MT6589 HSPA+ Smartphone
Application Processor
Technical Brief
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Version:
Release date:
0.2
2012-09-26
© 2011 - 2012 MediaTek Inc.
This document contains information that is proprietary to MediaTek Inc.
Unauthorized reproduction or disclosure of this information in whole or in part is strictly prohibited.
Specifications are subject to change without notice.
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loginid=chunping.miao@nbbsw.com,time=2012-11-23 14:49:04,ip=218.75.87.37,doctitle=MT6589_Technical_Brief_v0.2.docx,company=Bird_WCX
MT6589
HSPA+ Smartphone Application Processor
Technical Brief
Confidential A
Document Revision History
Revision
0.1
0.2
Date
2012-09-14
2012-09-26
Author
YC Lai
YC Lai
Description
First created by YC Lai
Document revised.
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MediaTek Confidential
© 2012 MediaTek Inc.
Page 2 of 53
This document contains information that is proprietary to MediaTek Inc.
Unauthorized reproduction or disclosure of this information in whole or in part is strictly prohibited.
datasheet pdf - http://www.DataSheet4U.net/
loginid=chunping.miao@nbbsw.com,time=2012-11-23 14:49:04,ip=218.75.87.37,doctitle=MT6589_Technical_Brief_v0.2.docx,company=Bird_WCX
MT6589
HSPA+ Smartphone Application Processor
Technical Brief
Confidential A
Table of Contents
Document Revision History .................................................................................................................. 2
Table of Contents ................................................................................................................................... 3
1
System Overview .......................................................................................................................... 6
1.1
1.2
1.3
1.4
2
Platform Features ................................................................................................................. 7
MODEM Features ................................................................................................................. 8
Multimedia Features ............................................................................................................. 9
General Descriptions .......................................................................................................... 10
Product Description ................................................................................................................... 12
2.1
Pin Description.................................................................................................................... 12
2.1.1
Ball Map View ..................................................................................................... 12
2.1.2
Pin Coordinate .................................................................................................... 13
2.1.3
Detailed Pin Description ..................................................................................... 17
Electrical Characteristic ...................................................................................................... 29
2.2.1
Absolute Maximum Ratings ............................................................................... 29
2.2.2
Recommended Operating Conditions ................................................................ 30
2.2.3
Storage Condition............................................................................................... 31
2.2.4
AC Electrical Characteristics and Timing Diagram ............................................ 31
System Configuration ......................................................................................................... 34
2.3.1
Mode Selection ................................................................................................... 34
2.3.1
Constant Tie Pins ............................................................................................... 34
Power-on Sequence ........................................................................................................... 35
Analog Baseband ............................................................................................................... 36
2.5.1
BBRX .................................................................................................................. 37
2.5.2
BBTX .................................................................................................................. 39
2.5.3
2GBBTX ............................................................................................................. 41
2.5.4
APC-DAC ........................................................................................................... 42
2.5.5
VBIAS-DAC ........................................................................................................ 43
2.5.6
AUXADC ............................................................................................................ 44
2.5.7
Clock Squarer ..................................................................................................... 46
2.5.8
Phase Locked Loop............................................................................................ 46
2.5.9
Temperature Sensor .......................................................................................... 51
Package Information ........................................................................................................... 52
2.6.1
Package Outlines ............................................................................................... 52
2.6.2
Thermal Operating Specifications ...................................................................... 52
2.6.3
Lead-free Packaging .......................................................................................... 52
Ordering Information ........................................................................................................... 53
2.7.1
Top Marking Definition ....................................................................................... 53
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2.2
2.3
2.4
2.5
2.6
2.7
MediaTek Confidential
© 2012 MediaTek Inc.
Page 3 of 53
This document contains information that is proprietary to MediaTek Inc.
Unauthorized reproduction or disclosure of this information in whole or in part is strictly prohibited.
