The world owes Phillips and Signetics a greatdebt in introducing the SO package. It offers avery small footprint, low cost, reliable, surfacemounting package demanded by today's highdensity systems. However, since the thermal impedanceof any package is, to the first order, inverselyproportional to its area, the SO-8 imposessevere restrictions on the allowable power dissipationof the package. As pointed out in Reference(1), power dissipation raises the die junctiontemperature, and system reliability may be degraded.This brief sets forth a practical designmethod to ascertain what, if any, restrictionshave to be placed on operating a linear IC in theSO package.
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