAX Radios
By Noman Rangwala, Marketing Manager [noman.rangwala@analog.com]
and Tom Gratzek, Product Line Director [tom.gratzek@analog.com]
The digital revolution has changed the way we communicate, work,
and travel by reshaping our relationship with the world around
us. The digitization of electronics has transformed our world by
enabling a vast network of portable, accessible, interconnected com-
munications media. However, the promised advantages of digital
technology are only as good as the ability of the analog technologies
to faithfully translate the digital language of 1s and 0s into natural
analog signals.
The advance of the digital revolution has been characterized by
Moore’s law—which states that the number of transistors on a chip
doubles every 18 months. Analog technologies, on the other hand,
are characterized by Murphy’s Law—if anything can go wrong, it will.
Analog technologies progress at a more measured pace dictated not
by process enhancements but by innovations in circuits and physical
transistor modeling. These technologies improve incrementally on
multiple dimensions of performance, power, and integration.
SPECIAL CONSIDERATION TO BOARD LAYOUT
REQUIRES CLEAN ANALOG SUPPLIES
OVER 20% TO 25% OF THE CHIP AREA
REAL-TIME CONTROL SIGNALS
ON-CHIP ISOLATION REQUIRED
REF
ADC
LO
ADC
DAC
DAC
PLL
SLOW SPEED
CONTROL PORT
REAL-TIME CONTROL LOOPS PARTITIONED
BETWEEN 2 SEPARATE CHIPS AND VENDORS
DIGITAL MODEM/MAC
VALIDATED BY
GATE LEVEL
SIMULATIONS
MIXED-SIGNAL DESIGN
• PERFORMANCE IS A FUNCTION OF ENVIRONMENT
SUCH AS NOISE, SUPPLY ROUTING, ETC.
• 10% TO 15% YIELD LOSS
• HIGH MASK MAKES DESIGN TWEAKS EXPENSIVE
• MIXED-SIGNAL TEST COST > DIGITAL TEST COST
Figure 1. Traditional partitioning.
Integration Trends and the Case for Partitioning
Integration trends are a function of volume and system maturity;
in many cases system acceptance and unit volume production
never grow to justify recurring generational development. In other
applications, such as base stations, instrumentation, and military
applications, stringent performance requirements lead to discrete
implementations. In cases such as cellular and Wi-Fi, where con-
sumer acceptance is universal, competitive forces drive the continual
cost reduction. As technology becomes more expensive to deploy
(such as mask, tool, and engineering costs), the return needed to
justify these developments increases. At the same time, competitive
forces drive companies to invest heavily early in a standard’s life
cycle. If a market takes off, and a company’s chipset is not ready,
the financial result can be dire.
In essence, companies are forced to invest to be ready when a
market takes off, and this investment is increasingly expensive, while
at the same time, customers are requiring more performance from
their suppliers. Obtaining an acceptable return on the R&D invest-
ments required to build today’s complex communication systems
is a very tricky proposition. Depending on the complexity of the
SOC—development costs can easily range from $10 to $20 million,
and higher, for a 90 nm design. Thus, success of a new initiative
depends on identifying a market where your IP is valuable and
then lining up partners to meet customer needs. Fewer and fewer
companies are able to handle all aspects of a system development.
However, focus on performance cost, TTM, and financial payback is
an absolute requirement.
For emerging communications applications like WiMAX, the first
generation systems have typically been developed using multiple
ICs. The MAC/modem section may use FPGAs and off-the-shelf
DSPs; the RF sections often use discrete components such as LNAs,
mixers, and synthesizers, with the ADCs and DACs bridging the gap.
