All semiconductor devices are sensitive to electrostaticdischarge (ESD) damage to varying degrees. This istrue whether they are soldered to a PC board in anapplication, or whether they are unattached in theshipping or application assembly process. Goodhandling techniques such as groundstraps, static freework stations and ionizers can reduce the risk of staticbuild up during assembly. Often more attention is paidto reducing ESD during assembly than is paid toreducing ESD risk during the lifetime of the application.
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