Evaluating the Integrity of LGA Package, 2nd Level Interconnect for μModule Family of Products:A good interconnect solution provides performance andcost benefi ts, ease of manufacturing, and meets or exceedsindustry reliability requirements for any application. Whenthe LGA component interconnect was introduced, boardlevel manufacturers were given the task of incorporatingthe new component interconnect with their existing process.New interconnects often improve processing, butthe acceptance for new interconnects can cause confl ictsbetween the design engineers who need the new capabilityand manufacturing engineers who must accommodatethe new package interconnect with their existing processand equipment. The LGA interconnect offers the designersbetter thermal and electrical performance and themanufacturing engineers the advantage of using existingequipment and processes, thus reducing both design andmanufacturing development cycle times.
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