As volumes grow, the digital logic is often integrated together on
a dedicated ASIC and, in some cases, the ADCs/DACs are included
on this digital ASIC, for use with more integrated RF solutions. For
other applications with size constraints, such as mobile phones or
USB dongles, the analog and digital functionality can be integrated
together, either in one system in a package using multichip modules,
or on a single chip. There are many different ways to drive to lower
size and cost, but the trend is that as volumes increase, size and
cost decline. In some cases, cost is king and RF performance can
be sacrificed (i.e., some WLAN consumer applications), although
customers don’t realize it. In other cases, size is paramount, and
integration of functionality is the driver.
There is no one recipe for success. Companies have been successful
with many different integration and cost reduction strategies. To be
clear, development choices must be made that minimize electronic
bill of materials (eBOM), size, and TTM. Intelligent design of system
partitioning is instrumental in achieving success.
Traditional Partitioning—a Time to Market Risk
The integration of mixed-signal circuits on a digital ASIC opens
doors to many implementation challenges and hence introduces
a time-to-market, and more importantly, time-to-revenue risk to
the product. Even though the mixed core has been verified on
a standalone basis, the performance of the core is a function of
the environment in which it is integrated. Issues of power supply
routing, parasitic capacitances, and process variations that are not
important for a digital-only chip, now have a greater significance.
www.analog.com
FPGA DESIGN
FLOW
RTL DESIGN
AND
VERIFICATION
PROTOTYPE
AND
VERIFICATION
PRODUCTION
START
PRODUCTION
DIGITAL ASIC
FPGA
VERIFICATION
RTL DESIGN
AND
VERIFICATION
PLACE AND
ROUTE
AND FINAL
VERIFICATION
PROTOTYPE
VALIDATION
AND
PRODUCTION
START
PRODUCTION
In high volume markets, the ability to manufacture at multiple
fabrication sites is essential to ensure timely delivery and optimize
costs. Digital design can be relatively fabrication-site agnostic while
porting mixed-signal circuits to different fabs is time consuming and
can require extensive redesign and optimization skills. The resources
for targeting different manufacturing flows are usually very difficult
to put together, and often better spent elsewhere.
Another important issue with traditional partitioning is that it requires
a matched pair approach. That is, since the ADCs and DACs are
separated from the RF, the real-time loops, such as automatic gain
control and transmit power control, are forced to be shared between
two chips and multiple parties. Significant up-front work is required
to optimize a reference design from discrete devices.
These challenges of analog and mixed-signal design lessen the focus
from the core competency of the system level design team and can
delay the introduction of new products to market.
6 TO 18 MONTH DESIGN CYCLE
TIME INCREASE
RTL DESIGN
FPGA
MxFE
AND
VERIFICATION
INTEGRATION
VERIFICATION
PLACE AND
ROUTE
AND FINAL
VERIFICATION
PROTOTYPE
VALIDATION
AND
PRODUCTION
PRODUCTION
START
MIXED-SIGNAL ASIC
Figure 2. Design cycle time.
The time from an FPGA-validated, digital-only design to silicon
ranges from two to six months based on complexity, design flow,
and automation tools. On the other hand, the cycle time to get a
mixed-signal design to first silicon could take up to three times as
long—assuming that the analog cores are available and verified in
the appropriate process of choice. The sensitivity of analog circuitry
to noise generated by the switching of millions of transistors in the
presence of signals in the range of microvolts requires greater atten-
tion and multiple design and layout reviews, thereby increasing the
time to silicon and working samples.
The problem is not insurmountable. Multiple techniques are available
to mitigate the interaction, but these require careful attention to cus-
tom layout of the mask, which takes engineering time and resources.
It certainly requires an entirely new set of core competencies in what
may already be an overloaded engineering team.
The evaluation board design and layout also has a critical impact
on the performance of the mixed-signal portion of the device. The
analog I/O on the reference board is sensitive to external noise, and
the supply routes to the mixed-signal portion of the design require
high isolation. Eliminating analog I/O reduces the noise coupling
issues to a minimum. In addition, it solves the problem of interfacing
analog cores from different vendors (i.e., RF chip and mixed-signal
converter cores). For example, some of the available ADC cores rec-
ommend that, to obtain data sheet specified performance, a discrete
5 V op amp driver buffer is required. For modems using a smaller
process, such as 130 nm or 90 nm, the signal swing and common-
mode level must be reduced and matched when using different
vendor RF chips. These additional considerations require valuable
engineering resources.
