ON Semiconductor has a complete portfolio of rugged, reliable products
that meet the needs of industrial grade applications.
HVAC
Control
CCTV Control
Smoke
Detection
Fire Detection
& Alarm
AC
Drive
Lighting
Control
•
Power Management
•
Temperature Monitoring
& Control
•
Motion & Speed Control
•
Electro-Mechanical Break
Control
•
Switching & Valve Control
•
Local Communications
•
Image Sensing
•
Sensor Interface
•
Electrical Protection
•
Oscillator Startup
•
Capacitance Discharge
Security &
Access Control
Ventilation
Energy
Management
Building Systems
Integration (Networking)
HVAC
Control
Security
System
Kitchen
Appliances
White
Goods
Lighting
Control
Energy Management
Sprinkler &
Irrigation Systems
Page 2
Industrial Solutions
Mixed-Signal ASIC Development Services
Value Proposition
•
Experienced resources and assets to bring customers’ design objectives successfully to market
•
Ability to integrate customers’ IP into single-chip solution, thereby protecting the IP
•
Flexible cost models to reduce customers’ total cost
• CAN, LIN
• I
2
C-bus
• USB
• KNX
• M-BUS
Wired
Communications
Design Engineering
• RF
Low or
High
Voltage
High Voltage (40 to 80 V)
Low Voltage (<3.3 V)
Low or
High
Voltage
Power/
Battery
Management
Wireless
Radio
Analog
Signals
Filtering
Analog/
Digital
Conversion
• Microcontroller
• DSP
Signal
Processing
Actuator
• Coil Driver
• Class-D Amp
• DAC
• Display Driver
Example:
Mechanical or
Electrical System:
• Stepper Motors
• Transducers
• MOSFETs & BJTs
• Relays
• Speakers
• Lamps
• LCD/LED Displays
Example:
Sensor:
• Magnetic Flux
• Temperature
• Light
• Sound
• Pressure
• Acceleration
• Angular Rate
Amplification
Sensor Interface
ASIC
Supporting
Logic
Memory
• EEPROM
• OTP
• SRAM
• ROM
•
Approximately 200 expert mixed-signal
designers with extensive SoC and SiP
experience
•
Robust custom development process
•
Dedicated project managers track & report
development progress
•
Flexible customer development engagement,
from full turnkey to subcontractor
production services
•
Design expertise in:
»
Sensor interface
»
Wireless systems
»
Energy management
»
Building & home control
IP & Fab Processes
•
≥
55 nm, analog-focused CMOS/BCDMOS process technologies
utilizing internal fabs and external foundry partners
•
Low, medium, high voltages —
≤
1 V to 90 V
•
Low current optimization — active & standby
•
Low noise design — “count the electrons”
•
High temperature —
≤
200°C (profile, for selected technologies)
•
Integrated low power wireless
•
Non-Volatile Memory (EEPROM, OTP), RAM & ROM
•
Embedded digital IP
•
Robust ESD protection
•
Extensive building block ‘starting points’ consisting of amplifiers,
references, DACs, ADCs, linear & switching regulators, power
management, etc.
