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MIL-STD-883E
FOREWORD
1. This military standard is approved for use by all Departments and Agencies of the Department of Defense.
*
2. Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this
document should be addressed to: Defense Supply Center Columbus, P.O. Box 3990, Columbus, OH 43216-5000, by using
the self-addressed Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or
by letter.
ii
MIL-STD-883E
CONTENTS
PARAGRAPH
Page
1. SCOPE ...................................................................................................................................... 1
1.1 Purpose ................................................................................................................................... 1
1.2 Intended use of or reference to MIL-STD-883 ............................................................................ 1
2. APPLICABLE DOCUMENTS...................................................................................................... 3
2.1 General .................................................................................................................................... 3
2.2 Government documents............................................................................................................ 3
2.3 Non-Government publications ................................................................................................... 4
2.4 Order of precedence................................................................................................................. 5
3. ABBREVIATIONS, SYMBOLS, AND DEFINITIONS.................................................................... 6
3.1 Abbreviations, symbols, and definitions ..................................................................................... 6
4. GENERAL REQUIREMENTS..................................................................................................... 8
4.1 Numbering system ................................................................................................................... 8
4.2 Test results .............................................................................................................................. 9
4.3 Test sample disposition............................................................................................................. 9
4.4 Orientation................................................................................................................................ 9
4.5 Test conditions ......................................................................................................................... 12
4.6 General precautions.................................................................................................................. 14
5.
6.
DETAIL REQUIREMENTS ......................................................................................................... 15
NOTES ...................................................................................................................................... 16
FIGURES
FIGURE
1. Orientation of noncylindrical microelectronic devices to
direction of applied force ............................................................................................................. 10
2. Orientation of cylindrical microelectronic device to
direction of applied force ............................................................................................................. 11
iii
MIL-STD-883E
TEST METHODS
METHOD NO.
ENVIRONMENTAL TESTS
1001
Barometric pressure, reduced (altitude operation)
1002
Immersion
1003
Insulation resistance
1004.7Moisture resistance
1005.8Steady state life
1006
Intermittent life
1007
Agree life
1008.2Stabilization bake
1009.8Salt atmosphere (corrosion)
1010.7Temperature cycling
1011.9Thermal shock
1012.1Thermal characteristics
1013
Dew point
1014.10
Seal
1015.9Burn-in test
1016
Life/reliability characterization tests
1017.2Neutron irradiation
1018.2Internal water-vapor content
1019.4Ionizing radiation (total dose) test procedure
1020.1Dose rate induced latchup test procedure
1021.2Dose rate upset testing of digital microcircuits
1022
Mosfet threshold voltage
1023.2Dose rate response of linear microcircuits
1030.1Preseal burn-in
1031
Thin film corrosion test
1032.1Package induced soft error test procedure (due to alpha particles)
1033
Endurance life test
1034
Die penetrant test (for plastic devices)
MECHANICAL TESTS
2001.2Constant acceleration
2002.3Mechanical shock
2003.7Solderability
2004.5Lead integrity
2005.2Vibration fatigue
2006.1Vibration noise
2007.2Vibration, variable frequency
2008.1Visual and mechanical
2009.9External visual
2010.10
Internal visual (monolithic)
2011.7Bond strength (destructive bond pull test)
2012.7Radiography
2013.1Internal visual inspection for DPA
2014
Internal visual and mechanical
2015.11
Resistance to solvents
2016
Physical dimensions
2017.7Internal visual (hybrid)
2018.3Scanning electron microscope (SEM) inspection of metallization
2019.5Die shear strength
2020.7Particle impact noise detection test
*
iv
MIL-STD-883E
TEST METHODS
METHOD NO.
MECHANICAL TESTS
2021.3Glassivation layer integrity
2022.2Wetting balance solderability
2023.5Nondestructive bond pull
2024.2Lid torque for glass-frit-sealed packages
2025.4Adhesion of lead finish
2026
Random vibration
2027.2Substrate attach strength
2028.4Pin grid package destructive lead pull test
2029
Ceramic chip carrier bond strength
2030
Ultrasonic inspection of die attach
2031.1Flip chip pull-off test
2032.1Visual inspection of passive elements
2035
Ultrasonic inspection of TAB bonds
ELECTRICAL TESTS (DIGITAL)
3001.1Drive source, dynamic
3002.1Load conditions
3003.1Delay measurements
3004.1Transition time measurements
3005.1Power supply current
3006.1High level output voltage
3007.1Low level output voltage
3008.1Breakdown voltage, input or output
3009.1Input current, low level
3010.1Input current, high level
3011.1Output short circuit current
3012.1Terminal capacitance
3013.1Noise margin measurements for digital microelectronic devices
3014
Functional testing
3015.7Electrostatic discharge sensitivity classification
3016
Activation time verification
3017
Microelectronics package digital signal transmission
3018
Crosstalk measurements for digital microelectronic device packages
3019.1Ground and power supply impedance measurements for digital microelectronics device packages
3020
High impedance (off-state) low-level output leakage current
3021
High impedance (off-state) high-level output leakage current
3022
Input clamp voltage
3023
Static latch-up measurements for digital CMOS microelectronic devices
3024
Simultaneous switching noise measurements for digital microelectronic devices
ELECTRICAL TESTS (LINEAR)
4001.1Input offset voltage and current and bias current
4002.1Phase margin and slew rate measurements
4003.1Common mode input voltage range
Common mode rejection ratio
Supply voltage rejection ratio
4004.1Open loop performance
4005.1Output performance
4006.1Power gain and noise figure
4007
Automatic gain control range
v
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