Being second to market often means steeply discounting product
pricing in order to capture market share. Choosing a pure digital
or an FPGA design flow can shorten the time to bring a product to
volume manufacturing by six to 12 months.
Getting to functional silicon is only the first step—getting to produc-
tion with a mixed-signal IC offers its own challenges. Mixed-signal
circuits are sensitive to process variations such as thresholds, leak-
age, resistance of material, and other process parameters. Often, as
the performance of the mixed-signal degrades, so does the system.
Smart Partitioning
With the availability of mature RF CMOS processes and advances
in analog and RF modeling capabilities, it is now possible to move
the data converters and other mixed-signal blocks to the RF IC. The
next section will show why replacing the traditional analog baseband
interface with a digital interface offers a “smarter” system partition-
ing for some communications systems.
The proposed change includes the appropriate partitioning of
functionality such that the RF system on a chip (SOC) provides a
complete RF to bits solution, which includes all the required control
loops such as automatic gain control, transmit power control, and
RF calibration loops. The inclusion of control loops on the radio
front end results in ease of use and easier mix and match capability
with different digital baseband PHY modems. A standard format, the
ADI/Q
™
digital I/Q interface, is available for the interface between the
RF front end and the digital baseband. This interface format consists
of bidirectional control and data lines and it supports interchange-
ability and ease of application. The reduction of real-time software
control results in simpler system design. All the analog and RF
specific controls are partitioned to the RF front end.
Figure 3. Smart partitioning.
2
Low Unit Cost and Lower Development Cost
Market segments which are characterized by high demand and pro-
duction volumes attract more market entrants. To be successful in
defending a lead and increasing market share, the solution providers
need to pay attention to full factory cost for the chipset. Smart
partitioning can offer significant device cost reduction.
For communication systems, such as WiMAX and broadband wire-
less access, consumer price points less than $100 are essential. CPE
equipment for ADSL and 802.11g Wi-Fi ($20 to $30) are examples
of where volumes increased dramatically as prices declined. An
emerging market such as WiMAX will also experience similar price
pressures. It is expected that the end user CPE prices will be under
$100 by mid-2007. To achieve these targets, the chipset pricing
will be required to fall into the range of $20 to $25. This is prob-
ably much lower than the current costs, and will require quantum
improvements so that market prices yield an acceptable profit.
RF to bits radio ICs can help enable this transition.
For a given process, mixed-signal ASIC design is more expensive
than a digital-only ASIC design, with the increased cost adders hav-
ing four main components:
1. For a particular process, mixed-signal devices are inherently more
expensive. The mixed-signal features require additional processing
steps such as thicker oxides, low threshold devices, and additional
implants. In general, mixed-signal wafer costs can be 20% higher
than the digital-only wafer.
2. The fabrication plants invest heavily in the reduction of defect
density, resulting in high yields, close to 97% to 98%, depending
on die size. On the other hand, analog circuit IC yield is a function
of the design itself. To achieve specified performance while making
power dissipation trade-offs, analog circuits are designed to perform
to specifications over a narrow window of process variations when
compared to digital design, resulting in parametric-limited yield, thus
increasing the costs for mixed-signal designs. This adds over a 10%
increase in costs for mixed-signal designs.
3. The elimination of analog functions from the digital modem
results in simplification of production test development and is instru-
mental in reducing production test time. Enabling test on a generic
digital tester rather than an expensive mixed-signal tester can reduce
tester cost by 15% to 20%.