datasheet pdf - http://www.DataSheet4U.net/
loginid=chunping.miao@nbbsw.com,time=2012-11-23 14:49:04,ip=218.75.87.37,doctitle=MT6589_Technical_Brief_v0.2.docx,company=Bird_WCX
MT6589
HSPA+ Smartphone Application Processor
Technical Brief
Confidential A
List of Figures
Figure 1-1: Block diagram of MT6589 ................................................................................................... 11
Figure 2-1 : Ball map view of MT6589 .................................................................................................. 12
Figure 2-2: Basic timing parameter for LPDDR2 commands ................................................................ 32
Figure 2-3: Basic timing parameter for LPDDR2 write .......................................................................... 32
Figure 2-4: Basic timing parameter for LPDDR2 read .......................................................................... 33
Figure 2-8: Power on/off sequence with XTAL ...................................................................................... 35
Figure 2-9: Power on/off sequence without XTAL ................................................................................. 36
Figure 2-10: Block diagram of BBRX-ADC ........................................................................................... 38
Figure 2-11: Block diagram of 2GBBTX ................................................................................................ 41
Figure 2-12: Block diagram of APC-DAC .............................................................................................. 42
Figure 2-13: Block diagram of VBIAS-DAC .......................................................................................... 43
Figure 2-14: Block diagram of AUXADC ............................................................................................... 44
Figure 2-15: Block diagram of PLL ....................................................................................................... 47
Figure 2-16: Outlines and dimensions of FCCSP 11.8mm*11.8mm, 515-ball, 0.4mm pitch package.. 52
Figure 2-17: Top mark of MT6589 ......................................................................................................... 53
List of Tables
Table 2-1: Pin coordinate ...................................................................................................................... 13
Table 2-2: Acronym for pin type ............................................................................................................ 17
Table 2-3: Detailed pin description ........................................................................................................ 17
Table 2-4: Absolute maximum ratings for power supply ....................................................................... 29
Table 2-5: Recommended operating conditions for power supply ........................................................ 30
Table 2-6: LPDDR2 AC timing parameter table of external memory interfaces .................................... 33
Table 2-8: Mode selection of chip (PMU 6320 pin) ............................................................................... 34
Table 2-9: Constant tied pins of MT6589 .............................................................................................. 34
Table 2-10: Baseband downlink specifications ..................................................................................... 38
Table 2-11: Baseband uplink transmitter specifications ........................................................................ 40
Table 2-12: Baseband uplink transmitter specifications ........................................................................ 41
Table 2-13: APC-DAC specifications ..................................................................................................... 42
Table 2-14: VBIAS-DAC specifications ................................................................................................. 43
Table 2-15: Definitions of AUXADC channels ....................................................................................... 44
Table 2-16: AUXADC specifications ...................................................................................................... 45
Table 2-17: Clock squarer 1 & 2 specifications ..................................................................................... 46
Table 2-18: ARMPLL specifications ....................................................................................................... 47
Table 2-19: MAINPLL specifications ..................................................................................................... 48
Table 2-20: MMPLL specifications ........................................................................................................ 48
Table 2-21: ISPPLL specifications ......................................................................................................... 48
Table 2-22: UNIVPLL specifications ...................................................................................................... 49
Table 2-23: MSDCPLL specifications .................................................................................................... 49
Table 2-24: TVDPLL specifications ....................................................................................................... 49
Table 2-25: LVDSPLL specifications ..................................................................................................... 50
Table 2-26: MDPLL1 & MDPLL2 specifications .................................................................................... 50
Table 2-27: WPLL specifications ........................................................................................................... 50
Table 2-28: WHPLL specifications ........................................................................................................ 50
Table 2-29: MCUPLL1 & MCUPLL2 specifications ............................................................................... 51
Table 2-30: Temperature sensor specifications ..................................................................................... 51
Table 2-31: Thermal operating specifications ....................................................................................... 52
http://www.DataSheet4U.net/
MediaTek Confidential
© 2012 MediaTek Inc.
Page 4 of 53
This document contains information that is proprietary to MediaTek Inc.
Unauthorized reproduction or disclosure of this information in whole or in part is strictly prohibited.
datasheet pdf - http://www.DataSheet4U.net/
loginid=chunping.miao@nbbsw.com,time=2012-11-23 14:49:04,ip=218.75.87.37,doctitle=MT6589_Technical_Brief_v0.2.docx,company=Bird_WCX
MT6589
HSPA+ Smartphone Application Processor
Technical Brief
Confidential A
http://www.DataSheet4U.net/
MediaTek Confidential
© 2012 MediaTek Inc.
Page 5 of 53
This document contains information that is proprietary to MediaTek Inc.
Unauthorized reproduction or disclosure of this information in whole or in part is strictly prohibited.
datasheet pdf - http://www.DataSheet4U.net/
loginid=chunping.miao@nbbsw.com,time=2012-11-23 14:49:04,ip=218.75.87.37,doctitle=MT6589_Technical_Brief_v0.2.docx,company=Bird_WCX
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