IPC-7093A
Design and Assembly Process
Implementation for Bottom
Termination Components (BTCs)
2020 – October
Supersedes IPC-7093
March 2011
An international standard developed by IPC
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IPC-7093A
®
Design and Assembly
Process Implementation
for Bottom Termination
Components (BTCs)
Developed by the Bottom Termination Components (BTC) Task
Group (5-21h) of the Assembly and Joining Committee (5-20) of IPC
Users of this publication are encouraged to participate in the
development of future revisions.
Contact:
IPC
3000 Lakeside Drive, Suite 105N
Bannockburn, Illinois
60015-1249
Tel 847 615.7100
Fax 847 615.7105
This Page Intentionally Left Blank
October 2020
IPC-7093A
Acknowledgment
Any document involving a complex technology draws material from a vast number of sources across many continents. While
the principal members of the Bottom Termination Components (BTC) Task Group (5-21h) of the Assembly and Joining
Committee (5-20) are shown below, it is not possible to include all of those who assisted in the evolution of this standard.
To each of them, the members of the IPC extend their gratitude.
Assembly and Joining
Committee
Bottom Termination
Components (BTC) Task Group
Technical Liaison of the
IPC Board of Directors
Chair
Daniel Foster
Missile Defense Agency (MDA)
Vice Chair
Karen Tellefsen
MacDermid Alpha
Electronics Solutions
Chair
Ray Prasad
Ray Prasad Consultancy Group
Vice Chairs
Matt Kelly
IBM
Udo Welzel
Robert Bosch GmbH
Bob Neves
Microtek (Changzhou) Laboratories
Bottom Termination Components (BTC) Task Group
Wallace Ables, Dell Inc.
Dudi Amir, Intel Corporation
Richard Arnold, Continental
Automotive Systems
Raiyomand Aspandiar, Intel
Corporation
Paul Austen, ECD
Mike Bixenman, Kyzen Corporation
Gerald Bogert, Bechtel Plant
Machinery, Inc.
Edgar Butron, Lockheed Martin
Eric Camden, Foresite, Inc.
William Cardinal, Collins Aerospace
Stephen Chavez, UTC Aerospace
Systems
Beverley Christian, HDP User Group
Robert Cochran, Mind Chasers Inc.
Scott Decker, UTC Aerospace
Systems
Gerjan Diepstraten, Vitronics Soltec
Joe Fjelstad, Verdant Electronics
Dennis Fritz, MacDermid Enthone
Electronics Solutions
John Ganjei, MacDermid Alpha
Electronics Solutions
Thomas Hausherr, PCB Libraries
Gaston Hidalgo, Toyota Motor North
America
David Hillman, Collins Aerospace
Ife Hsu, Intel Corporation
Constantin Hudon, Varitron
Technologies Inc.
Jennie Hwang, H-Technologies
Group
Mark Jeanson, IBM
Sharissa Johns, Lockheed Martin
Missiles & Fire Control
Michael Johnson, M/A-COM
Technology Solutions, Inc.
Matt Kelly, IBM
Robert Kinyanjui, John Deere
Electronic Solutions
Leo Lambert, EPTAC Corporation
Dale Lee, Plexus
David Lober, Kyzen Corporation
Karen McConnell, Northrop
Grumman Corporation
Michael Moore, U.S. Army Aviation
& Missile Command
Richard Otte, PROMEX Industries,
Inc.
Agnieszka Ozarowski, BAE Systems
Keith Peterson, Missile Defense
Agency
Ray Prasad, Ray Prasad Consultancy
Group
Jagadeesh Radhakrishnan, Intel
Corporation
Thorsten Rother, YXLON
International GmbH
Robert Rowland, Axiom Electronics,
LLC
Kunal Shah, LiloTree
Vern Solberg, Solberg Technical
Consulting
Bhanu Sood, NASA Goddard Space
Flight Center
Rainer Taube, Taube Electronic
GmbH
Kristen Troxel, HP Inc.
Hector Valladares, Honeywell
Aerospace
Mark Waterman, ECD
Udo Welzel, Robert Bosch GmbH
Linda Woody, LWC Consulting
iii
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