Test coverage tools allow a digital designer to create fault coverage
scan chains, simplifying production test. Whereas mixed-signal test-
ing requires measuring various analog specifications in the range of
a few microvolts. A mixed-signal test design could take at least five
times longer than a digital-only test. The time can be reduced using
parallel processing on the testers. Assuming an aggressive test
program methodology—the test cost for mixed-signal devices can
be in the range of two to three times greater.
4. The integrated converter core is usually intellectual property that
is developed by a third party and/or an internal group with associ-
ated royalties, and/or NRE. The design and support tools used in a
mixed-signal design flow are an added investment when compared
with a design toolkit for a digital-only ASIC solution. A suite of tools
400.0
350.0
RELATIVE COST (%)
300.0
250.0
200.0
150.0
100.0
50.0
0.0
180
SMART PARTITIONING COST BENEFIT
MIXED SIGNAL VS. DIGITAL COST
• WAFER COST
• TEST COST
• YIELD COST
20%
10%
10%
OPTIMUM PROCESS SELECTION
2 COST REDUCTION
OPPORTUNITY COST
• TIME TO MARKET 6 TO 18 MONTHS
• OPTIMUM PROCESS
2
DIGITAL MODEM/MAC
130
90
65
MIXED-SIGNAL MODEM/MAC (5%)
MIXED-SIGNAL MODEM MAC (10%)
PROCESS (nm)
Figure 4. Cost benefit of smart partitioning.
required to design a new mixed-signal ASIC when compared to a
digital-only ASIC can easily exceed $500k.
Additionally, analog circuits do not scale with process shrinks in the
same way digital circuits do. Figure 4 illustrates the rising costs of
mixed-signal ICs as a function of feature size. The cost curves are
normalized to the cost of a digital-only ASIC in 180 nm. Historically,
the digital ASIC cost tends to reduce by a third when migrating from
one feature size to the next. In contrast, the mixed-signal IC cost
increases as a function of the percentage of mixed-signal die area.
This comes from the fact that the noise limited analog circuitry does
not scale with lithography, while the digital circuitry tends to scale as
quadratically with process.
New processing equipment investments and the increased complex-
ity of the manufacturing process result in a net increase in the
die cost per sq. mm from one generation to the next. The digital
circuitry scales proportionally to result in a lower cost per transistor.
Since analog circuits do not scale with process, the total mixed-
signal product cost tends to remain flat initially and increases with
subsequent process shrinks.
In high volume markets, companies must remain cost competitive
while meeting market pricing and providing a fair return to investors.
If a company’s cost structure is double the best-in-class competi-
tors, new tactics or new strategies will soon become necessary.
Although all the challenges associated with mixed-signal design
continue to exist, the benefits of smart partitioning include dramati-
cally lowering the systems cost by taking full advantage of Moore’s
law—not always available to analog/RF circuits.
In addition to the increased cost per device, the opportunity cost of
not selecting an optimum process and longer time to market can
doom the financial return on a project. The availability of ready-to-
use analog and mixed-signal cores lag behind the digital process by
approximately two years, or about one generation. With the avail-
ability of production ready cores being close to four years out, the
smart partitioning approach enables the system vendors to choose
an optimum process based on their needs and not be constrained by
availability of a validated analog core. The opportunity cost associat-
ed with the selection of a nonoptimum process is high. For example,
in the broadband wireless space, manufacturers have announced a
90 nm core design. The difference in product cost between a 90 nm
3
digital SOC design and 130 nm can be greater
than 200 percent! At 65 nm, the multiplier can be
even higher.
The proposed change offers an opportunity to
use the additional time and resources to focus on
developing the next generation product—
potentially putting it one product generation
ahead of competitors who are spending valuable
resources fighting issues inherent in a mixed-sig-
nal ASIC design.
between the analog and digital filtering, utilizing
the converter dynamic range to the maximum.