ON Semiconductor
Category
Serial Interfaces
Microprocessors
Memory
Clocking
Communication
Encryption
Data Converters
Wireless IP
Power Management
References
Analog and High Voltage
Interfaces
Signal Conditioning
Mixed Signal Intellectual Property (IP)
USB 3.0/2.0/1.1, HDMI, MIPI, I2C, SPI, CAN, UART
ARM, RCore DSP, R8051, AMBA/AHB/APB Peripherals
SRAM, DPRAM, ROM, EEPROM, OTP, FLASH
Oscillators, PLLs, DLLs
Wireless (Proprietary & Standards), Wired (KNX, PLC
and others)
ECC, AES, 3-DES, DES, RSA
DAC, ADC (8 - 20 bits, 1 KSPS – 120 MSPS)
PGA, LNA, PLLs, Correlators, DSP
Efficient Switching Regulators, LDOs, Charge Pumps,
Thermal Protection
Precision Bandgaps, Current References, Temperature
Sensors
High-Voltage Drivers, Display and LCD Drivers, Class D
Amplifiers
PGA, Instrumentation Amps, Digital and Analog Filters
Page 3
PLC Modems/Power Line Driver
COMMUNICATION
C8
R7
12 V
C9
VCC
R8
3V3_D
C7
C6
R6
3V3_A
C16
VDDA
3V3_D
C17
VDD
R12
R5
R4
C4
Vwarn
GNDuC
R9
C5
Rlim
3V3_D
R14
TX_ENB
R2
C11
D3
XTAL_OUT
D4
Tr
1:2
R11
3 V 3_A
D5
R1
CDREF
ZC_IN
C12
C13
C14
XTAL_IN
REF_OUT
SEN
VSSA
VSS
EXT_CLK_E
C15
R3
C2
C1
RX_OUT
RX_IN
VDD1V8
C3
TX_OUT
T_REQ
TXD
RXD
BR0
Application
&
Metering
μC
12 V
R10
D1
MAINS
NCS5651
VEE
Vcom
D2
C10
NCN49597
BR1
RESB
Device
NCN49599
Function
PLC S-FSK Modem;
A - D Band
PLC S-FSK Modem;
A - D Band
PLC S-FSK Modem;
A & B Band
Power Line Driver;
Class AB
•
ARM Cortex M0
•
Baud rate: 4800 Bauds
•
S-FSK modulation
•
ARM Cortex M0
•
Baud rate: 4800 Bauds
•
ARM7TDMi, 24 MHz core
•
Baud rate: 2400 Bauds
Features
•
Hardware embedded MAC + PHY
•
Embedded 1.2 A, 2-stage power amplifier
with current limitation and thermal
protection
•
S-FSK modulation
•
Hardware embedded MAC + PHY
•
S-FSK modulation
•
Hardware embedded MAC + PHY
•
Current shutdown minimizes power
consumption during power down state
•
Rail-to-Rail Drop of Only ±1 V with
Iout = 1.5 A
Package(s)
QFN-56
Smart
Grid
Modem
NCN49597
Smart
Metering
AMIS49587
Modem
Power
NCS5651
Amplifier
QFN-52
QFN-52
•
Low distortion power line driver with
optimized interface for PLC modems
•
Capability to drive 2.0 A peak into
reactive loads
QFN-20 EP
Page 4
Industrial Solutions
Modems
AMIS-49200 & AMIS-49250 Fieldbus Physical Layer Medium Access Units
•
Compatible to both FOUNDATION Fieldbus H1 (Type 111 and Type
112 per FF-816) and PROFIBUS PA standards
•
Enables Fieldbus to completely power field devices using the
integrated power supply block
•
Data rate: 31.25 kbps voltage mode
•
Low current consumption 500
μA
typ
•
LQFP-44 and NQFP-44 packages
Process
Sensor
Microprocessor
with RAM and ROM
Link
Controller
Fieldbus
MAU
Fieldbus
Segment
Industrial HART Protocol Modems
•
Single-chip, half-duplex 1200 bps FSK modem
•
Bell 202 shift frequencies of 1200 Hz and 2200 Hz
•
Transmit-signal wave shaping
•
Receive band-pass filter
VDDA
1.8 V − 3.5 V
VDD
RESET
VPOR
KICK
RxAN
VDDA
RxAFI
RxAF
RxAP
HART IN
RxD
HART Modems
Device
NCN5193
CD
TxD
VDDA
AREF
Input
Frequency
460.8 kHz,
920 kHz,or
1.8 MHz
460.8 kHz,
920 kHz,or
1.8 MHz
460.8 kHz
DAC
Integrated
16-bit
Sigma-Delta
Integrated
16-bit
Sigma-Delta
External
Temp Range
(°C)
Package
–40 to +85
QFN-32
μC
RTS
CS
DATA
SCLK
CLK1
CLK2
XOUT
NCN5193
CDREF
TxA
HART &
4 – 20 mA OUT
VDDA
DAC
JUMP
DACREF
TEST2
TEST1
CBIAS
VSS
MODE
NCN5192
–40 to +85
QFN-32
QFN-32,
LQFP-32,
PLCC-28
3.6864 MHz
XIN
A5191HRT
–40 to +85
ON Semiconductor
Page 5
COMMUNICATION
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