Power dissipation is also an important parameter
for mobile systems. Power dissipated on a digital
chip is directly proportional to the square of the
supply voltage and directly proportional to the gate
capacitance. Thus, for a process migration from
130 nm to 90 nm, the result could be a power sav-
ings of 8×. With a smart partitioning philosophy,
the DBB, when implemented in 0.13
μm,
dissipat-
ing in the range of 1 W to 1.5 W, can be reduced
aggressively down to 200 mW, when moved to a
90 nm process.
Analog Devices, Inc.
Worldwide Headquarters
Analog Devices, Inc.
One Technology Way
P.O. Box 9106
Norwood, MA 02062-9106
U.S.A.
Tel: 781.329.4700
(800.262.5643,
U.S.A. only)
Fax: 781.461.3113
Analog Devices, Inc.
Europe Headquarters
Analog Devices, Inc.
Wilhelm-Wagenfeld-Str. 6
80807 Munich
Germany
Tel: 49.89.76903.0
Fax: 49.89.76903.157
Analog Devices, Inc.
Japan Headquarters
Analog Devices, KK
New Pier Takeshiba
South Tower Building
1-16-1 Kaigan, Minato-ku,
Tokyo, 105-6891
Japan
Tel: 813.5402.8200
Fax: 813.5402.1064
Analog Devices, Inc.
Southeast Asia
Headquarters
Analog Devices
22/F One Corporate Avenue
222 Hu Bin Road
Shanghai, 200021
China
Tel: 86.21.5150.3000
Fax: 86.21.5150.3222
Performance Advantages from the Shift
to a Digital Radio Baseband Interface
Along with the cost advantage in development,
support, and per unit cost, smart partitioning
enables a high performing system solution.
For advanced OFDM systems with high peak-to-
average ratio, the high linearity achieved on the RF
device, as well as the advanced synchronization
and channel estimation algorithms on the DBB,
must not be compromised by the dynamic range
of the ADCs and DACs. Careful management of the
headroom must be considered to enable robust
performance in the presence of noise, fading
channels, and interferers.
With the integration of an autonomous AGC
loop, the dynamic range of the ADCs can be
matched with the capability of the RF front end,
thus enabling high data rates such as 64 QAM.
There are many vendors that have struggled with
bringing up their reference designs because of the
complex interactions between the DBB and the
RF IC. In addition, advanced techniques, such as
symbol-to-symbol AGC, can be utilized to improve
the performance of the system in fading channels
which are common in mobile environments. Unlike
a distributed AGC (i.e., AGC algorithm imple-
mented on two separate devices), the proposed
partitioning enables a fast convergence of the
AGC, thus allowing the DBB to spend more time
on channel estimation and synchronization, thus
improving the system performance by many deci-
bels, which translates into greater range and rate.
Filtering is required to eliminate undesired signals
from adjacent or alternate channels. To address
this issue, careful trade-offs must be made
between linearity and filtering complexity. For low
cost ZIF architectures, the final channel selectivity
is performed by using digital filters. Filtering like
gain must be distributed between the RF and sub-
sequent digital filters. Smart partitioning enables
the optimization of the filtering requirements
Summary
The digital revolution has resulted in solutions
with millions of gates put together on fine line
processes. These SOC solutions are expensive to
develop and put tremendous pressure on return
on investment. To succeed, one must choose
the appropriate market segment, apply focus
on a core competency to deliver a differentiated
product at low cost in a timely manner. Partnering
to minimize risk and executing to a schedule is an
attractive option.
Partitioning with an “RF to bits” radio offers the
four key ingredients for success—high perfor-
mance solution, focus on core competency, lowest
power cost, and fastest time to market.
The appropriate partitioning of analog and digital
functionality solves many of the issues related to
integration of analog circuits on digital ASICs and
results in faster time to market and longer time-in-
market. It enables the optimization of the system
to achieve high performance.
For digital baseband vendors, with expertise in
digital modems and media access controllers,
smart partitioning offers the advantage of focusing
critical resources on tasks and projects that further
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